Monolithic sensor of fingerprints

• US 5,844,287 A
• Filed: 10/10/1996
• Issued: 12/01/1998
• Est. Priority Date: 10/17/1995
• Status: Expired due to Fees

• Current Assignee: La Poste, Orange S.A.
• Original Assignee: La Poste, Orange S.A.
• Inventors: Hassan, Salman Abou, Revillet, Marie-Josephe
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): Wilson, Allan R.
• Application Number:
  US08/728,329
• Time in Patent Office: 782 Days
• Field of Search: 257/108, 257/418, 257/419, 257/415, 437/228, 437/233, 438/53
• US Class Current: 257/419
• CPC Class Codes: A61B 5/1172 using fingerprinting
• CPC Class Codes: G01L 1/205 using distributed sensing elements
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

An electronic fingerprint sensor works by the detection of pressure, the ridge lines of the finger exerting a greater pressure than the valleys. The sensor has a matrix of pressure microsensors and electronic control and signal-processing circuits. It is made in an entirely monolithic form, according to techniques for the making of electronic circuits (deposition of thin layers, photo-etching, doping and thermal processing), both for the pressure detection part and for the signal-processing and control part. The matrix-type pressure sensor uses either piezoelectric resistors lying on an insulator layer stretched above a cavity or a variable capacitor or a microcontactor.

Claims

1. A fingerprint sensor comprising a matrix of pressure microsensors sensitive to the pattern of a fingerprint, the matrix of pressure microsensors being implemented in an integrated circuit, each pressure microsensor of the matrix including a deformable diaphragm which closes off a cavity, the cavity being disposed between the diaphragm and a substrate of the integrated circuit, the diaphragm being formed of an insulator material, and the diaphragm having disposed thereon a conductive element of the microsensor which deforms under the effect of a pressure applied to the diaphragm.

2. A fingerprint sensor according to claim 1, wherein each pressure microsensor comprises a bridge of piezoelectric resistors deposited on a first layer of the insulator material forming the diaphragm, the conductive element disposed on the diaphragm being part of the bridge of piezoelectric resistors, and a resistance of the bridge of piezoelectric resistors providing an indication of the pressure applied to the diaphragm.

3. A fingerprint sensor according to claim 2, wherein the bridge of piezoelectric resistors comprises bands of polycrystalline silicon deposited on the first layer stretched above the cavity.

4. A fingerprint sensor according to claim 3, wherein the cavity is demarcated by walls formed by the first layer, the bridge of piezoelectric resistors lying on the diaphragm suspended above the cavity.

5. A fingerprint sensor according to claim 1, wherein each pressure microsensor comprises a contactor having first and second electrodes which are disposed in the cavity, the first electrode being formed of the conductive element and being fixedly joined to the diaphragm and the second electrode being disposed on the substrate, the contactor being moved between an open position and a closed position based on the pressure applied to the diaphragm, the first and second electrodes being electrically connected to each other in the closed position and being electrically disconnected from each other in the open position.

6. A fingerprint sensor according claim 1, wherein each pressure microsensor comprises a variable capacitor, the variable capacitor having first and second electrodes which are disposed in the cavity, the first electrode being formed of the conductive element and being fixedly joined to the diaphragm, the second electrode being disposed on the substrate, and a capacitance between the first and second electrodes providing an indication of the pressure applied to the diaphragm.

7. A fingerprint sensor according to claim 5, wherein the cavity is demarcated by walls of silicon nitride, a layer of metal lying on the diaphragm suspended above the cavity.

8. A fingerprint sensor according to claim 1, wherein the matrix has at least 128×

128 pressure microsensors arranged in an array with a pitch that is smaller than or equal to 65 micrometers.

9. A fingerprint sensor according to claim 1, wherein the pressure microsensors are made on a monolithic substrate and are coated with a layer of flexible material protecting the pressure microsensors and facilitating the transfer of pressure between a finger and the pressure microsensors.

10. A fingerprint sensor according to claim 9, wherein the thickness of the layer of flexible material is increased at the center of each pressure microsensor to form a pad and thus improve the transfer of pressure between the finger and the pressure microsensors.

11. A fingerprint sensor according to claim 1, comprising electronic circuits having means for transmitting, to an output of the fingerprint sensor, electrical signals representing the pressure detected by each pressure microsensor.

12. A fingerprint sensor according to claim 11, wherein the electrical signals representing the pressure detected by each pressure microsensor are binary signals representing whether a threshold of pressure has been exceeded or not exceeded.

13. A fingerprint sensor according to claim 1, wherein the each pressure microsensor has an analog output signal enabling a more precise measurement of the pressure of the finger.

14. A fingerprint sensor comprising:

a matrix of pressure microsensors sensitive to the pattern of a fingerprint, the matrix of pressure microsensors being implemented entirely in an integrated circuit, each pressure microsensor of the matrix including

a first electrode disposed on a substrate of the integrated circuit,

a deformable diaphragm which closes off a cavity, the cavity being disposed between the diaphragm and the substrate of the integrated circuit, the diaphragm being formed of an insulator material, and

a second electrode, the second electrode being disposed on the diaphragm between the diaphragm and the substrate, the second electrode being deformable under the effect of a pressure applied to the diaphragm so as to have an open position and a closed position, the second electrode being electrically connected with the first electrode in the closed position, the second electrode being electrically disconnected from the first electrode in the open position, and the open and closed positions of the second electrode providing an indication of the pressure applied to the diaphragm.

15. A fingerprint sensor comprising:

a matrix of pressure microsensors sensitive to the pattern of a fingerprint, the matrix of pressure microsensors being implemented entirely in an integrated circuit, each pressure microsensor of the matrix including

a deformable diaphragm which closes off a cavity, the cavity being disposed between the diaphragm and a substrate of the integrated circuit, the diaphragm being formed of an insulator material, and

a piezoelectric resistor, the piezoelectric resistor being disposed on the diaphragm, the piezoelectric resistor being deformable under the effect of a pressure applied to the diaphragm so as to have a resistance which varies according to the pressure applied to the diaphragm, the resistance providing an indication of the pressure applied to the diaphragm.

16. A fingerprint sensor according to claim 15, wherein the piezoelectric resistor is part of a bridge of piezoelectric resistors, and wherein the bridge of piezoelectric resistors is formed of bands of polycrystalline silicon deposited on a first layer of the insulator material forming the diaphragm.

17. A fingerprint sensor according to claim 16, wherein each pressure microsensor provides an analog output signal.

18. A fingerprint sensor comprising:

a matrix of pressure microsensors sensitive to the pattern of a fingerprint, the matrix of pressure microsensors being implemented entirely in an integrated circuit, each pressure microsensor of the matrix including

a deformable diaphragm which closes off a cavity, the cavity being disposed between the diaphragm and a substrate of the integrated circuit, the diaphragm being formed of an insulator material, and

a variable capacitor, the variable capacitor having first and second electrodes which are disposed in the cavity, the first electrode being fixedly joined to the diaphragm, the second electrode being disposed on the substrate, a capacitance between the first and second electrodes providing an indication of the pressure applied to the diaphragm.

19. A fingerprint sensor according to claim 18, wherein each pressure microsensor provides an analog output signal.