Low-profile microelectronic package

• US 5,844,315 A
• Filed: 03/26/1996
• Issued: 12/01/1998
• Est. Priority Date: 03/26/1996
• Status: Expired due to Term

• Current Assignee: VLSI Technology LLC (SoftBank Group Corp.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Turlik, Iwona, Demet, George N., Melton, Cynthia M.
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/621,912
• Time in Patent Office: 980 Days
• Field of Search: 257/690, 257/734, 257/737, 257/738, 257/777-782, 257/772, 257/666, 257/686, 257/685, 257/692, 257/786, 257/787, 361/783, 361/761, 29/827, 29/846, 29/832, 174/52.4
• US Class Current: 257/738
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/854 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49517 Additional leads
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14). The microelectronic package (10) is then capable of being tested and subsequently attached to a printed circuit board (40) to form a low-profile microelectronic assembly (11).

Claims

1. A microelectronic package comprising:

a polymeric body having a first polymeric body surface and a second polymeric body surface opposite the first polymeric body surface;

an integrated circuit die having an active face embedded into the first polymeric body surface;

a plurality of metallic leads embedded into the polymeric body adjacent to the integrated circuit die, the metallic leads having outer surfaces exposed adjacent the first polymeric body surface and inner surfaces opposite the outer surfaces;

a plurality of wire leads embedded into the polymeric body and connecting the active face to the metallic leads; and

a plurality of metallic bumps bonded to the metallic leads and extending through the polymeric body from the inner surfaces to protrude from the second polymeric body surface, each said metallic bump comprising a bonding surface opposite each said metallic lead.

2. A microelectronic package in accordance with claim 1, wherein the microelectronic package further comprises a planar surface formed of the integrated circuit die, the polymeric body, and the plurality of metallic leads.

3. A microelectronic package in accordance with claim 1, wherein the polymeric body is formed of an epoxy resin having a curing temperature, and wherein the metallic bumps have a melting temperature higher than the curing temperature of the polymeric body.

4. A microelectronic package in accordance with claim 1, wherein the polymeric body has a perimeter, and wherein each said metallic lead has a perimeter end coextensive with the perimeter of the polymeric body.

5. A microelectronic package in accordance with claim 1, wherein the metallic leads are formed of copper or copperbase alloys.

6. A microelectronic package comprising:

a polymeric body comprising a perimeter, a first surface, and a second surface opposite the first surface;

an integrated circuit die having an active face, a generally planar non-active face, and a plurality of die bond pads located on the active face, said integrated circuit die being embedded into the first surface of the polymeric body such that the active face is covered by the polymeric body;

a plurality of metallic leads embedded into the first surface of the polymeric body, each said metallic lead having an inner surface, a die proximate end adjacent to the integrated circuit die, and a perimeter end opposite the die proximate end;

a plurality of wire leads embedded into the polymeric body and connecting the die bond pads to the die proximate ends; and

a plurality of solder bumps bonded to the inner surface of the metallic leads intermediate each said wire lead and each said perimeter end, each said solder bump extending through the polymeric body and having a bonding surface exposed at the second surface to provide access for forming solder interconnections.

7. A microelectronic package in accordance with claim 6, wherein the microelectronic package comprises a planar surface formed by the polymeric body, the non-active face, and the metallic leads.

8. A microelectronic package in accordance with claim 6, wherein each said metallic lead has a perimeter end coextensive with the perimeter of the polymeric body.

9. A microelectronic package in accordance with claim 6, wherein the plurality of metallic leads are formed of copper or a copper-base alloy.

10. A microelectronic assembly comprising:

a printed circuit board comprising a substrate and a plurality of board bond pads located on the substrate; and

a microelectronic package comprising a polymeric body having a first polymeric body surface and a second polymeric body surface opposite the first polymeric body surface, an integrated circuit die having an active face embedded into the first polymeric body surface, a plurality of metallic leads embedded into the polymeric body adjacent to the integrated circuit die, the metallic leads having outer surfaces exposed adjacent to the first polymeric body surface and inner surfaces opposite the outer surfaces, a plurality of wire leads embedded into the polymeric body and connecting the active face of the integrated circuit die to the metallic leads, and a plurality of metallic bumps bonded to the metallic leads and extending through the polymeric body from the inner surfaces to protrude from the second polymeric body surface, each said metallic bump being bonded to a board bond pad.

11. A microelectronic assembly in accordance with claim 10, wherein the integrated circuit die further comprises a non-active face opposite the active face, and wherein the polymeric body, the non-active face, and the metallic leads cooperate to form a planar surface facing away from the printed circuit board.

12. A microelectronic assembly in accordance with claim 10, wherein the polymeric body has a perimeter, and wherein each said metallic lead has a perimeter end coextensive with the perimeter of the polymeric body.

13. A microelectronic assembly in accordance with claim 10, wherein the first polymeric body surface is remote from the printed circuit board.

14. A microelectronic assembly in accordance with claim 10, wherein the second polymeric body surface faces the printed circuit board.

15. A microelectronic assembly in accordance with claim 10, wherein each said metallic bump is solder bonded to a board bond pad.

16. A microelectronic assembly in accordance with claim 10, wherein the microelectronic assembly further comprises solder interconnections bonding the metallic bumps to the board bond pads.

17. A microelectronic assembly in accordance with claim 10, wherein the metallic bumps are composed of solder.

18. A microelectronic assembly comprising:

a printed circuit board comprising a substrate and a plurality of board bond pads located on the substrate;

a microelectronic package comprising a polymeric body having a first polymeric body surface and a second polymeric body surface opposite the first surface, an integrated circuit die having an active face embedded into the polymeric body, a plurality of metallic leads embedded into the polymeric body adjacent to the integrated circuit die, the metallic leads having outer surfaces exposed adjacent to the first polymeric body surface and inner surfaces opposite the outer surfaces, a plurality of wire leads embedded into the polymeric body and connecting the active face of the integrated circuit die to the metallic leads, and a plurality of metallic bumps bonded to the metallic leads and extending through the polymeric body from the inner surfaces to protrude from the second polymeric body surface, each said metallic bump comprising a bonding surface opposite each said metallic lead; and

a plurality of solder interconnections connecting the board bond pads to the metallic bumps.

19. A microelectronic assembly in accordance with claim 18, wherein the integrated circuit die further comprises a non-active face opposite the active face, and wherein the polymeric body, the non-active face, and the metallic leads cooperate to form a planar surface facing away from the printed circuit board.

20. A microelectronic assembly in accordance with claim 18, wherein the polymeric body has a perimeter, and wherein each said metallic lead has a perimeter end coextensive with the perimeter of the polymeric body.

21. A microelectronic assembly in accordance with claim 18, wherein the first polymeric body surface is remote from the printed circuit board.

22. A microelectronic assembly in accordance with claim 18, wherein the second polymeric body surface is adjacent to the printed circuit board.

23. A microelectronic assembly in accordance with claim 18, wherein each said metallic bump is solder bonded to a board bond pad.

24. A microelectronic assembly in accordance with claim 18, wherein the microelectronic assembly further comprises solder interconnections bonding the metallic bumps to the board bond pads.

25. A microelectronic assembly in accordance with claim 18, wherein the metallic bumps are formed of solder.