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Consolidated chip design for wire bond and flip-chip package technologies

  • US 5,844,317 A
  • Filed: 07/26/1996
  • Issued: 12/01/1998
  • Est. Priority Date: 12/21/1995
  • Status: Expired due to Fees
First Claim
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1. A semiconductor structure facilitating external electrical connection to a region of active circuitry thereof, through a wire bond pad or a metal bump formed therein, said semiconductor structure comprising:

  • a semiconductor substrate having said region of active circuitry associated therewith;

    a final metallization overlying said semiconductor substrate and electrically connected with said region of active circuitry, said final metallization having an exposed, planar wire bond pad configured to facilitate electrical connection with an external connector;

    an insulating material film disposed over said final metallization, said wire bond pad thereof being exposed through a contact hole in said insulating material film, said insulating material film also having a via hole laterally displaced from said contact hole, said via hole exposing a portion of said final metallization laterally displaced from said wire bond pad; and

    a metal bump disposed in said via hole contacting said final metallization, said metal bump being configured to facilitate electrical connection of an external connector thereto, said metal bump being laterally displaced from said wire bond pad and electrically coupled thereto through said final metallization, such that electrical connection to said region of active circuitry of said semiconductor substrate can occur through either said metal bump or said wire bond pad.

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