Integral capacitive sensor array
First Claim
Patent Images
1. A capacitive sensor array comprising:
- a plurality of detectors comprising at least one drive electrode and at least one receive electrode, said electrodes formed only on a first face of a single dielectric substrate;
means for communicating power and data with said electrodes, said means for communicating formed only on said first face of said single dielectric substrate; and
a monolithic grounded area formed on a second face of said single dielectric substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A capacitive sensor array wherein the plurality of electrodes and the power and data lines communicating with the electrodes are formed from a single dielectric substrate. One face of the substrate is a grounded area, with the electrodes and power and data lines formed from the substrate on the opposite face. A ground connector connects the grounded areas on the two faces without a need to penetrate the substrate. The substrate is flexible, and the power and data lines are die cut from a portion of the substrate to form an integrated cable.
139 Citations
17 Claims
-
1. A capacitive sensor array comprising:
-
a plurality of detectors comprising at least one drive electrode and at least one receive electrode, said electrodes formed only on a first face of a single dielectric substrate; means for communicating power and data with said electrodes, said means for communicating formed only on said first face of said single dielectric substrate; and a monolithic grounded area formed on a second face of said single dielectric substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A capacitive sensor array comprising:
-
a plurality of detectors comprising at least one drive electrode and at least one receive electrode, said electrodes formed on a flexible dielectric substrate; and means for communicating power and data with said electrodes, said means for communicating formed on said dielectric substrate; wherein a portion of said flexible dielectric substrate comprising a portion of said means for communicating power and data is die cut to form an integrated cable. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
-
Specification