Integral capacitive sensor array

• US 5,844,486 A
• Filed: 01/02/1997
• Issued: 12/01/1998
• Est. Priority Date: 01/02/1997
• Status: Expired due to Term

• Current Assignee: Methode Electronics Incorporated
• Original Assignee: Advanced Safety Concepts, Inc.
• Inventors: Kithil, Philip W., Barron, Michael H.
• Primary Examiner(s): Lefkowitz, Edward
• Application Number:
  US08/778,871
• Time in Patent Office: 698 Days
• Field of Search: 340/573, 280/735, 701/45
• US Class Current: 340/573.4
• CPC Class Codes: B60N 2/002 Seats provided with an occupancy detection means mounted therein or thereon detection means responsive to presence or absence of children B60N2/266
• CPC Class Codes: B60R 21/01532 using electric or capacitive field sensors
• CPC Class Codes: B60R 21/0154 in combination with seat heating
• CPC Class Codes: H03K 17/962 Capacitive touch switches

Abstract

A capacitive sensor array wherein the plurality of electrodes and the power and data lines communicating with the electrodes are formed from a single dielectric substrate. One face of the substrate is a grounded area, with the electrodes and power and data lines formed from the substrate on the opposite face. A ground connector connects the grounded areas on the two faces without a need to penetrate the substrate. The substrate is flexible, and the power and data lines are die cut from a portion of the substrate to form an integrated cable.

Claims

1. A capacitive sensor array comprising:

a plurality of detectors comprising at least one drive electrode and at least one receive electrode, said electrodes formed only on a first face of a single dielectric substrate;

means for communicating power and data with said electrodes, said means for communicating formed only on said first face of said single dielectric substrate; and

a monolithic grounded area formed on a second face of said single dielectric substrate.

2. The array of claim 1 additionally comprising electronic components, all of which are placed only on said first face of said single dielectric substrate.

3. The array of claim 1 additionally comprising means for connecting grounded areas on said first face to said monolithic grounded area, wherein said connecting means does not penetrate said single dielectric substrate.

4. The array of claim 1 wherein said single dielectric substrate is flexible.

5. The array of claim 4 wherein a portion of said flexible dielectric substrate comprising a portion of said means for communicating power and data is die cut to form an integrated cable.

6. The array of claim 1 wherein said sensor array is deployable to provide data to a controller directing an action selected from the group consisting of:

modify air bag performance;

adjust seat positioning;

adjust seat headrest positioning;

detect driver impairment;

adjust mirrors;

detect a possibly unauthorized vehicle operator;

detect and record head position and motion;

adjust vehicle heating/cooling;

adjust sound balance; and

adjust other interior convenience systems.

7. The array of claim 1 additionally comprising a sequence of perforations through said dielectric substrate, said perforations permitting the array to part along the perforations when exposed to an expanding automobile airbag.

8. The array of claim 7 additionally comprising means for connecting grounded areas on said first face to said monolithic grounded area, wherein said connecting means passes through one or more of said perforations.

9. A capacitive sensor array comprising:

a plurality of detectors comprising at least one drive electrode and at least one receive electrode, said electrodes formed on a flexible dielectric substrate; and

means for communicating power and data with said electrodes, said means for communicating formed on said dielectric substrate;

wherein a portion of said flexible dielectric substrate comprising a portion of said means for communicating power and data is die cut to form an integrated cable.

10. The array of claim 9 wherein said electrodes are formed only on a first face of said flexible dielectric substrate.

11. The array of claim 10 wherein said means for communicating are formed only on said first face of said flexible dielectric substrate.

12. The array of claim 10 additionally comprising a monolithic grounded area formed on a second face of said flexible dielectric substrate.

13. The array of claim 12 additionally comprising means for connecting grounded areas on said first face to said monolithic grounded area, wherein said connecting means does not penetrate said flexible dielectric substrate.

14. The array of claim 10 additionally comprising electronic components, all of which are placed only on said first face of said flexible dielectric substrate.

15. The array of claim 9 wherein said sensor array is deployable to provide data to a controller directing an action selected from the group consisting of:

modify air bag performance;

adjust seat positioning;

adjust seat headrest positioning;

detect driver impairment;

adjust mirrors;

detect a possibly unauthorized vehicle operator;

detect and record head position and motion;

adjust vehicle heating/cooling;

adjust sound balance; and

adjust other interior convenience systems.

16. The array of claim 9 additionally comprising a sequence of perforations through said dielectric substrate, said perforations permitting the array to part along the perforations when exposed to an expanding automobile airbag.

17. The array of claim 16 additionally comprising means for connecting grounded areas on said first face to said monolithic grounded area, wherein said connecting means passes through one or more of said perforations.