Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate

• US 5,846,852 A
• Filed: 09/15/1997
• Issued: 12/08/1998
• Est. Priority Date: 05/23/1996
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: McDunn, Kevin J., Schmidt, Detlef W., Limper-Brenner, Linda, Press, Minoo D.
• Primary Examiner(s): GRAYBILL, DAVID E
• Application Number:
  US08/929,941
• Time in Patent Office: 449 Days
• Field of Search: 438/118, 438/125, 438/122, 438/413, 29/25, 29/1
• US Class Current: 438/118
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

Claims

1. An apparatus for mounting an electronic component to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of:

providing a passage through the substrate;

locating a cover within the passage, the cover enclosing at least a portion of the die, the cover having a fixed portion and a removable portion, the removable portion detachably connected to the fixed portion, the fixed portion having a first end and a second end, the first end coupled to the first side, the second end having a surface that is substantially coplanar with the second side;

supplying an adhesive to the surface; and

providing a sealing frame in communication with the adhesive and the second side.

2. A method for spray-cooling an electronic component mounted to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of:

providing a passage through the substrate;

locating a wall within the passage, the wall surrounding the die and having a base surface and a top surface, the base surface coupled to the first side, the top surface substantially planar to the second side;

supplying an adhesive in communication with the top surface;

providing a sealing frame in communication with the adhesive and the second side; and

coupling a housing defining a chamber to the second side, the housing enclosing the sealing frame.

3. The method according to claim 2, further comprising the steps of:

receiving a fluid by a nozzle disposed in the housing, the nozzle having a spray end in communication with the chamber and an aperture disposed at a tip of the spray end;

atomizing the fluid by the spray end of the nozzle; and

discharging the atomized fluid into the chamber via the aperture.

4. The method according to claim 3, further comprising the steps of:

providing the fluid to the nozzle via a fluid inlet port disposed in the housing; and

removing the fluid from the chamber via a fluid outlet port disposed in the housing.

5. The method according to claim 4, further comprising:

receiving the fluid from the fluid outlet port by a condenser; and

supplying the fluid by the condenser to a fluid pump, the fluid pump in communication with the fluid inlet port, forming a closed-loop fluid flow.