Endpoint detector for a chemical mechanical polishing system

• US 5,846,882 A
• Filed: 10/03/1996
• Issued: 12/08/1998
• Est. Priority Date: 10/03/1996
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Birang, Manoocher
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/725,607
• Time in Patent Office: 796 Days
• Field of Search: 438/8, 438/14, 438/691, 438/642, 438/692, 438/747, 216/38, 216/84, 216/86, 216/88, 216/90, 216/92, 156/345 LC, 156/345 MT, 156/345 LP
• US Class Current: 438/692
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: G05B 19/406 characterised by monitoring or safety G05B19/19 takes precedence
• CPC Class Codes: G05B 19/4065 Monitoring tool breakage, life or condition
• CPC Class Codes: G05B 2219/37285 Load, current taken by motor
• CPC Class Codes: G05B 2219/37585 Start, begin and end, halt, stop of machining

Abstract

An endpoint detector for a substrate polishing apparatus integrates a signal indicative of the instantaneous material removal rate from the substrate. The signal is generated by a monitor which measures a motor parameter such as torque or current draw. The resulting sum is compared to a baseline sum known to yield the desired polishing to predict the polishing endpoint.

Claims

1. An endpoint detector for a chemical mechanical polishing apparatus having a polishing surface, a positioning member for positioning a substrate in contact with the polishing surface, and a motor for creating relative movement between the polishing surface and the substrate, comprising:

a monitor to measure the power input to the motor and generate an output signal representing the power input;

an accumulator to sum the output signal over time; and

a comparator to compare the sum to a reference value to indicate when an endpoint condition has been reached.

2. The endpoint detector of claim 1 wherein the comparator supplies a signal to a controller which terminates polishing when the reference value has been reached.

3. The endpoint detector of claim 1 wherein the monitor includes a current meter.

4. The endpoint detector of claim 1 wherein the monitor includes a torque meter.

5. The endpoint detector of claim 1 wherein the monitor includes a current meter and a voltage meter.

6. The endpoint detector of claim 1, further comprising a processor, the processor including the accumulator and the comparator.

7. A method of determining the polishing endpoint of a substrate polished on a polishing surface, wherein the polishing surface and substrate are moved with respect to one another by a motor, comprising the steps of:

summing a condition of the motor which is indicative of the frictional load on the motor; and

comparing that sum to a reference value to detect a polishing endpoint.

8. The method of claim 7 further comprising indicating the achievement of the polishing endpoint on a display when the sum reaches the reference value.

9. The method of claim 7 wherein the summed motor condition is current draw.

10. The method of claim 7 wherein the summed motor condition is torque.

11. The method of claim 7 wherein the summed motor condition is current draw multiplied by voltage draw.

12. The method of claim 7 further comprising controlling the motor speed with a control circuit which generates an error signal corresponding to changes in motor speed.

13. The method of claim 12 wherein the summed motor condition is the error signal.

14. An endpoint detector for a chemical mechanical polishing apparatus having a polishing surface, a positioning member for positioning the substrate in contact with the polishing surface, and a plurality of motors for creating relative movement between the polishing surface and the substrate, comprising:

a plurality of monitors for measuring a power input to each motor and generating a plurality of output signals representing the power input to each motor;

an accumulator to receive the output signals and sum the output signals over time; and

a comparator to compare the sum to a reference value and indicate an endpoint condition when the reference value has been reached.

15. An endpoint detector for a chemical mechanical polishing apparatus having a polishing surface, a positioning member for positioning the substrate in contact with the polishing surface, and a motor for creating relative movement between the polishing surface and the substrate, comprising:

a monitor for measuring a power input to the motor and generating an output signal representing the power input; and

a processor to receive the output signal and sum it over time and to compare the sum to a reference value to indicate when an endpoint condition has been reached.