Microwave circuit package

• US 5,847,453 A
• Filed: 03/19/1997
• Issued: 12/08/1998
• Est. Priority Date: 03/27/1996
• Status: Expired due to Term

• Current Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Original Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Inventors: Uematsu, Hiroshi, Urabe, Masanobu, Kudoh, Hiroshi
• Primary Examiner(s): Arroyo, Teresa M.
• Application Number:
  US08/820,817
• Time in Patent Office: 629 Days
• Field of Search: 257/664, 257/725, 257/728, 333/247
• US Class Current: 257/728
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/045 the other leads having an insulating passage through the base
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10329 Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15312 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/157 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/1616 : Cavity shape
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A microwave circuit package includes a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits (MMICs) and a spacer, made of a dielectric material, separating the MMICs from each other, and the MMICs and spacer are sealed in the package. The provision of the spacer substantially reduces the volume of the interior space of the package. A dielectric substrate having generally the same height as substrates of the MMICs may also be mounted on the metallic base plate, and a strip conductor may be provided on the dielectric substrate so as to form a microstrip line thereon.

Claims

1. A microwave circuit package comprising:

a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and

at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material,

wherein said monolithic microwave integrated circuits and spacer are sealed in said package.

2. A microwave circuit package comprising:

a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits;

a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and

a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon,

wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.

3. A microwave circuit package as claimed in claim 2 wherein said microstrip line forms a circuit element.

4. A microwave circuit package as claimed in claim 2 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.

5. A microwave circuit package comprising:

a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits;

at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material;

a dielectric substrate mounted on said metallic base plate and having substantially the same height as substrates of said monolithic microwave integrated circuits; and

a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon,

wherein said monolithic microwave integrated circuits, spacer and dielectric substrate are sealed in said package.

6. A microwave circuit package as claimed in claim 5 wherein said microstrip line forms a circuit element.

7. A microwave circuit package as claimed in claim 5 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.

8. A microwave circuit package comprising:

a single metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits;

a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and

a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon,

wherein said monolithic microwave integrated circuits and dielectric substrate are sealed in said package.

9. A microwave circuit package as claimed in claim 8 wherein said microstrip line forms a circuit element.

10. A microwave circuit package as claimed in claim 8 wherein said microstrip line and monolithic microwave integrated circuits are interconnected via beam leads.

11. A microwave circuit package comprising:

a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits; and

at least one spacer mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said spacer being made of a dielectric material,

wherein said monolithic microwave integrated circuits, and spacer are sealed in said package, and

further comprising a frame mounted on a periphery of said metallic base plate and an upper lid mounted on a top of said frame so that said monolithic microwave integrated circuits and spacer are sealed in said package by said frame and upper lid, and wherein said spacer is greater in height than substrates of said monolithic microwave integrated circuits and is made of a same material as said frame.

12. A microwave circuit package comprising:

a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits;

a dielectric substrate mounted on said metallic base plate so as to separate said monolithic microwave integrated circuits from each other, said dielectric substrate having substantially the same height as substrates of said monolithic microwave integrated circuits; and

a strip conductor provided on said dielectric substrate so as to form a microstrip line thereon,

wherein said monolithic microwave integrated circuits, and dielectric substrate are sealed in said package, and

said dielectric substrate is a T-shaped substrate having a stem portion separating said monolithic microwave integrated circuits from each other and a flange portion located along one end of each said integrated circuit.