Theft resistant circuit assembly
First Claim
Patent Images
1. A printed circuit board assembly comprising:
- at least one sheet of electrically non-conductive material;
an electrically conductive layer formed on a surface of said sheet, said layer being shaped to provide a portion of an electrical circuit;
a security element comprising a film of low magnetic coercivity material which is easily magnetically saturated, said security element being formed on said electrically conductive layer.
3 Assignments
0 Petitions
Accused Products
Abstract
Printed circuit boards and integrated circuit assemblies have security markers formed thereon by deposition techniques or affixed thereto, either directly or by prior encasement of the markers in a resin prior to such affixation.
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Citations
48 Claims
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1. A printed circuit board assembly comprising:
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at least one sheet of electrically non-conductive material; an electrically conductive layer formed on a surface of said sheet, said layer being shaped to provide a portion of an electrical circuit; a security element comprising a film of low magnetic coercivity material which is easily magnetically saturated, said security element being formed on said electrically conductive layer. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a printed circuit board assembly having theft resistant capability, said method comprising the steps of:
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forming an electrically conductive layer on a surface of a sheet of electrically non-conductive material, said electrically conductive layer being shaped and arranged to form a portion of an electrical circuit, and depositing on said electrically conductive layer a film of low magnetic coercivity material which is easily magnetically saturated. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13)
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14. A theft resistant integrated circuit assembly comprising
at least one integrated electrical circuit which incorporates a metallic heat dissipation element, and a security member in the form of a film of magnetizable material which becomes driven into and out of magnetic saturation in response to an alternating magnetic interrogation field, said security element being formed directly on the surface of said heat dissipation element.
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17. A method of making a theft resistant integrated circuit assembly said method comprising the steps of
providing a metallic heat dissipation element, directly forming on the surface of said heat dissipation element a film of magnetizable material which becomes driven into and out of magnetic saturation in response to an alternating magnetic interrogation field, and mounting said heat dissipation element on an integrated electrical circuit.
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29. A theft resistant integrated circuit assembly comprising
at least one integrated electrical circuit supported by a rigid non-metallic support element and, a security element in the form of an elongated strip of magnetizable material of nearly zero magnetostriction which becomes driven into and out of magnetic saturation in response to an alternating magnetic field, said security element being mounted to extend along said support element adjacent said integrated electrical circuit.
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41. A method of protecting an electronic assembly during successive stages of manufacture and distribution, said method comprising the steps of
providing an integrated circuit assembly comprising at least one integrated electrical circuit supported by a rigid non-metallic support element and further comprising a security element in the form of an elongated strip of magnetizable material of nearly zero magnetostriction which becomes driven into and out of magnetic saturation in response to an alternating magnetic field, said security element being mounted to extend along said support element adjacent said integrated electrical circuit and thereafter incorporating said integrated circuit assembly into a larger assembly.
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43. A method of attaching a security marker to the surface of an object, said method comprising the steps of:
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coating said security marker with a fluid material which is capable of becoming solid; solidifying said material to form an enclosure which encases said security marker and holds the marker in place mechanically without adhering to it; and thereafter adhering said enclosure to the surface of an object. - View Dependent Claims (44, 45, 46, 47, 48)
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Specification