Contactless integrated circuit card with a conductive polymer antenna

• US 5,847,931 A
• Filed: 04/16/1997
• Issued: 12/08/1998
• Est. Priority Date: 04/23/1996
• Status: Expired due to Term

• Current Assignee: Gemalto SA (Thales SA)
• Original Assignee: Solaic
• Inventors: Gaumet, Michel, Thevenot, Benoit
• Primary Examiner(s): Thompson, Gregory
• Assistant Examiner(s): Foster, David
• Application Number:
  US08/842,707
• Time in Patent Office: 601 Days
• Field of Search: 361/737, 361/760, 361/761, 361/777, 361/752, 361/753, 361/755, 361/757, 361/793-795, 235/380, 235/439, 235/492, 235/451, 257/723, 257/724, 257/679, 257/684, 257/687, 257/787
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit card comprising a card body, an integrated circuit fixed in a cavity of the card body, an antenna extending over a face of the card body and connected to the integrated circuit, and a layer of resin covering the integrated circuit and at least a portion of the card body immediately adjacent to the integrated circuit.

Claims

1. An integrated circuit card comprising a card body, an integrated circuit having a face flush with a face of the card body, and an antenna of conductive polymer extending overland on said face of the card body and connected to the integrated circuit, the card including a layer of resin covering the integrated circuit and all or a portion of said face of the card body immediately adjacent to the integrated circuit.

2. An integrated circuit card according to claim 1, wherein the integrated circuit has a thickness of less than 120 μ

m and is disposed in the vicinity of the neutral fiber of the card under the layer of resin.