Method and apparatus for voltage regulation within an integrated circuit package

• US 5,847,951 A
• Filed: 12/16/1996
• Issued: 12/08/1998
• Est. Priority Date: 12/16/1996
• Status: Expired due to Term

• Current Assignee: Dell USA LP (Dell Technologies Inc.)
• Original Assignee: Dell USA LP (Dell Technologies Inc.)
• Inventors: Brown, Alan E., Swamy, N. Deepak
• Primary Examiner(s): Wong, Peter S.
• Assistant Examiner(s): Jardieu, Derek J.
• Application Number:
  US08/769,644
• Time in Patent Office: 722 Days
• Field of Search: 363/141, 363/147, 174/52.2, 361/761, 361/792, 361/795, 361/762, 327/565
• US Class Current: 363/147
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

An integrated circuit package comprising an integrated circuit device and a voltage converter circuit both embedded within the package. The voltage converter circuit is configured to convert a standard supply voltage to an operating voltage as required by the integrated circuit device. Also, discrete embedded capacitors may be included to capacitively couple power and ground connections of the integrated circuit device and thus reduce voltage variations during operation of the integrated circuit device. The integrated circuit may package include one or more layers. One or more discrete components or integrated circuits are mounted to one or more layers within the package. Internal conductors on one or more of the layers are configured to connect the components forming the voltage converter circuit. Internal conductors also form connections to the integrated circuit device. The integrated circuit device and voltage converter circuit may be coated with an encapsulant for added protection. The integrated circuit package with embedded voltage converter may be manufactured with processes similar to those used for traditional integrated circuit packages and printed circuit board assemblies.

Claims

1. A package for an integrated circuit device, the package comprising:

a plurality of layers laminated together to form a package body;

a plurality of external conductors attached to said package body;

a plurality of internal conductors on at least one of said layers, wherein at least one of said plurality of internal conductors is electrically coupled to at least one of said plurality of external conductors;

an integrated circuit device embedded within said package body, said integrated circuit device electrically coupled to at least one of said plurality of internal conductors, and wherein said integrated circuit device comprises at least one connection for receiving an operating voltage; and

a voltage converter circuit embedded within said package body, wherein said voltage converter circuit comprises an input for receiving a standard supply voltage and an output for providing said operating voltage, and wherein said voltage converter circuit is electrically coupled to at least one of said plurality of internal conductors;

wherein said output for providing said operating voltage from said voltage converter circuit is electrically coupled to said at least one connection for receiving an operating voltage for said integrated circuit device; and

wherein at least one of said plurality of external conductors is adapted to receive said standard supply voltage, and said input for receiving a standard supply voltage to said voltage converter circuit is electrically coupled to said at least one of said plurality of external conductors adapted to receive said standard supply voltage.

2. The package of claim 1, wherein said voltage converter circuit comprises a switching type DC-to-DC buck topology.

3. The package of claim 1, wherein said voltage converter circuit comprises:

an integrated switching regulator controller circuit configured to provide a regulator signal;

at least one power transistor comprising an input connection, an output connection, and a control connection, wherein said regulator signal is electrically coupled to said power transistor control connection and said input for receiving a standard supply voltage is electrically coupled to said power transistor input connection; and

an LC filter electrically coupled to said power transistor output connection, wherein said LC filter is configured to provide said operating voltage to said output for providing said operating voltage.

4. The package of claim 3, wherein said integrated switching regulator controller circuit, said at least one power transistor, and said LC filter are electrically coupled by ones of said plurality of internal conductors.

5. The package of claim 3, wherein said integrated circuit device and said integrated switching regulator controller circuit each comprise a plurality of connection pads, and wherein ones of said plurality of connection pads are wire bonded to corresponding ones of said plurality of conductor pads located on at least one of said plurality of layers, wherein said ones of said plurality of conductor pads are coupled to ones of said plurality of internal conductors.

6. The package of claim 3, wherein said at least one power transistor and said LC filter each comprise at least one terminal, and wherein each said at least one terminal is soldered to a corresponding conductor pad, wherein each said corresponding conductor pad is located on one of said plurality of layers.

7. The package of claim 1, further comprising:

a first conductor plane located on one of said plurality of layers and electrically coupled to said output for providing said operating voltage from said voltage converter circuit; and

wherein said at least one connection for receiving an operating voltage to said integrated circuit device is electrically coupled to said first conductor plane.

8. The package of claim 1, further comprising:

at least one discrete capacitor embedded within said package body;

wherein said integrated circuit device further comprises at least one ground connection, and wherein said at least one discrete capacitor capacitively couples said at least one ground connection to said at least one connection for receiving an operating voltage.

9. The package of claim 8, further comprising:

a first conductor plane located on one of said plurality of layers, wherein said first conductor plane is electrically coupled to said at least one discrete capacitor, to said output for providing said operating voltage from said voltage converter circuit, and to said at least one connection for receiving an operating voltage for said integrated circuit device;

a second conductor plane located on a different one of said plurality of layers than said first conductor plane, said second conductor plane electrically coupled to said at least one discrete capacitor and to said at least one ground connection of said integrated circuit device; and

wherein said at least one discrete capacitor capacitively couples said first conductor plane and said second conductor plane.

10. The package of claim 1, further comprising vias formed through at least one of said layers, wherein said vias are adapted to electrically couple ones of said plurality of internal conductors.

11. The package of claim 1, further comprising an encapsulant coating said integrated circuit device.

12. The package of claim 1, further comprising an encapsulant coating said integrated circuit device and said voltage converter circuit.

13. The package of claim 1, wherein each one of said plurality of layers is comprised of a substantially dielectric material.

14. The package of claim 13, wherein said dielectric material comprises epoxy, FR-4, or polymide.

15. The package of claim 1, wherein each one of said plurality of layers is comprised of a substantially ceramic material.

16. The package of claim 15, wherein said plurality of layers are cured by firing at a high temperature, such as 1600 degrees Celsius, to create a monolithic sintered package body.

17. The package of claim 1, wherein said package is substantially hermetically sealed.

18. The package of claim 1, wherein a cavity is formed within said plurality of layers.

19. The package of claim 18, wherein said integrated circuit device is mounted within said cavity.

20. The package of claim 18, wherein said voltage converter circuit is mounted within said cavity.

21. The package of claim 18, wherein a plurality of discrete capacitors are mounted in said cavity.

22. The package of claim 1, wherein the integrated circuit device is bonded to one of said plurality of layers with bonding wire.

23. The package of claim 22, wherein the bonding wire is comprised substantially of gold.

24. The package of claim 1, wherein a plurality of external pins is electrically coupled to ones of said plurality of internal conductors.

25. A package for an integrated circuit device, the package comprising:

at least one package substrate layer having opposing surfaces;

a plurality of external conductors attached to said package;

a plurality of internal conductors on at least one of said opposing surfaces of said at least one package substrate layer, wherein at least one of said plurality of internal conductors is electrically coupled to at least one of said plurality of external conductors;

an integrated circuit device mounted on said package substrate layer, said integrated circuit device electrically coupled to at least one of said plurality of internal conductors, and wherein said integrated circuit device has a power connection and a ground connection;

a voltage converter circuit mounted on said package substrate layer, wherein said voltage converter circuit is configured to convert a standard supply voltage to an operating voltage and supply said operating voltage to said integrated circuit power connection to said integrated circuit ground connection; and

an encapsulant configured to cover said integrated circuit device and said at least one discrete capacitor.

26. The package of claim 25, further comprising vias formed through said at least one package substrate layer, wherein said vias are adapted to electrically couple ones of said plurality of internal conductors.

27. The package of claim 25, wherein said encapsulant comprises a polymer material.

28. The package of claim 25, wherein said encapsulant comprises a molded plastic material.