×

Methods of making semiconductor chip assemblies

  • US 5,848,467 A
  • Filed: 05/13/1997
  • Issued: 12/15/1998
  • Est. Priority Date: 09/24/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. A method of making a plurality of semiconductor chip assemblies comprising the steps of:

  • (a) providing a semicondutor wafer including a plurality of semiconductor chips having contacts thereon;

    (b) providing a sheet separate from said wafer incorporating a plurality of dielectric elements having terminals thereon,(c) assembling the sheet to the wafer so that the terminals on said dielectic elements face away from the wafer and so that said chips are associated with said dielectric elements, and connecting contacts on said chips to terminals on the dielectric elements associated with said chips; and

    (d) severing the individual dielectric elements from the sheet and severing the individual chips from said wafer after said assembling and connecting step so as to provide a plurality of subassemblies, each said subassembly including a chip and a dielectric element associated therewith.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×