Substrate heating equipment for use in a semiconductor fabricating apparatus

• US 5,850,071 A
• Filed: 08/09/1996
• Issued: 12/15/1998
• Est. Priority Date: 02/16/1996
• Status: Expired due to Term

• Current Assignee: Kokusai Electric Co., Ltd.
• Original Assignee: Kokusai Electric Co., Ltd.
• Inventors: Hamano, Katsuyoshi, Akao, Tokunobu, Makiguchi, Issei
• Primary Examiner(s): Walberg, Teresa J.
• Assistant Examiner(s): PELHAM, JOSEPH MOORE
• Application Number:
  US08/694,875
• Time in Patent Office: 858 Days
• Field of Search: 219/385, 219/390, 219/405, 219/411, 219/446, 219/457, 219/466, 392/416, 392/418, 118/50.1, 118/724, 118/725, 118/728, 118/729, 438/799, 432/121, 432/122, 432/152, 165/58, 165/61
• US Class Current: 219/390
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A substrate heating equipment for use in a semiconductor fabricating apparatus includes a heater support frame disposed within a vacuum vessel, opposed panel heaters disposed in a pluri-shelved fashion within the heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of the opposed panel heaters, whereby simultaneous heating of plural substrates to be treated is enabled. By controlling the individual temperature of the panel heaters, it also becomes possible to significantly reduce a tact time and to effect uniform heating of the substrates while the equipment is rendered compact.

Claims

1. A substrate heating equipment for use in a semiconductor fabricating apparatus, comprising a heater support frame disposed within a vacuum vessel, a plurality of opposed panel heaters individually temperature controlled and disposed in a plural shelved fashion within said heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of said opposed panel heaters.

2. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein the opposed panel heaters each have a first and second end, the substrate heating equipment further comprising side panel heaters disposed at both ends of said opposed panel heaters.

3. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein said opposed panel heaters are secured to said heater support frame at central portions of side portions thereof, an insulative collar is disposed at each side end of said opposed panel heaters, and said insulative collar is fit into recesses disposed in said heater support frame.

4. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein said heater support frame includes a substrate receiver attached thereto and being capable of loading said substrate to be treated along one edge of the substrate to be treated, and said opposed panel heaters include a substrate guiding pin partially buried therein and adapted to guide an opposite edge of said substrate to be treated.

5. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 2, wherein the heater support frame incudes side frames and wherein said side panel heaters are heating elements and are thermally insulated from at least the side frames of said heater support frame, said opposed panel heaters are bridged between right and left ones of said side panel heaters, and said opposed panel heaters are heated through thermal conduction by said side panel heaters.

6. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 5, wherein said side panel heaters are vertically divided into a plurality of heating zones which are individually temperature controlled.

7. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 5, wherein said side panel heaters have shelves capable of receiving the ends of said opposed panel heaters, the ends of said opposed panel heaters being pressed against said shelves by press means.

8. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 7, wherein said press means comprises heater presses disposed on the ends of said opposed panel heaters, heater dampers fitted about said heater presses and said shelves, and set screws screwed into engagement with said heaters clampers for pressing said heater presses against said opposed panel heaters.

9. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein said heater support frame has reflecting plates.

10. A substrate heating equipment for use in a semiconductor fabricating apparatus according to one of claims 1 to 9, wherein said vacuum vessel is adapted to allow loading of said substrates through a side wall thereof, said heater support frame is supported by a strut passing in an airtight manner through a bottom plate of said vacuum vessel, said strut including a screw rod connected thereto by means of a nut, and said screw rod being adapted to be rotationally driven by a vertically movable motor.

11. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 2, wherein each of said side panel heaters is divided into a plurality of zones, and said opposite panel heaters are individually temperature controlled by controlling each zone of said side panel heaters.

12. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein said opposite panel heaters are cast panel heaters of aluminum in which heater wires are embedded.

13. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 1, wherein said side panel heaters are cast panel heaters of aluminum in which heater wires are embedded.

14. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 2, wherein each of said opposite panel heaters are divided into a plurality of zones, and said zones are individually temperature controlled.

15. A substrate heating equipment for use in a semiconductor fabricating apparatus according to claim 2, wherein each of said opposite panel heaters are divided into a plurality of zones, and said zones are individually temperature controlled.