Method of manufacturing and assembling an integrated circuit card

• US 5,850,690 A
• Filed: 07/08/1996
• Issued: 12/22/1998
• Est. Priority Date: 07/11/1995
• Status: Expired due to Term

• Current Assignee: De La Rue Cartes et Systemes
• Original Assignee: De La Rue Cartes et Systemes
• Inventors: Launay, Fran.cedilla.ois, Severin, Jan, Van Noort, Harry, Venambre, Jacques
• Primary Examiner(s): Vo, Peter
• Application Number:
  US08/677,001
• Time in Patent Office: 897 Days
• Field of Search: 29/827, 29/829, 29/840, 29/841, 29/852, 174/52.2, 228/180.21, 235/488, 235/492, 257/679, 264/272.11, 264/272.14, 264/272.15, 264/272.17, 361/761, 361/764
• US Class Current: 29/841
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.

Claims

1. A method of manufacturing and assembling an electronic card comprising an electrically insulating card support provided with a cavity having a bottom and at least first and second opposing side walls, the cavity being provided in the card support for accommodating an integrated circuit defining first and second opposed sides, said integrated circuit having a first group of contacts which are provided on said first side and a second group of contacts which are provided on said first side and, said electrically insulating card support having on one surface metal contact pads electrically connected to respective contacts of said integrated circuit, said metal contact pads being respectively arranged in first and second groups adjacent the first and second side walls of said cavity, the method comprising the following steps:

a first step comprises providing electrical conductor tracks on the card support, each of said tracks being positioned against the bottom and a sidewall of said cavity and each of said tracks connected to one of said metal contact pads arranged on the surface of the support, the conductor tracks being provided so that each traverses the bottom of the cavity from one of said first and second side walls towards the other of said first and second side walls by more than half the dimension of the cavity defined by the first and second side walls, wherein said tracks connected to said first group of metal contacts pads alternate with said tracks connected to said second group of metal contact pads,

a second step comprises gluing said second side of said integrated circuit, to the bottom of the cavity, wherein said first group of contacts on said integrated circuit are positioned adjacent said first group of metal contact pads and said second group of contacts on said integrated circuit are positioned adjacent said second group of metal contact pads, the integrated circuit being glued by means of non-conducting glue on a number of said tracks,

a third step comprises soldering conductor wires between the contacts of the integrated circuit and ends of corresponding conductor tracks, the ends of said tracks connected to said first group of metal contact pads being connected to said second group of contacts on said integrated circuit and ends of said tracks connected to said second group of metal contact pads being connected to said first group of contacts of said integrated circuit, and

a fourth step comprises filling the cavity with a protective resin which is subsequently polymerised.

2. The manufacturing and assembling process as claimed in claim 1, wherein the first step includes a step of completing a configuration of the tracks at least in a zone where they lie side-by-side, at the cavity bottom, by means of an etching operation with a fixed or mobile laser beam.

3. The manufacturing and assembling process as claimed in claim 1, wherein the first step further comprises cutting and gluing the tracks under hot pressure using a hot-curing glue.

4. The manufacturing and assembling process as claimed in claim 1, wherein the first step further comprises application by printing of a catalyst on the card support in a configuration corresponding to a desired physical arrangement for the tracks, followed by a metallization through autocatalysis.