Method for manufacturing a surface-mounted type optical semiconductor device

• US 5,851,449 A
• Filed: 09/26/1996
• Issued: 12/22/1998
• Est. Priority Date: 09/27/1995
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Uchino, Tuguo, Matumoto, Iwao, Nagasawa, Hiroshi
• Primary Examiner(s): Vargot, Mathieu D.
• Application Number:
  US08/721,015
• Time in Patent Office: 817 Days
• Field of Search: 264/1.7, 264/1.9, 264/1.1, 264/272.11, 264/272.14, 264/272.15, 264/272.17, 264/328.4
• US Class Current: 264/1.7
• CPC Class Codes: B29C 33/0027 with deep narrow cavities, e.g. for making piles non-woven pile fabrics D04H11/00
• CPC Class Codes: B29C 33/0044 for sealing off parts of inserts projecting into the mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29D 11/00278 Lenticular sheets B29D11/00269 takes precedence
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

In manufacturing an optical semiconductor device, light-emitting elements are mounted on their respective printed boards of an insulating plate with a silver paste interposed therebetween. A sealing mold having a shape (a lens forming portion) necessary for forming a projected lens is adhered to the major surface of the insulating plate in accordance with each of the light-emitting elements of each of the printed boards. A liquid epoxy resin having a melt viscosity of 100 Pa·s to 200 Pa·s is continuously injected into the sealing mold with the lens forming portion of the sealing mold downward. The liquid epoxy resin is then hardened to form a projected, domed lens on each of the light-emitting elements. After that, the sealing mold is removed, and the insulating plate is separated for each of the light-emitting elements into surface-mounted optical semiconductor devices each having a projected, domed lens. Consequently, a lens having a large diameter can be formed in a short time, thereby increasing in luminance and improving in yield and quality, without increasing in manufacturing costs.

Claims

1. A method for manufacturing a surface-mounted optical semiconductor device, comprising the steps of:

mounting an optical semiconductor element on each of a plurality of insulating substrates;

adhering a sealing mold for transfer molding, having a through-gate structure and a dome-shaped portion, to a major surface of each of said insulating substrates;

continuously injecting a liquid epoxy resin having a melt viscosity of approximately 100 to 200 Pa·

s into the dome-shaped portion of said sealing mold;

hardening said liquid epoxy resin by thermal curing to form a projected, domed lens on said optical semiconductor element; and

removing said sealing mold, and separating said insulating substrates from one another, wherein each insulating substrate includes said optical semiconductor element.

2. The method according to claim 1, wherein said optical semiconductor element includes one or both of a light-emitting element and a light-receiving element.

3. The method according to claim 1, wherein said sealing mold is selected from the group consisting of metal and resin.

4. The method according to claim 1, wherein the dome-shaped portion of said sealing mold faces downward.

5. The method according to claim 1, which further comprises a step of picking up said optical semiconductor device by holding up a flange which is provided below said domed lens, and mounting an external lead terminal on a surface of each of said insulating substrates.

6. A method for manufacturing a surface-mounted type optical semiconductor device, comprising the steps of:

mounting a plurality of optical semiconductor elements on each of a plurality of insulating substrates;

adhering a sealing mold for transfer molding, having a through-gate structure, to a major surface of each of said insulating substrates;

continuously injecting a liquid epoxy resin having a melt viscosity of approximately 100 to 200 Pa·

s into said sealing mold; and

hardening said liquid epoxy resin by thermal curing to form a projected, domed lens on said optical semiconductor element.

7. The method according to claim 6, wherein said insulating substrates are arranged in rows between a plurality of openings formed in an insulating plate, and wherein wiring is electrically connected to each of said optical semiconductor elements on a major surface of each of said insulting substrates, and further wherein an external lead terminal is connected to the wiring through a side of each of said openings on an opposite surface of each of said insulating substrates.

8. The method according to claim 6, wherein each of said optical semiconductor elements includes one or both of a light-emitting element and a light-receiving element.

9. The method according to claim 6, wherein said sealing mold has a dome-shaped portion corresponding to each of said optical semiconductor elements mounted on each of said insulating substrates.

10. The method according to claim 6, wherein the dome-shaped portion of said sealing mold, faces downward.

11. The method according to claim 6, wherein said domed lens has a radius of approximately 1.0 mm formed above a flange.

12. A method for manufacturing a surface-mounted optical semiconductor device, comprising the steps of:

mounting an optical semiconductor element on an insulating substrate;

adhering a sealing mold for transfer molding, having a through-gate structure and a dome-shaped portion, to a major surface of said insulating substrate;

continuously injecting a liquid epoxy resin having a melt viscosity of approximately 100 to 200 Pa·

s into the dome-shaped portion of said sealing mold;

hardening said liquid epoxy resin by thermal curing to form a projected, domed lens on said optical semiconductor element; and

removing said sealing mold.

13. The method according to claim 12, wherein said optical semiconductor element includes one or both of a light-emitting element and a light-receiving element.

14. The method according to claim 12, wherein said sealing mold is selected from the group consisting of metal and resin.

15. The method according to claim 12, wherein the dome-shaped portion of said sealing mold faces downward.

16. The method according to claim 12, which further comprises a step of picking up said optical semiconductor device by holding up a flange which is provided below said domed lens, and mounting an external lead terminal on a surface of said insulating substrate.

17. A method for manufacturing a surface-mounted optical semiconductor device, comprising the steps of:

mounting a plurality of optical semiconductor elements on an insulating substrate;

adhering a sealing mold for transfer molding, having a through-gate structure, to a major surface of said insulating substrate;

continuously injecting a liquid epoxy resin having a melt viscosity of approximately 100 to 200 Pa·

s into said sealing mold;

hardening said liquid epoxy resin by thermal curing to form a projected, domed lens on said optical semiconductor element.

18. The method according to claim 17, wherein said at least one insulating substrate is arranged in a an opening formed in an insulating plate, and wherein wiring is electrically connected to each of said optical semiconductor elements on a major surface of said insulting substrate, and further wherein an external lead terminal is connected to the wiring through a side of each of said openings on an opposite surface of said at least one insulating substrate.

19. The method according to claim 17, wherein each of said optical semiconductor elements includes one or both of a light-emitting element and a light-receiving element.

20. The method according to claim 17, wherein said sealing mold has a dome-shaped portion corresponding to each of said optical semiconductor elements mounted on said at least one insulating substrate.

21. The method according to claim 17, wherein a dome-shaped portion of said sealing mold, faces downward.

22. The method according to claim 17, wherein said domed lens has a radius of approximately 1.0 mm formed above a flange.