Prepreg, process for producing the same and printed circuit substrate/board using the same

• US 5,851,646 A
• Filed: 10/15/1996
• Issued: 12/22/1998
• Est. Priority Date: 10/16/1995
• Status: Expired due to Term

• Current Assignee: Sumitomo Chemical Company Limited
• Original Assignee: Sumitomo Chemical Company Limited
• Inventors: Sato, Hiroyuki, Takahashi, Tsutomu, Kumada, Hiroaki, Tsujimoto, Yoshifumi
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US08/732,577
• Time in Patent Office: 798 Days
• Field of Search: 428/294.1, 428/361, 428/395, 428/378, 428/408, 428/457, 428/474.4, 428/902, 428/910, 442/60, 442/168, 442/169, 174/250, 174/256, 361/750
• US Class Current: 428/294.1
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 2260/021 Fibrous or filamentary layer layers of natural mineral fibres or particles being impregnated in a plastic substance B32B19/02
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2305/026 Porous
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 5/022 Non-woven fabric
• CPC Class Codes: C08J 5/04 Reinforcing macromolecular compounds with loose or coherent fibrous material
• CPC Class Codes: C08J 5/246 using polymer based synthetic fibres
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/0293 Non-woven fibrous reinforcement
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10S 428/902 High modulus filament or fiber
• CPC Class Codes: Y10S 428/91 Product with molecular orientation
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24993 Fiber is precoated
• CPC Class Codes: Y10T 428/24994 Fiber embedded in or on the surface of a polymeric matrix
• CPC Class Codes: Y10T 428/249944 : Fiber is precoated
• CPC Class Codes: Y10T 428/249953 : Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249955 : Void-containing component partially impregnated with adjacent component
• CPC Class Codes: Y10T 428/2907 : with coating or impregnation
• CPC Class Codes: Y10T 428/2938 : Coating on discrete and individual rods, strands or filaments
• CPC Class Codes: Y10T 428/2969 : Polyamide, polyimide or polyester
• CPC Class Codes: Y10T 428/2971 : Impregnation
• CPC Class Codes: Y10T 428/30 : Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31725 : Of polyamide
• CPC Class Codes: Y10T 442/2008 : Fabric composed of a fiber or strand which is of specific structural definition
• CPC Class Codes: Y10T 442/2893 : Coated or impregnated polyamide fiber fabric
• CPC Class Codes: Y10T 442/2902 : Aromatic polyamide fiber fabric

Abstract

The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

Claims

1. A prepreg comprising a porous para-oriented aromatic polyamide film impregnated with a thermoplastic resin and/or a thermosetting resin, wherein the porous para-oriented aromatic polyamide film is composed of para-aramid fibrils having a diameter of not more than 1 μ

m, with the fibrils planarly arranged as a network or a nonwoven fabric and laminated in layer form, and the film has a linear thermal expansion coefficient at 200°

to 300°

C. of ±

50×

10^-6 /°

C. and has 30 to 95% of vacant spaces.

2. The prepreg according to claim 1, wherein the prepreg comprises a porous para-oriented aromatic polyamide film impregnated with a thermoplastic resin and a thermosetting resin.

3. The prepreg according to claim 1, wherein the para-oriented aromatic polyamide is poly(paraphenyleneterephthalamide), poly(parabenzamide), poly(4,4'"'"'-benzanilideterephthalamide), poly(paraphenylene-4,4'"'"'-biphenylenedicarboxylic acid amide), poly(paraphenylene-2,6-naphthalenedicarboxylic acid amide), poly(2-chloro-paraphenyleneterephthalamide) or a copolymer of paraphenylenediamine/2,6-dichloroparaphenylenediamine/terephthaloyl dichloride.

4. The prepreg according to claim 1, wherein the thermoplastic resin is polyether sulfon, polysulfon, polyether imide, polysulfide sulfon or polycarbonate.

5. The prepreg according to claim 1, wherein the thermosetting resin is an epoxy resin, a bismaleimide-triazine resin, a polyimide resin, a diallyl phthalate resin, an unsaturated polyester resin, a cyanate resin or an allyl-modified polyphenylene ether resin.