Near infrared rays-curing putty composition
First Claim
Patent Images
1. A near infrared rays-curing putty composition comprising:
- (A) a resin containing at least one polymerizable ethylenically unsaturated group,(B) a polymerizable unsaturated compound comprising monomers or oligomers containing at least one ethylenically unsaturated group,(C) a near infrared rays polymerization initiator, said near infrared rays polymerization initiator (C) being a near infrared rays-absorbing cationic dye, and(D) a resin powder consisting of gelation polymer fine particles obtained by emulsion polymerization, said gelation polymer fine particles being contained in an amount of 1 to 100 parts by weight per 100 parts by weight of a total solid content in the resin (A) and compound (B).
1 Assignment
0 Petitions
Accused Products
Abstract
A near infrared rays-curing putty composition containing (A) a polymerizable ethylenically unsaturated group-containing resin, (B) a polymerizable ethylenically unsaturated compound and (C) a near infrared rays polymerization initiator, said near infrared rays polymerization initiator (C) being a near infrared rays-absorbing cationic dye and a resin powder consisting of gelation polymer fine particles.
-
Citations
7 Claims
-
1. A near infrared rays-curing putty composition comprising:
-
(A) a resin containing at least one polymerizable ethylenically unsaturated group, (B) a polymerizable unsaturated compound comprising monomers or oligomers containing at least one ethylenically unsaturated group, (C) a near infrared rays polymerization initiator, said near infrared rays polymerization initiator (C) being a near infrared rays-absorbing cationic dye, and (D) a resin powder consisting of gelation polymer fine particles obtained by emulsion polymerization, said gelation polymer fine particles being contained in an amount of 1 to 100 parts by weight per 100 parts by weight of a total solid content in the resin (A) and compound (B). - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification