Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging

• US 5,853,888 A
• Filed: 04/25/1997
• Issued: 12/29/1998
• Est. Priority Date: 04/25/1997
• Status: Expired due to Fees

• Current Assignee: The United States of America As Represented By The Secretary of Agriculture
• Original Assignee: the united states of america as represented by the secretary of the navy
• Inventors: Dutta, Indranath, Menon, Sarath K.
• Primary Examiner(s): Turner, A. A.
• Application Number:
  US08/845,581
• Time in Patent Office: 613 Days
• Field of Search: 428/408, 428/457, 428/469, 428/472, 428/698, 428/701, 428/702, 204/192.38, 427/534, 427/542, 427/96, 427/99, 427/249, 427/309, 427/314, 427/350, 427/372.2, 427/380, 427/419.2
• US Class Current: 428/408
• CPC Class Codes: C23C 14/081 of aluminium, magnesium or beryllium
• CPC Class Codes: C23C 14/18 on other inorganic substrates
• CPC Class Codes: C23C 14/5853 Oxidation
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

An article and a method of making surface modified synthetic diamond substes at temperatures below 500° C. for electronic packaging applications are described. The article consists of a synthetic diamond substrate, the surface of which has been modified by providing an adherent thin coating of a ceramic (alumina) material so as to enable metallization of synthetic diamond by current industrial methods. The method of surface modification comprises deposition of a thin transition metal layer on the synthetic diamond substrate prior to low temperature reactive vapor deposition of aluminum followed by annealing in an oxygen atmosphere.

Claims

1. An article of surface modified synthetic diamond for electronic packaging applications, comprising:

a clean diamond substrate;

a layer of a carbide-forming transition metal on the clean diamond substrate;

a thin metal-carbide layer between the transition metal and the diamond substrate to form a chemical bond between the diamond and metal layers;

an adherent crystalline alumina layer deposited on the transition metal layer to serve as a dielectric; and

an interdiffusion zone between the transition metal and alumina layers resulting in strong chemical bonding between the alumina and the transition metal layers, so as to make diamond metallizable by conventional thin and thick film techniques, and to decrease the through-thickness thermal conductivity of diamond by less than 5%, whereby the article is capable of being used as a highly thermally conductive metallized diamond substrate for electronic packaging.

2. A method of modifying the surface of diamond substrates at temperatures below 500°

C., which comprises;

vacuum-depositing a layer of a carbide-forming transition metal on a clean synthetic (e.g., CVD) diamond substrate while heating the substrate between 250°

-500°

C. at a pressure of less than 5×

10^-7 torr;

depositing an alumina layer onto the transition metal layer by reactive evaporation of aluminum in a low partial pressure of oxygen (<

5×

10^-4 torr) at a deposition rate of 10 to 40 Å

/minute while continuing to heat the substrate between 250°

-500°

C.; and

annealing the coated diamond substrate between 300° and

500°

C. at an oxygen partial pressure of 100-600 torr, whereby the reaction between the transition metal and diamond is further enhanced to produce a metal-carbide layer at the interface, an interdiffusion zone is created between the transition metal and alumina, and the as deposited alumina film becomes crystalline and electrically insulating, making the diamond substrate suitable for the production of adherent thick and thin film metallizations for electronic packaging applications.