Non-planar magnet tracking during magnetron sputtering

• US 5,855,744 A
• Filed: 07/19/1996
• Issued: 01/05/1999
• Est. Priority Date: 07/19/1996
• Status: Expired due to Term

• Current Assignee: Applied Komatsu Technology, Inc.
• Original Assignee: Applied Komatsu Technology, Inc.
• Inventors: Black, Russell, Hall, Victoria L., De Salvo, Allan, Hosokawa, Akihiro, Demaray, Richard E., Halsey, Harlan I.
• Primary Examiner(s): Nguyen, Nam
• Assistant Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US08/684,446
• Time in Patent Office: 900 Days
• Field of Search: 204/298.16, 204/298.17, 204/298.19, 204/298.2, 204/298.22, 204/192.12, 204/298.12, 204/298.18
• US Class Current: 204/192.12
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3455 Movable magnets

Abstract

The structure and method which improves the film thickness uniformity or thickness control when using magnetron sputtering by adjusting the distance between the magnetron or a portion of the magnetron and the sputtering target to provide an improvement in the film thickness uniformity. Shimmed rails, contoured rails, contoured surfaces, cam plates, and cam plate control followers are utilized to achieve an improvement in film thickness uniformity or thickness control due to anomalies in magnetic field as a magnetron assembly moves back and forth when sputtering substrates (utilized primarily for rectangularly shaped substrates).

Claims

1. A magnetron sputtering apparatus, comprising:

a magnet member having a magnetic field emanating therefrom disposed in the proximity of a sputtering target,

a magnet member cycling system which during sputtering of said sputtering target causes said magnet member to move in a set pattern,

wherein said set pattern of motion is defined by a set of points defining a pattern reference surface, wherein the pattern reference surface is defined by a set of lateral coordinates and a set of vertical coordinates of the pattern,

wherein said set of lateral coordinates establish a defined set of locations on an offset reference surface which is approximately parallel to a reference surface of said sputtering target and offset from it,

wherein said set of vertical coordinates establish a defined set of elevations for said set pattern at each respective lateral coordinate of said set of lateral coordinates,

wherein said pattern reference surface includes a divergent portion having a subset of said defined set of elevations establishing the elevation of the pattern reference surface within said divergent portion at a distance from said offset reference surface at each respective lateral coordinate of said set of lateral coordinates, wherein the elevation of the pattern reference surface within said divergent portion falls outside a range of tolerance for parallelism between said offset reference surface and said reference surface of said sputtering target.

2. The magnetron sputtering apparatus as in claim 1, wherein motion of said magnet member following said divergent portion of said pattern reference surface, rather than following a non-divergent portion of said pattern in which said distance would fall within the range of tolerance for parallelism between offset reference surface and said reference surface of said sputtering target, provides an improvement in the uniformity or thickness control of film thickness deposited on the surface of a substrate, located opposite said sputtering target, being sputter deposited.

3. The magnetron sputtering apparatus as in claim 1,

wherein said reference surface of said sputtering target is defined by unused pre-sputtering configuration surface of said sputtering target facing a processing chamber.

4. The magnetron sputtering apparatus as in claim 2,

wherein said reference surface of said sputtering target is defined by an unused pre-sputtering configuration of a front surface of said sputtering target facing a processing chamber.

5. The magnetron sputtering apparatus as in claim 1, 2, 3, or 4, wherein said tolerance for parallelism is 0.0075 inches per foot of motion along said offset reference surface.

6. The magnetron sputtering apparatus as in claim 1, 2, or 3,

wherein said tolerance for parallelism is 0.010 inches per foot of motion along said offset reference surface.

7. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.015 inches per foot of motion along said offset reference surface.

8. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.020 inches per foot of motion along said offset reference surface.

9. The magnetron sputtering apparatus as in claim 1, 2, or 3,

wherein said tolerance for parallelism is 0.025 inches per foot of motion along said offset reference surface.

10. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.030 inches per foot of motion along said offset reference surface.

11. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.035 inches per foot of motion along said offset reference surface.

12. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.040 inches per foot of motion along said offset reference surface.

13. The magnetron sputtering apparatus as in claim 1, 2, or 3, wherein said tolerance for parallelism is 0.050 inches per foot of motion along said offset reference surface.

14. The magnetron sputtering apparatus as in claim 1, wherein said set pattern of said cycling system results from a motion along a set of tracks supporting and guiding the magnet member,

wherein the configuration of said set of tracks establishes said set of lateral coordinates and said set of vertical coordinates of said set pattern, including said divergent portion.

15. The magnetron sputtering apparatus as in claim 14, wherein said motion along said set of tracks is a back and forth motion.

16. The magnetron sputtering apparatus as in claim 1, further comprising:

a set of tracks supporting and guiding the magnet member

a cam surface fixed to a first of either said magnet member or a fixed support adjacent said tracks and a cam follower fixed to a second of either said magnet member or said fixed support,

wherein a divergent portion of said motion, corresponding to said divergent portion of said pattern reference surface, results from a motion along said set of tracks,

wherein said set pattern of said cycling system results at least partially from a motion along said set of tracks where during said set motion said cam follower comes into contact with said cam surface and urges said magnet member in a vertical direction to follow a motion corresponding to the divergent portion of said pattern reference surface.

17. The magnetron sputtering apparatus as in claim 1,

wherein said magnet member includes a series of magnet member subsections,

wherein said magnetron apparatus further comprises:

a set of tracks, wherein each one of said set of tracks supports and guides a corresponding subset of said series of magnet member subsections,

a series of cam surfaces, each one of said series of cam surfaces being fixed to a first of either a subsection of said series of magnet member subsections or a fixed support adjacent said tracks and a cam follower fixed to a second of either a subsection of said series of magnet member subsections or said fixed support,

wherein a divergent portion of said motion, corresponds to said divergent portion of said pattern reference surface,

wherein said set pattern of said cycling system results at least partially from a motion along said set of tracks where during said set motion said cam follower comes into contact with said cam surface and causes at least one of said series of magnet member sections to move in a vertical direction to follow a motion corresponding to the divergent portion of said pattern reference surface.

18. The magnetron sputtering apparatus as in claim 17,

wherein said series of cam surfaces form a continuous cam plate surface.

19. The magnetron sputtering apparatus as in claim 1,

wherein said magnet member includes a series of magnet member subsections,

wherein said magnetron apparatus further comprises:

a set of tracks, wherein each one of said set of tracks supports and guides a corresponding subset of said series of magnet member subsections as a lateral drive moves each one of said series of magnet member subsections in a lateral direction,

a series of vertical drives, each one of said series of vertical drives being fixed to provide relative motion between each respective subsection of said series of magnet member subsections and said lateral drive,

wherein a divergent portion of said motion, corresponds to said divergent portion of said pattern reference surface,

wherein said recurring pattern of said cycling system results at least partially from a vertical motion provided by said vertical drive as a result of programming a control of said vertical drive to provide a preset pattern of relative motion corresponding to the divergent portion of said pattern reference surface.

20. A magnetron sputtering apparatus comprising:

a sputtering target assembly having a first side opposite a second side wherein a target surface on said first side is exposed to a sputtering chamber;

a traveling magnet member disposed to travel along a track on a second side of said target assembly, said magnet member including components which produce a magnetic field extending beyond the surface of said magnet member toward said target surface,

wherein a portion of said magnet member travels in a plane approximately parallel to an unused pre-sputtering configuration of said surface of said first side of said target, except in a divergent portion, where the distance of a portion of the magnetic member and said unused configuration of said surface of said first side of said target assembly exceed a range of tolerance for parallelism between said plane and said unused pre-sputtering configuration of said surface of said first side of said target.

21. The magnetron sputtering apparatus as in claim 20,

wherein travel of said magnet member following said divergent portion, rather than following said plane, provides an improvement in the uniformity of film thickness deposited on the surface of a substrate, located opposite said sputtering target, being sputter deposited.

22. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.0075 inches per foot of motion along said track.

23. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.010 inches per foot of motion along said track.

24. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.015 inches per foot of motion along said track.

25. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.020 inches per foot of motion along said track.

26. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.025 inches per foot of motion along said track.

27. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.030 inches per foot of motion along said track.

28. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.035 inches per foot of motion along said track.

29. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.040 inches per foot of motion along said track.

30. The magnetron sputtering apparatus as in claim 20 or 21,

wherein said tolerance for parallelism is 0.050 inches per foot of motion along said track.

31. The magnetron sputtering apparatus as in claim 20,

wherein said magnet member includes a series of magnet member subsections,

wherein movement along said track results from a programming of a motor to raise and lower each subsection of said set of subsections according a programmed pattern depending on the lateral position of said magnet member as it moves laterally.

32. The magnetron sputtering apparatus as in claim 20,

wherein the magnet member includes at least two sections, wherein a set of tracks comprising said track in a center track supporting an end of each section of said at least two sections, said magnet member being hinged at said center track.

33. A magnetron scanning apparatus comprising:

a magnet member running as a truck on a set of separated linear bearing rails which are approximately parallel, where during sputtering to improve the uniformity of film thickness sputter deposited on a substrate opposite a target disposed between said target assembly and said magnet member a first end of a first rail of said set of bearing rails is raised to be further from the target than a second end of said first rail of said set of bearing rails.

34. A magnetron scanning apparatus as in claim 33,

where during sputtering to further improve the uniformity of film thickness sputter deposited, a second end of a second rail of said set of bearing rails is raised to be further from the target than a first end of said second rail of said set of bearing rails, wherein said second end of said second rail of said set of bearing rails corresponds to said second end of said first rail of said set of bearing rails.

35. A magnetron sputtering apparatus as in claim 34,

wherein a set of vertical positions of said first and said second ends of said rails is set by a vertical travel mechanism which can raise and lower said first and said second ends of said first and second rails to set the tracking of the magnet member.

36. A magnetron sputtering apparatus as in claim 35,

wherein said vertical travel mechanism operates during sputtering and tracking of said magnet member.

37. A method for selectively controlling the film thickness deposited on a substrate during sputtering comprising the steps of:

moving a magnet member laterally in an approximately linear pattern in the proximity of a sputtering target and

varying the strength of the magnetic field enhancing sputtering at the target surface as the magnet member moves laterally to deposit a particular film thickness pattern on the substrate during processing during sputtering.

38. The method for selectively controlling the film thickness deposited on a substrate during sputtering as in claim 37,

wherein the step of varying the strength of the magnetic field includes moving portions of said magnet member vertically.

39. The method for selectively controlling the film thickness deposited on a substrate as in claim 38,

wherein the step of moving portions of the magnet member vertically provides that the vertical distance is a distance greater than a tolerance for parallelism between a reference plane and the plane of motion at selected locations to vary the magnetic field strength causing a divergence from the plane to control the film thickness uniformity.

40. The method for selectively controlling the film thickness deposited on a substrate during sputtering as in claim 37,

wherein the step of varying the strength of the magnetic field includes changing the strength of electromagnets in said magnetic member according to a pattern depending on the lateral location of the magnet member.

41. A method for selectively controlling the film thickness deposited on a substrate during sputtering comprising the steps of:

moving a magnet member laterally along an approximately linear track and

moving portions of the magnet member in a vertical direction simultaneously with the lateral motion of the magnet member to change the magnetic field intensity utilized for sputtering at one or more locations along the track to improve the control of the film thickness deposited during sputtering.

42. A method for selectively controlling the film thickness deposited on a substrate during sputtering comprising the steps of:

locating a magnetic field opposite a sputtering target;

moving the magnetic field laterally across the target;

varying the strength of the magnetic field at locations where a localized change in the deposited film thickness is desired

wherein the step of varying the strength of the magnetic field includes changing the strength of electro-magnets in said magnetic member according to a pattern depending on the lateral location of the magnet member.