IC-processed microneedles
First Claim
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1. A method of fabricating a microstructure, comprising the steps of:
- providing a substrate for forming an interface region and an elongated portion extending away from said interface region, said substrate including a frontside and a backside;
forming a patterned, non-planar etchable structure on the frontside of said elongated portion;
depositing an unetchable membrane layer atop said etchable structure;
opening at least one etching hole in said membrane layer; and
etching said etchable structure by placing an etchant into said etching hole, said etchable structure being etched to form a cavity underneath said membrane layer, thereby producing a shaft formed from said membrane layer and said elongated portion of said substrate.
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Abstract
A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.
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Citations
12 Claims
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1. A method of fabricating a microstructure, comprising the steps of:
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providing a substrate for forming an interface region and an elongated portion extending away from said interface region, said substrate including a frontside and a backside; forming a patterned, non-planar etchable structure on the frontside of said elongated portion; depositing an unetchable membrane layer atop said etchable structure; opening at least one etching hole in said membrane layer; and etching said etchable structure by placing an etchant into said etching hole, said etchable structure being etched to form a cavity underneath said membrane layer, thereby producing a shaft formed from said membrane layer and said elongated portion of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating a microneedle, comprising the steps of:
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providing a semiconductor substrate for forming an interface region and an elongated portion; forming a shaft enclosing a microchannel along said elongated portion, said shaft extending from said interface region; and forming first and second ports through said shaft for permitting transport of a liquid through said microchannel. - View Dependent Claims (9, 10, 11)
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12. A method of fabricating a microstructure, comprising the steps of:
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providing a substrate for forming a region and an elongated portion extending away from said region, said substrate including a first side and a second side; forming a patterned etchable structure on said first side; depositing an unetchable layer atop said etchable structure; opening at least one etching hole in said unetchable layer; and etching said etchable structure by placing an etchant into said at least one etching hole, said etchable structure being etched to form a cavity underneath said unetachable layer, thereby producing a shaft formed from said unetchable layer and said elongated portion of said substrate.
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Specification