Process for production of semiconductor substrate
First Claim
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1. A process for producing a semiconductor substrate comprising the steps of:
- forming a nonporous monocrystalline semiconductor layer on a first substrate wherein the first substrate comprises a porous layer at the surface thereof;
bonding a second substrate to the nonporous monocrystalline layer;
separating the bonded substrate such that a portion of the porous layer remains on the second substrate and a portion of the porous layer is not removed from the first substrate;
removing the portion of the porous layer on the second substrate; and
removing the portion of the porous layer remaining on the first substrate.
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Abstract
A process for producing a semiconductor substrate is provided which comprises steps of forming a porous layer on a first substrate, forming a nonporous monocrystalline semiconductor layer on the porous layer of the first substrate, bonding the nonporous monocrystalline layer onto a second substrate, separating the bonded substrates at the porous layer, removing the porous layer on the second substrate, and removing the porous layer constituting the first substrate.
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Citations
24 Claims
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1. A process for producing a semiconductor substrate comprising the steps of:
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forming a nonporous monocrystalline semiconductor layer on a first substrate wherein the first substrate comprises a porous layer at the surface thereof; bonding a second substrate to the nonporous monocrystalline layer; separating the bonded substrate such that a portion of the porous layer remains on the second substrate and a portion of the porous layer is not removed from the first substrate; removing the portion of the porous layer on the second substrate; and removing the portion of the porous layer remaining on the first substrate. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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2. A process for producing a semiconductor substrate, comprising the steps of:
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forming a nonporous monocrystalline semiconductor layer on a first substrate wherein the first substrate comprises a porous layer at the surface thereof; bonding a second substrate to the nonporous monocrystalline layer with interposition of an insulative layer; separating the bonded substrates such that a portion of the porous layer remains on the second substrate and a portion of the porous layer is not removed from the first substrate; removing the portion of the porous layer on the second substrate; and removing the portion of the porous layer remaining on the first substrate. - View Dependent Claims (12, 13)
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Specification