Demountable and repairable low pitch interconnect for stacked multichip modules

• US 5,857,858 A
• Filed: 12/23/1996
• Issued: 01/12/1999
• Est. Priority Date: 12/23/1996
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Wojnarowski, Robert John, Kolc, Ronald Frank, Gorowitz, Bernard
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US08/773,625
• Time in Patent Office: 750 Days
• Field of Search: 439/69, 439/74, 439/75, 361/729, 361/735, 361/740, 361/790, 361/744, 361/86, 361/87, 361/88, 361/89, 361/91, 257/686
• US Class Current: 439/86
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence

Abstract

Connection elements which, for example, may be used to facilitate interconnection to and stacking of electronic assemblies or may include an elongated conductive core, such as a wire or a hollow tube structure, coated with a layer of elastomeric material containing conductive particle such that the elastomeric material is conductive at least when compressed. The substrates of multi-chip modules (MCMs) have electrical connection sites in the form of metal-lined channels in the substrate edges, and the connection elements are pressed into the channels. Separate compression or clamping elements may be employed to enhance conductivity, as well as to facilitate external connections. The elongated conductive core may take the form of a hollow tube structure which may be expanded under internal pressure to compress the layer of elastomeric material. The compression elements may take the form of printed circuit boards. In alternative embodiments the connection elements may be clamped between conductive channels of side-by-side substrates or between opposed conductive channels of stacked substrates.

Claims

1. An electrical interconnection comprising:

an electrically insulating interconnect support having a pair of opposed major surfaces and a side surface;

an electrical connection site comprising a channel formed in said side surface and lined with an electrically conductive layer electrically connected to circuitry; and

a connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, at least a portion of said connection element being located within said channel;

a compression element pressed against said connection element to enhance electrical connection between said conductive particles, said core and said channel, said compression element comprising a printed circuit board supporting a conductor pressed against said connection element to establish an electrical connection with said circuit board conductor.

2. An electrical interconnection comprising:

an electrically insulating interconnect support having a pair of opposed major surfaces and a side surface;

an electrical connection site comprising a channel formed in said side surface and lined with an electrically conductive layer electrically connected to circuitry; and

a connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, at least a portion of said connection element being located within said channel;

a compression element pressed against said connection element to enhance electrical connection between said conductive particles, said core and said channel, said compression element comprising a printed circuit board including an electrically conductive via hole pressed against said connection element to establish an electrical connection with said via hole.

3. An electrical interconnection comprising:

an electrically insulating interconnect sup port having a pair of opposed major surfaces and a side surface, said interconnect support comprising a circuit substrate supporting circuitry;

an electrical connection site comprising a channel formed in said side surface and lined with an electrically conductive layer electrically connected to the circuitry; and

a connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, at least a portion of said connection element being located within said channel;

a compression element pressed against said connection element to enhance electrical connection between said conductive particles, said core and said channel;

said compression element comprising another electrically insulating circuit substrate having a pair of opposed major surfaces and a side surface, with a channel formed in said side surface and lined with an electrically conductive layer electrically connected to circuitry supported by said another substrate, said channel of said another substrate being pressed against said connection element to establish an electrical connection.

4. The electrical interconnection of claim 3, wherein said core comprises a hollow tube structure internally pressurized to expand said tube structure and compress said layer of elastomeric material.

5. The electrical interconnection of claim 4, wherein said hollow tube structure is internally pressurized with a material injected in liquid form under pressure to expand said hollow tube structure to an expanded configuration and subsequently solidified to maintain said hollow tube structure in the expanded configuration.

6. A connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, said core comprising a hollow tube structure which can be internally pressurized to expand said tube structure.

7. The connection element of claim 6, wherein said hollow tube structure is internally pressurized with a material injected in liquid form under pressure to expand said hollow tube structure to an expanded configuration and subsequently solidified to maintain said hollow tube structure in the expanded configuration.

8. The connection element of claim 6, wherein the hollow tube structure includes at least one longitudinal split.

9. The connection element of claim 6, wherein the hollow tube structure comprises a plurality of individual longitudinally extending wires.

10. A connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles and a radially-extending electrically conductive structure on said core for increased localized compression of said layer of elastomeric material when said layer of elastomeric material is compressed.

11. A stack comprising:

a plurality of electronic modules in a stacked configuration, each module including a respective interconnect support having a pair of opposed major surfaces and a side surface, and each of said modules including circuitry;

electrical connection sites on the side surface of each of said interconnect supports comprising aligned electrical connection sites on a side of said stacked configuration of said plurality of modules, said electrical connection sites on each of said interconnect supports, respectively, comprising a channel formed in the respective side surface extending between said opposed major surface of a respective interconnect supports lined with an electrically conductive layer electrically connected to said circuitry included in each of said modules, respectively; and

a plurality of connection elements, each comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, located within said channels and extending between aligned electrical connection sites on said side of said stacked configuration to interconnect said modules.

12. The stack of claim 11, wherein each of said interconnect supports comprises a circuit substrate, and said circuitry is supported by respective substrates.

13. The stack of claim 11, wherein said circuitry comprises at least one integrated circuit.

14. The stack of claim 11, further comprising a compression element pressed against said connection elements to enhance electrical connections between conductive particles, respective cores, and respective channels.

15. The stack of claim 14, wherein said compression element comprises a printed circuit board supporting conductors pressed against corresponding ones of said connection elements.

16. The stack of claim 14, wherein said compression element comprises a printed circuit board including electrically conductive via holes pressed against corresponding ones of said connection elements.

17. The stack of claim 12, further comprising a compression element pressed against said connection elements to enhance electrical connections between conductive particles, respective cores, and respective channels, and wherein said compression element comprises another stack of interconnected electronic modules including:

a plurality of electrically insulating substrates in another stacked configuration, each substrate having a pair of opposed major surfaces and a side surface, and each of said substrates supporting circuitry; and

electrical connection sites on the side surface of each of said substrates comprising aligned electrical connection sites on a side of said another stacked configuration of said plurality of substrates, said electrical connection sites on each of said substrates, respectively, comprising a channel formed in the respective side surface extending between said opposed major surface of a respective substrate and lined with an electrically conductive layer electrically connected to said at least one integrated circuit supported by each of said substrates, respectively;

said electrical connection site channels of said another stacked configuration being pressed against said connection elements to establish electrical connections.

18. The stack of claim 17, wherein said cores comprise hollow tube structures internally pressurized to expand said tubes and compress said layers of elastomeric material of respective connection elements.

19. An electrical interconnection comprising:

a pair of electrically insulating circuit modules each having upper and lower opposed major surfaces;

a channel formed in the upper surface of one of said modules and lined with an electrically conductive layer, and a corresponding channel formed in the lower surface of the other of said modules and lined with another electrically conductive layer; and

a connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles;

said circuit modules begin pressed together with said connection element engaging said channels to electrically connect said electrically conductive layers.

20. The electrical interconnection of claim 19, wherein said channels are circular.

21. A method for forming an electrical interconnection, said method comprising:

providing an electrically insulating circuit substrate having a pair of opposed major surfaces and a side surface;

forming a channel in the substrate side surface between the major surfaces;

lining the channel with an electrically conductive layer;

providing circuitry on one surface of the major surfaces, wherein lining the channel and providing circuitry include electrically connecting the channel and the circuitry;

providing a connection element including an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles; and

inserting at least a portion of the connection element into the channel; and

pressing a printed circuit board supporting a conductor against said connection element to establish an electrical connection with said circuit board conductor.

22. A method for forming an electrical interconnection, said method comprising:

providing an electrically insulating circuit substrate having a pair of opposed major surfaces and a side surface;

forming a channel in the substrate side surface between the major surfaces;

lining the channel with an electrically conductive layer;

providing circuitry on one surface of the major surfaces, wherein lining the channel and providing circuitry include electrically connecting the channel and the circuitry;

providing a connection element including an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles; and

inserting at least a portion of the connection element into the channel; and

pressing a printed circuit board including an electrically conductive via hole against the connection element to establish an electrical connection with the via hole.

23. A method for forming an electrical interconnection, said method comprising:

providing an electrically insulating circuit substrate having a pair of opposed major surfaces and a side surface;

forming a channel in the substrate side surface between the major surfaces;

lining the channel with an electrically conductive layer;

providing circuitry on one surface of the major surfaces, wherein lining the channel and;

providing circuitry include electrically connecting the channel and the circuitry

providing a connection element including an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles;

inserting at least a portion of the connection element into the channel; and

providing another electrically insulting circuit substrate supporting circuitry, having a pair of opposed major surfaces and a side surface, and having a channel formed in the side surface between the major surfaces and lined with an electrically conductive layer electrically connected to the circuitry; and

pressing the channel of the another electrically insulating circuit substrate against the connection element to establish an electrical connection.

24. A method for interconnecting integrated circuits, comprising the steps of:

providing a plurality of electrically insulating substrates, each respective substrate having a respective pair of opposed major surfaces, a respective side surface, and at least one respective integrated circuit thereon;

providing respective electrical connection sites on the side surface of each of the substrates by forming respective channels in the substrate side surfaces between the major surfaces and lined with electrically conductive layers electrically connected to the respective integrated circuits;

stacking the substrates in a vertical configuration with the electrical connection site channels of the respective substrates in alignment;

providing a connection element including an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles; and

inserting the connection element into the aligned connection site channels to establish electrical connections.

25. An electrical interconnection comprising:

an electrically insulating interconnect support having a pair of opposed major surfaces and a side surface;

an electrical connection site comprising a channel formed in said side surface and lined with an electrically conductive layer electrically connected to circuitry; and

a connection element comprising an elongated electrically conductive core coated with a layer of elastomeric material containing conductive particles, at least a portion of said connection element being located within said channel, the connection element being adapted to provide a constant impedance connection to the electrically conductive layer.