Tab imager assembly for use in an endoscope

• US 5,857,963 A
• Filed: 07/17/1996
• Issued: 01/12/1999
• Est. Priority Date: 07/17/1996
• Status: Expired due to Term

• Current Assignee: GE Inspection Technologies LP (General Electric Company)
• Original Assignee: Welch Allyn Incorporated
• Inventors: West, Douglas J., Bingham, Richard L., Pelchy, Thomas Edward, Vivenzio, Robert L., Johnson, Edward Arthur, Grecco, James Edward
• Primary Examiner(s): Leubecker, John P.
• Application Number:
  US08/682,136
• Time in Patent Office: 909 Days
• Field of Search: 600/109-112, 348/65, 348/76, 348/373, 348/375, 348/294, 250/239
• US Class Current: 600/109
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

A solid state imager assembly for use in an endoscope in which a TAB imager package is mounted within the horizontal leg of a T-shaped support member. Circuitry for servicing the imager is mounted on the vertical leg of the support member. In one embodiment of the invention, the vertical component of the T-shaped support member comprises two half-sections.

Claims

1. A solid state imager assembly comprising:

a T-shaped non-conductive support having a vertical member and a horizontal member,

said horizontal member having a recess passing downwardly through a top surface of said member to a given uniform depth,

a TAB imager package mounted in said recess, said package including a solid state imager, a transparent window mounted over said imager and fine pitch leads extending outwardly from between the imager and the transparent window to either side of the package so that the leads overlie at least a portion of the top surface of the horizontal member, the pitch of said leads being about 2 mm or less, said TAB imager package being entirely supported by said non-conductive support,

circuit means mounted upon said support for transmitting signals to and from said solid state imager, and

traces on said support for electrically connecting said imager leads to said circuit means.

2. The imager assembly of claim 1 wherein the pitch between leads is 2 mm or less.

3. The imager assembly of claim 1 wherein said circuit means is located on at least one side of the vertical member of said support.

4. The imager assembly of claim 1 that further includes a grounding buss for said circuit means mounted upon the bottom surface of the vertical member.

5. The imager assembly of claim 1 wherein said support is formed from a single piece of non-conductive material.

6. The imager assembly of claim 1 wherein the vertical member and the horizontal member of said support are separate sections that are bonded together in assembly.

7. The imager assembly of claim 6 wherein said imager leads pass over the top surface of the horizontal member and are bonded to electrical traces mounted upon the support for connecting the imager to said circuitry.

8. The imager assembly of claim 1 that further includes transmission wires connected to the vertical member of said support for connecting the electrical circuitry on said support member to a remote video processor.

9. A solid state imager assembly comprising:

a non-conductive support including two half-sections that are symmetrically positioned about a common central axis,

each half section further including a vertical panel, a horizontal shelf extending outwardly from the top edge of the vertical panel and a raised lip extending vertically from the outer edge of said shelf,

a TAB imager package mounted upon the shelves of the two half sections, said package including a solid state imager that is seated upon said shelf adjacent said lips, a transparent window mounted upon the imager and fine pitch leads extending outwardly to either side of the imager over the opposed lips of said support,

circuit means mounted upon the vertical panel of each half section for transmitting signals to and from said solid state imager, and

electrical traces on each of the half sections for electrically connecting said fine pitch leads to said circuit means.

10. The imager assembly of claim 9 wherein the pitch between leads is at or below 2 mm.

11. The imager assembly of claim 9 wherein the height of the opposed lips above the top of the shelves are about equal to the height of the imager.

12. The imager assembly of claim 9 wherein the opposing side walls of the vertical panels are bonded together in abutting contact in assembly and said circuit means are mounted on the outer side walls of the abutting panels.

13. The imager assembly of claim 9 wherein a gap is provided between the opposing side walls of the panels and circuit means are mounted on both sides of each panel and further including a block of encapsulating material filling said gap which is bonded to each of said panels.

14. The imager assembly of claim 9 wherein a gap is provided between the opposing side walls of the panels, and circuit means are mounted on the inner side walls of the panels, and said imager assembly further including a block of encapsulating material filling said gap, said block being bonded to the opposing panels whereby the electrical circuitry mounted upon the panels is completely encapsulated in said material.

15. The imager assembly of claim 14 that further includes at least one electrical connection for coupling the electric circuitry mounted on one half section with that mounted on the other half section.

16. A video endoscope having an insertion tube and a video processor, said endoscope including:

a light bundle passing through said insertion tube having a light exit face located at a distal end of the insertion tube for illuminating a target,

lens means mounted in the distal end of the insertion tube for focussing an image of said target upon an imaging plane located inside said insertion tube,

a TAB imager package including a solid state imager, a transparent window mounted over the imager, and fine pitch leads passing from between the window and the imager to either side of the imager,

a T-shaped non conductive support having a first member mounted perpendicular to the axis of the insertion tube and a second member integral with said first member being mounted along said axis, said first member having a recess formed in the top surface thereof in which said TAB imager package is seated with said leads passing over the top of said first member, and an image recording surface on the imager lying in said plane,

electrical circuitry means mounted upon the second member of said support and electrical traces on said support for connecting said electrical circuitry means to said leads,

wherein said T-shaped non conductive support is disposed within a thin walled cylinder of said endoscope contained within said insertion tube, and in which said non conductive support is not in contact with said thin walled cylinder such that said TAB imager assembly is not supported by said thin walled cylinder, and

transmission wires connected to the second member of said support that extend through the insertion tube for exchanging signals between said electrical circuitry means and a remote video processor.

17. The video endoscope of claim 16 wherein the pitch between leads is 2 mm or less.

18. The video endoscope of claim 16 that further includes a common ground buss for said circuitry mounted along the bottom edge of said second member.

19. A video endoscope having an insertion tube and a video processor, said endoscope including:

a light bundle passing through said insertion tube having a light exit face located at a distal end of the insertion tube for illuminating a target,

lens means mounted in the distal end of the insertion tube for focussing an image of said target upon a plane located inside said insertion tube,

a TAB imager package including a solid state imager, a transparent window mounted over said imager and fine pitch leads passing from between the window and the imager to either side of the imager,

a T-shaped non conductive support having a first member mounted perpendicularly to the axis of the insertion tube and a second member being mounted along said axis, said first member having a recess formed in the top surface thereof in which said TAB imager package is seated with said pitch leads passing over the top of said first member, and an image recording surface on the imager lying within said plane,

wherein said second member is divided into two symmetrical half sections, each of which includes a panel parallely aligned with the axis of the insertion tube,

electrical circuitry means mounted upon the second member of said support and electrical traces on said support for connecting said electrical circuitry means to said leads, and

transmission wires connected to the second member of said support that extends through the insertion tube for exchanging signals between said electrical circuitry means and a remote video processor.

20. The video endoscope of claim 19 wherein the vertical panels are separated to provide a gap therebetween and said electrical circuitry is mounted on each vertical panel.

21. The video endoscope of claim 19 wherein said electrical circuitry is mounted on the opposing inner sides of said vertical panels and further includes a block of encapsulating material filling the gap between said panels, said block being bonded to said panels and encapsulating said electrical circuitry mounted thereon.

22. The video endoscope of claim 21 that further includes connecting means for electrically coupling the circuit means on one panel with circuit means on the other panel.