High resolution intravascular ultrasound transducer assembly having a flexible substrate
First Claim
1. An ultrasound transducer assembly for facilitating providing images from within a cavity, the ultrasound transducer assembly comprising:
- integrated circuitry;
an ultrasound transducer array including a set of ultrasound transducer elements, each element comprising transducer material, and a first electrode formed on at least a first surface and a second surface of the transducer material and a second electrode formed on at least the second surface of the transducer material;
a flexible circuit to which the ultrasound transducer array and the integrated circuitry are attached during fabrication of the ultrasound transducer assembly, the flexible circuit comprising;
a flexible substrate, providing a re-shapable platform, to which the integrated circuitry and transducer elements are attached;
transducer signal lines on an inner surface of the flexible substrate, the transducer signal lines facilitating an electrical signal path between the integrated circuitry and the set of transducer elements; and
a ground line connection on the inner surface of the flexible substrate; and
wherein a first contact surface on the first electrode and a second contact surface on the second electrode for each transducer element are arranged upon the second surface of the transducer material and upon substantially a same physical plane as the inner surface of the flexible substrate.
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Accused Products
Abstract
An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. Integrated circuitry and transducer elements are attached to the flexible circuit while the flexible circuit is in a substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes. In an embodiment of the invention wherein the transducer elements are arranged in a cylindrical array, gaps are entirely filled with backing material having a relatively low acoustic impedance. Structure integrity is enhanced and a path to ground facilitated by electrically conductive disks attached to the ends of the transducer assembly.
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Citations
15 Claims
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1. An ultrasound transducer assembly for facilitating providing images from within a cavity, the ultrasound transducer assembly comprising:
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integrated circuitry; an ultrasound transducer array including a set of ultrasound transducer elements, each element comprising transducer material, and a first electrode formed on at least a first surface and a second surface of the transducer material and a second electrode formed on at least the second surface of the transducer material; a flexible circuit to which the ultrasound transducer array and the integrated circuitry are attached during fabrication of the ultrasound transducer assembly, the flexible circuit comprising; a flexible substrate, providing a re-shapable platform, to which the integrated circuitry and transducer elements are attached; transducer signal lines on an inner surface of the flexible substrate, the transducer signal lines facilitating an electrical signal path between the integrated circuitry and the set of transducer elements; and a ground line connection on the inner surface of the flexible substrate; and wherein a first contact surface on the first electrode and a second contact surface on the second electrode for each transducer element are arranged upon the second surface of the transducer material and upon substantially a same physical plane as the inner surface of the flexible substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification