Electrokinetic pumping

• US 5,858,193 A
• Filed: 11/09/1995
• Issued: 01/12/1999
• Est. Priority Date: 06/06/1995
• Status: Expired due to Fees

• Current Assignee: Orchid Cellmark Incorporated (Laboratory Corporation Of America Holdings)
• Original Assignee: Sarnoff Corporation (SRI International, Inc.)
• Inventors: Moroney, Richard Morgan III, McBride, Sterling Edward, Burton, Charlotte Anna, Chiang, William, Zanzucchi, Peter John, Demers, Robert Richard
• Primary Examiner(s): Beisner, William H.
• Assistant Examiner(s): NOGUEROLA, ALEXANDER STEPHAN
• Application Number:
  US08/556,423
• Time in Patent Office: 1,160 Days
• Field of Search: 204/600, 204/601, 204/450, 204/451
• US Class Current: 204/601
• CPC Class Codes: B01F 25/41 Mixers of the fractal type
• CPC Class Codes: B01F 33/3032 using magneto-hydrodynamic [MHD] phenomena to mix or move the fluids
• CPC Class Codes: B01F 35/7182 with means for feeding the material with a fractal or tree-type distribution in a surface
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00353 Pumps
• CPC Class Codes: B01J 2219/00358 electrode driven
• CPC Class Codes: B01J 2219/005 Beads
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/0059 Sequential processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/0068 Means for controlling the apparatus of the process
• CPC Class Codes: B01J 2219/0072 Organic compounds
• CPC Class Codes: B01J 2219/00722 Nucleotides
• CPC Class Codes: B01J 2219/00826 Quartz
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/00833 Plastic
• CPC Class Codes: B01J 2219/00853 : Employing electrode arrangements
• CPC Class Codes: B01J 2219/00891 : Feeding or evacuation
• CPC Class Codes: B01J 2219/00952 : Sensing operations
• CPC Class Codes: B01J 2219/00995 : Mathematical modeling
• CPC Class Codes: B01J 4/02 : for feeding measured , i.e. prescribed quantities of reagents
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2200/143 : Quality control, feedback systems
• CPC Class Codes: B01L 2300/0816 : Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0867 : Multiple inlets and one sample wells, e.g. mixing, dilution
• CPC Class Codes: B01L 2300/0874 : Three dimensional network
• CPC Class Codes: B01L 2300/1827 : using resistive heater
• CPC Class Codes: B01L 2400/0415 : electrical forces, e.g. electrokinetic
• CPC Class Codes: B01L 2400/0688 : surface tension valves, capillary stop, capillary break
• CPC Class Codes: B01L 3/5025 : for parallel transport of multiple samples
• CPC Class Codes: B01L 3/50273 : characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 : characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B01L 3/502746 : characterised by the means for controlling flow resistance, e.g. flow controllers, baffles B01L3/502738 takes precedence
• CPC Class Codes: C40B 40/06 : Libraries containing nucleotides or polynucleotides, or derivatives thereof
• CPC Class Codes: C40B 60/14 : for creating libraries
• CPC Class Codes: F04B 19/006 : Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02N 11/006 : Motors

Abstract

The invention provides electrode-based pumps and methods of operating such pumps. In one embodiment, the invention provides an electrode-based pump situated in a fluid channel comprising a first electrode and a second electrode, wherein the first and second electrodes have a diameter from about 25 microns to about 100 microns and are spaced from about 100 microns to about 2,500 microns apart. In another embodiment, the invention provides an electrode-based pump comprising a first electrode, second electrode and third electrode.

Claims

1. An electrode-based pump comprising, in a substrate,

(a) a first electrode and a second electrode intersecting with a channel of capillary dimensions, wherein the first and second electrodes have a diameter from about 25 microns to about 100 microns and are spaced from about 100 microns to about 2,500 microns apart, and wherein the pump operates to move liquid in the channel as a result of a potential applied between the first and second electrodes;

and

(b) a voltage driver for applying voltage across the electrodes,

wherein the pump in one mode of operation is adapted to pump fluid by having the driver apply voltage to just said first and second electrodes.

2. The electrode-based pump of claim 1, wherein the first and second electrodes are from about 150 microns to about 1000 microns apart.

3. The electrode-based pump of claim 1, wherein the first and second electrodes are from about 150 microns to about 250 microns apart.

4. The electrode-based pump of claim 1, wherein the electrodes are formed of fused via ink.

5. The electrode-based pump of claim 4, wherein the channel intersecting portion of the fused via ink is plated with metal.

6. The electrode-based pump of claim 5, wherein the plated metal is nickel, silver, gold, platinum or rhodium.

7. The electrode-based pump of claim 4, wherein the fused via ink extends through a via in the substrate that intersects with the channels, and wherein the fused via ink seals the vias against liquid leakage from the channel.

8. The electrode-based pump of claim 1, wherein the voltage driver is for applying voltage pulses across the electrodes.

9. The electrode-based pump of claim 8, wherein the driver is a digital driver.

10. An electrode-based pump comprising:

a substrate in which a channel of capillary dimensions is formed;

electrical conduits through the substrate intersecting with the channel at points separated by from about 100 microns to about 2,500 microns formed of fused via ink, wherein the fused via ink seals the conduits against liquid leakage from the channel; and

metal plating on ends of the fused via ink intersecting the channel, wherein the metal platings and associated conduits define electrodes.

11. The electrode-based pump of claim 10, wherein the first and second electrodes are from about 150 microns to about 1000 microns apart.

12. The electrode-based pump of claim 10, wherein the first and second electrodes are from about 150 microns to about 250 microns apart.