Method of forming small aperture

• US 5,858,256 A
• Filed: 07/11/1996
• Issued: 01/12/1999
• Est. Priority Date: 07/11/1996
• Status: Expired due to Fees

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Quate, Calvin F., Minne, Stephen C.
• Primary Examiner(s): McCamish, Marion E.
• Assistant Examiner(s): JUSKA, CHERYL ANN
• Application Number:
  US08/679,687
• Time in Patent Office: 915 Days
• Field of Search: 216/12, 216/24, 216/56, 438/734, 438/31, 438/700, 438/947, 438/928
• US Class Current: 216/24
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: B82Y 35/00 Methods or apparatus for measurement or analysis of nanostructures
• CPC Class Codes: G01Q 60/22 Probes, their manufacture, or their related instrumentation, e.g. holders
• CPC Class Codes: G01Q 60/44 SICM [Scanning Ion-Conductance Microscopy] or apparatus therefor, e.g. SICM probes
• CPC Class Codes: Y10S 438/928 Front and rear surface processing
• CPC Class Codes: Y10S 438/947 Subphotolithographic processing

Abstract

A thick column is formed by masking and etching a substrate, and the column is thinned to a very small diameter (e.g., ≦5 nm) by oxidizing the column and removing the oxide layer. A metal layer is deposited on the surface of the substrate, and the column and substrate are etched to form a pit. The backside of the substrate is etched to form an aperture surrounded by the metal layer. Alternatively, the metal layer is removed and a dopant layer is implanted into the substrate, followed by the etching of the backside, leaving an aperture surrounded by the dopant layer. In a second alternative, the oxidized column is broken from the substrate, and the backside is etched, leaving an aperture surrounded by an oxide layer. These processes can be used to fabricate apertures of very small and reproducible dimensions for such instruments as near field scanning optical microscopes and scanning ion conductance microscopes.

Claims

1. A method of forming an aperture comprising:

providing a substrate;

fabricating a column, said column extending from a frontside of said substrate;

depositing a metal layer on said frontside of said substrate, said metal layer covering a tip of said column but not covering a sidewall of said column;

applying at least one etchant which attacks said substrate, thereby causing a portion of said metal layer covering said tip of said column to lift off and forming a pit in said substrate; and

removing material from a backside of said substrate so as to form an aperture.

2. The method of claim 1 wherein removing material from a backside of said substrate comprises using said metal layer as an etch stop.

3. The method of claim 1 further comprising removing said metal layer and implanting dopant in said frontside of said substrate to form a doped layer.

4. The method of claim 3 wherein removing material from a backside of said substrate comprises using said doped layer as an etch stop.

5. The method of claim 4 further comprising oxidizing said doped layer so as to form an oxide layer and thereby reduce the diameter of said aperture.

6. The method of claim 5 further comprising removing a portion of said oxide layer on the frontside of said substrate.

7. The method of claim 3 wherein said dopant comprises boron.

8. The method of claim 1 wherein applying at least one etchant which attacks said substrate comprises applying a first etchant to cause said portion of said metal layer covering said tip of said column to lift off and applying a second etchant to from said pit.

9. The method of claim 1 wherein said substrate comprises silicon.

10. The method of claim 1 wherein said metal layer comprises chromium.

11. The method of claim 1 wherein fabricating a column comprises:

fabricating a first column extending from said frontside of said substrate;

oxidizing said first column to form an oxide layer in said first column; and

removing said oxide layer to form a column, the column being less thick than the first column.

12. The method of claim 11 wherein fabricating a thick column comprises depositing a metal dot on a surface of said substrate and etching a portion of said substrate using said metal dot as a mask.

13. The method of claim 12 wherein said metal dot comprises chromium.

14. A method of forming an aperture comprising:

providing a substrate;

fabricating a column, said column extending from a frontside of said substrate;

forming an oxide layer on said column and said frontside;

removing said column; and

etching a backside of said substrate to form an aperture.

15. The method of claim 14 further comprising depositing a passivation layer on said oxide layer prior to etching a backside of said substrate.

16. The method of claim 15 further comprising removing said passivation layer following said step of etching a backside of said substrate.

17. A method of forming an aperture comprising:

providing a silicon substrate;

depositing a metal dot on a surface of said silicon substrate;

applying a first etchant to said surface so as to form a first column extending from a frontside of said substrate;

oxidizing said first column to form a first oxide layer therein;

removing said first oxide layer to form a column, the column being less thick than the first column;

depositing a chromium layer on said frontside and a tip of said column;

applying a second etchant to from a spike extending from said substrate;

applying a third etchant to form a pit in said substrate;

removing said chromium layer;

implanting a layer of dopant in said frontside; and

applying a fourth etchant to a backside of said substrate to form an aperture, said layer of dopant acting as an etch stop for said fourth etchant.

18. The method of claim 17 further comprising forming a second oxide layer on said layer of dopant to reduce the diameter of said aperture.

19. The method of claim 18 further comprising removing a portion of said second oxide layer from said layer of dopant on the frontside of said substrate to reduce a thickness of said aperture.

20. A method of forming an aperture comprising:

providing a silicon substrate;

depositing a metal dot on a surface of said silicon substrate;

applying a first etchant to said surface so as to form a first column extending from a frontside of said substrate;

oxidizing said first column to form a first oxide layer therein;

removing said first oxide layer to form a column, the column being less thick than the first column;

depositing a chromium layer on said frontside and a tip of said column;

applying a second etchant to form a spike extending from said substrate;

applying a third etchant to form a pit in said substrate; and

applying a fourth etchant to a backside of said substrate to form an aperture, said chromium layer acting as an etch stop for said fourth etchant.

21. A method of forming an aperture comprising:

providing a silicon substrate;

depositing a metal dot on a surface of said silicon substrate;

applying a first etchant to said surface so as to form a column extending from a frontside of said substrate;

oxidizing said column and said substrate to form an oxide layer in said column and in said frontside;

removing said column;

depositing a polyimide layer over said oxide layer; and

applying a second etchant to a backside of said substrate to form an aperture, said oxide layer acting as an etch stop for said second etchant.