Method of making an inverse-T tungsten gate
First Claim
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1. A method of forming an integrated circuit device, said method comprising the steps of:
- providing a partially completed semiconductor wafer, said partially completed semiconductor wafer comprising a gate insulating layer overlying a substrate; and
forming an inverse-T gate electrode structure, said inverse-T gate electrode structure comprising;
a silicided layer overlying said gate insulating layer; and
a gate electrode overlying said silicided layer, said silicided layer extending laterally from said gate electrode.
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Abstract
A technique for fabricating an integrated circuit device 100 using an inverse-T tungsten gate structure 121 overlying a silicided layer 119 is provided. This technique uses steps of forming a high quality gate oxide layer 115 overlying a semiconductor substrate 111. The silicided layer 119 is defined overlying the gate oxide layer 115. The silicided layer 119 does not substantially react to this layer. The technique defines the inverse-T tungsten gate electrode layer 121 overlying the silicided layer 119. A top surface of this gate electrode may also be silicided 127 to further reduce the resistance of this device element.
39 Citations
20 Claims
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1. A method of forming an integrated circuit device, said method comprising the steps of:
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providing a partially completed semiconductor wafer, said partially completed semiconductor wafer comprising a gate insulating layer overlying a substrate; and forming an inverse-T gate electrode structure, said inverse-T gate electrode structure comprising; a silicided layer overlying said gate insulating layer; and a gate electrode overlying said silicided layer, said silicided layer extending laterally from said gate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming an integrated circuit device comprising the steps of:
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providing a partially completed semiconductor wafer, said partially completed semiconductor wafer comprising a gate insulating layer overlying a substrate; forming a first silicided layer overlying said gate insulating layer; forming a gate electrode overlying said silicided layer; and etching said first silicided layer to form an etched silicided layer, wherein a portion of said etched silicided layer extends laterally from said gate electrode. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method of forming an integrated circuit device comprising the steps of:
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providing a partially completed semiconductor wafer, said partially completed semiconductor wafer comprising a gate insulating layer overlying a substrate; forming a first silicided layer overlying said gate insulating layer; forming a gate electrode overlying said silicided layer; etching said first silicided layer to form an etched silicided layer, wherein a portion of said etched silicided layer extends laterally from said gate electrode; forming a first sidewall spacer adjacent said gate electrode and at least partially above said etched silicided layer; and forming a second sidewall spacer adjacent said first sidewall spacer.
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Specification