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Curved lead configurations

  • US 5,859,472 A
  • Filed: 09/12/1997
  • Issued: 01/12/1999
  • Est. Priority Date: 09/12/1996
  • Status: Expired due to Term
First Claim
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1. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

  • a structure defining a lead-bearing surface;

    a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;

    a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface and spaced apart on said lead-bearing surface from said terminal end on an offset axis;

    a first curved lead interconnecting said tip end and said terminal end; and

    a second curved lead interconnecting said tip end and said terminal end.

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