Curved lead configurations

• US 5,859,472 A
• Filed: 09/12/1997
• Issued: 01/12/1999
• Est. Priority Date: 09/12/1996
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Smith, John W., DiStefano, Thomas H.
• Primary Examiner(s): Brown, Peter Toby
• Assistant Examiner(s): DUONG, HUNG V
• Application Number:
  US08/927,601
• Time in Patent Office: 487 Days
• Field of Search: 257/666, 257/674, 257/690, 257/642, 257/643, 257/700, 257/773
• US Class Current: 257/674
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end.

Claims

1. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

a structure defining a lead-bearing surface;

a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;

a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface and spaced apart on said lead-bearing surface from said terminal end on an offset axis;

a first curved lead interconnecting said tip end and said terminal end; and

a second curved lead interconnecting said tip end and said terminal end.

2. A microelectronic lead assembly as claimed in claim 1, wherein said first and second curved leads are arranged on opposite sides of said offset axis.

3. A microelectronic lead assembly as claimed in claim 2, wherein first and second curved leads are substantially symmetric across said offset axis.

4. A microelectronic lead assembly as claimed in claim 1 wherein said first and second curved leads join said terminal end from substantially opposite directions.

5. A microelectronic lead assembly as claimed in claim 1, wherein said first and second curved leads join each of said ends from substantially opposite directions.

6. A microelectronic lead assembly as claimed in claim 1 wherein said first and second curved leads bow away from the offset axis and away from one another between said tip end and said terminal end.

7. A microelectronic lead assembly as claimed in claim 1 wherein said terminal end includes a bulge and wherein first and second curved leads have tapered portions adjacent the terminal end, said leads gradually increasing in width in the directions along said curved leads toward said terminal end.

8. A microelectronic lead assembly as claimed in claim 1 wherein said structure defining a lead-bearing surface is a flexible, sheet-like structure and said terminal end is fixed to a via extending through said structure.

9. A microelectronic lead assembly as claimed in claim 1, further comprising an extension portion extending substantially along said offset axis and having first and second ends, said extension portion being connected at said first end to one of said tip end and said terminal end, and connected at said other end to said first and second curved leads.

10. A microelectronic lead assembly as claimed in claim 9, wherein said extension portion extends from said one of said ends in a direction away from the other of said ends.

11. A microelectronic lead assembly as claimed in claim 9, wherein said extension portion extends from said terminal end.

12. A microelectronic lead assembly as claimed in claim 9 wherein said structure defining a lead-bearing surface is a flexible, sheet-like structure and said terminal end is fixed to a via extending through said structure.

33. A microelectronic assembly including first and second microelectronic elements having confronting surfaces spaced apart from one another in a vertical direction, and a plurality of vertically extensive microelectronic lead assemblies as claimed in any one of claims 1, 13, 19, 22, or 26 interconnecting said electrical connections on said microelectronic elements.

13. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

a structure defining a lead-bearing surface;

a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;

a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface, said tip end further being spaced apart on said lead-bearing surface from said terminal end; and

a curved lead connecting said tip end and said terminal end, said curved lead having a bulge at one of said ends, said lead being substantially tangent to said bulge.

14. A microelectronic lead assembly as claimed in claim 13, wherein said ends of said lead define an offset axis, and a point of tangency between said lead and said bulge lies substantially on said offset axis.

15. A microelectronic lead assembly as claimed in claim 14, wherein said point of tangency is on a side of said bulge facing another end of said lead.

16. A microelectronic lead assembly as claimed in claim 13, wherein said one end having said bulge is said terminal end.

17. A microelectronic lead assembly as claimed in claim 13, wherein a major portion of a length of said lead is a U-shaped bight on one side of said offset axis.

18. A microelectronic lead assembly as claimed in claim 13 wherein said structure defining a lead-bearing surface is a flexible, sheet-like structure and said terminal end is fixed to a via extending through said structure.

19. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

a structure defining a lead-bearing surface;

a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;

a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface, said tip end also being spaced apart on said lead-bearing surface from said terminal end along an offset axis;

a generally S-shaped lead connecting said tip end and said terminal end, said S-shaped lead having a first curve in a first direction and a second curve in a second direction opposite said first direction, said first curve having a curve angle of at least 90 degrees as measured by an angle that a vector tangent to the lead entering the curve must be rotated to have a direction of a vector tangent to the lead exiting the curve.

20. A microelectronic lead assembly as claimed in claim 19, wherein said second curve has a curve angle of at least 90 degrees.

21. A microelectronic lead assembly as claimed in claim 19 wherein said structure defining a lead-bearing surface is a flexible, sheet-like structure and said terminal end is fixed to a via extending through said structure.

22. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

a structure defining a lead-bearing surface;

a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface;

an annular terminal structure for connection to the first microelectronic element, said terminal structure disposed on said lead-bearing surface surrounding and substantially concentric with said tip end and fixed to said structure;

a plurality of leads interconnecting said tip end and said terminal structure.

23. A microelectronic lead assembly as claimed in claim 22, wherein said plurality of leads comprises a plurality of elongated, spiral leads.

24. A microelectronic lead assembly as claimed in claim 22, wherein said plurality of leads comprises three leads.

25. A microelectronic lead assembly as claimed in claim 22 wherein said structure defining a lead-bearing surface is a flexible, sheet-like structure and said terminal end is fixed to a via extending through said structure.

26. A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

a structure defining a lead-bearing surface;

a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;

a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface; and

a lead interconnecting said tip end and said terminal end, said sheet-like lead having a peripheral edge and defining a slot with a plurality of branches, a first one of said branches passing between said tip end and said terminal end and having an opening at said peripheral edge.

27. A microelectronic lead assembly as claimed in claim 26, wherein said slot is generally Y-shaped, having second and third branches joining said first branch at a junction.

28. A microelectronic lead assembly as claimed in claim 26, wherein said lead element comprises an elongated portion extending from a bulbous portion, said slot having a second branch extending longitudinally along a portion of said elongated portion.

29. A microelectronic lead assembly as claimed in claim 28, wherein one of said tip end and said terminal end is positioned at a center of said bulbous portion, and the other of said tip end and said terminal end is positioned at a peripheral portion of said bulbous portion.

30. A microelectronic lead assembly as claimed in claim 29, wherein said lead element further defines a third branch of said slot connected to said first and second branches, said first and third branches extending within said bulbous portion partially around said center.

31. A microelectronic lead assembly as claimed in claim 28, wherein said bulbous portion has a clearance cutout for clearing an elongated portion of a neighboring lead.

32. A microelectronic lead assembly as claimed in claim 26, wherein at least one of said plurality of branches has a rounded cutout at a terminus thereof.

34. A microelectronic assembly including first and second microelectronic elements having confronting surfaces spaced apart from one another in a vertical direction, a plurality of electrical connections on said microelectronic elements and a plurality of vertically extensive flexible lead elements interconnecting said electrical connections on said microelectronic elements, each said flexible lead element including a plurality of curved conductors electrically connected in parallel with one another.

35. A microelectronic assembly as claimed in claim 34, wherein said electrical connections on said microelectronic elements are arranged in a grid array.

36. A microelectronic assembly as claimed in claim 35, wherein said grid array has a pitch of less than about 1 mm.

37. A microelectronic assembly as claimed in claim 34, further comprising a compliant layer interposed between said confronting surfaces and surrounding said flexible lead elements.

38. A microelectronic assembly as claimed in claim 34, wherein said plurality of curved leads comprises a pair of curved leads.

39. A microelectronic assembly as claimed in claim 38, wherein said pair of curved conductors are arranged symmetrically about an axis.

40. A microelectronic assembly as claimed in claim 34, wherein one of said first and second microelectronic elements is a flexible, sheet-like structure, and said electrical connections between said sheet-like structure and said plurality of leads are vias extending through said structure.