Compositions and methods for suppressing flame

• US 5,861,106 A
• Filed: 11/13/1997
• Issued: 01/19/1999
• Est. Priority Date: 11/13/1997
• Status: Expired due to Term

• Current Assignee: Goodrich Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Universal Propulsion Company Incorporated (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Olander, Donald E.
• Primary Examiner(s): ANTHONY, JOSEPH DAVID
• Application Number:
  US08/968,588
• Time in Patent Office: 432 Days
• Field of Search: 252/4, 252/5, 252/7, 252/601
• US Class Current: 252/7
• CPC Class Codes: A62C 5/006 Extinguishants produced by combustion
• CPC Class Codes: A62D 1/0007 Solid extinguishing substances
• CPC Class Codes: A62D 1/06 containing gas-producing, chemically-reactive components
• CPC Class Codes: C09K 21/02 Inorganic materials
• CPC Class Codes: C09K 21/14 Macromolecular materials

Abstract

The invention relates to flame suppression compositions including an inorganic halogen-containing component including bromine, iodine, or a mixture thereof, and an organic binder system having a heat of formation of less than about 200 cal/g, wherein the composition is solid at a temperature below 100° C. and combusts at a temperature between about 160° C. to 1200° C. to produce a plurality of reaction products capable of suppressing a flame upon application thereto and wherein substantially all the halogen is converted to a solid form after suppressing the flame. The invention also relates to methods of suppressing flames by combining an inorganic halogen-containing component including bromine, iodine, or a mixture thereof, with an organic binder system having a heat of formation of less than about 200 cal/g to form a solid composition, generating a plurality of reaction products from the composition in a substantially gaseous form, wherein the reaction products have a velocity, and applying the reaction products at a temperature of between about 160° C. to 1200° C. to at least one flame in an amount sufficient to suppress the flame, wherein substantially all the halogen is solid after suppressing the flame.

Claims

1. A flame suppression composition comprising:

about 70 to 96 weight percent of the composition of an inorganic halogen-containing compound comprising bromine, iodine, or a mixture thereof; and

about 4 to 30 weight percent of the composition of an organic binder system having a heat of formation of less than about 200 cal/g, wherein the composition is solid at a temperature below 100°

C. and capable of combusting at a temperature between about 160°

C. to 1200°

C. to produce a plurality of reaction products capable of suppressing a flame upon application thereto and wherein substantially all the halogen is converted to a solid form after suppressing the flame.

2. The composition of claim 1, wherein the reaction products of the composition comprise H₂ O, CO, and a halogen-containing byproduct selected from the group consisting of KI, KBr, H₂, COH₂, O₂, I₂ OH, K₂ I, and a mixture thereof.

3. The composition of claim 1, wherein the reaction products are in a substantially gaseous state prior to application to the flame.

4. The composition of claim 1, wherein the inorganic halogen-containing component comprises potassium bromine, potassium bromate, potassium iodine, potassium iodate, ammonium bromine, ammonium bromate, ammonium iodine, or ammonium iodate, or a mixture thereof.

5. The composition of claim 4, wherein the inorganic halogen-containing component is selected from the group consisting of potassium iodate, potassium bromate, potassium bromine, ammonium iodate, and a mixture thereof.

6. The composition of claim 1, wherein the organic binder system is present in an amount of about 4 to 15 weight percent of the composition.

7. The composition of claim 6, wherein the organic binder system is present in an amount of about 8 to 12 weight percent of the composition.

8. The composition of claim 1, wherein the organic binder system comprises:

a binder resin of at least one curing binder, melt cast binder, solvated binder, or a mixture thereof;

a curative present in about 1 to 3 weight percent; and

a plasticizer present in about 10 to 30 weight percent, wherein the organic binder system has a heat of formation of less than about 0 cal/g.

9. The composition of claim 8, wherein the organic binder system further comprises at least one of an antioxidant, an opacifier, or a scavenger.

10. The composition of claim 8, wherein the binder resin is carboxy-terminated polybutadiene, polyethylene glycol, polypropylene glycol, hydroxy-terminated polybutadiene, polybutadiene acrylonitrile, polybutadiene acrylic acid, butacene, glycol azido adipate, polyglycol adipate, or a mixture thereof.