Image sensor assembly

• US 5,861,654 A
• Filed: 11/28/1995
• Issued: 01/19/1999
• Est. Priority Date: 11/28/1995
• Status: Expired due to Term

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Eastman Kodak Company
• Inventors: Johnson, Dean A.
• Primary Examiner(s): Ostrowski, David
• Application Number:
  US08/563,832
• Time in Patent Office: 1,148 Days
• Field of Search: 257/432, 257/433, 257/434, 257/797, 250/208.1, 250/208.2, 356/399, 361/802, 361/820
• US Class Current: 257/433
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

An image sensor assembly is mounted in an optical system having a plurality of reference locators. The image sensor assembly includes an image sensing device having photolithographically generated elements, such as image sensing sites, and a carrier package for enclosing the image sensing device. The carrier package has externally accessible reference features that are optically aligned with respect to the photolithographically generated elements on the image sensing device. Moreover, the externally accessible reference features are used to exactly constrain the image sensor assembly relative to the reference locators. Referencing the image sensing device to the same features that are used for exact constraint removes the effect of material variations that may cause dimensional changes and eliminates the need to activate the sensor for alignment of the sensor assembly in the optical system.

Claims

1. An image sensor assembly for mounting in an optical system having a plurality of reference locators, wherein said reference locators include a plurality of locator pins extending from respective flat surfaces, said image sensor assembly comprising:

an image sensing device; and

a carrier package adapted for exact constraint to a set of three features on the carrier package that are externally accessible to the reference locators to set the plane of the image sensor assembly, said carrier package supporting the image sensing device in a location within the carrier package that is referenced to at least one of the features, and wherein said set of features includes three target surfaces that contact the flat surfaces of the locators to set the plane of the package, and at least two straight edges orthogonal to one another that contact the pins to set the remaining degrees of freedom of the package.

2. An optical system, comprising:

a lens for focusing an image upon an imaging plane;

a plurality of reference locators that are positioned relative to the lens to provide a reference for locating the imaging plane;

an image sensing device;

a carrier package adapted for exact constraint to a set of features on the package that are accessible to the plurality of reference locators, said carrier package supporting the image sensing device in a location that is referenced to the set of features, said set of features including three targets to set the plane of the carrier package against the plurality of reference locators, and at least two straight edges orthogonal to one another that are urged against at least one of the reference locators to set the remaining degrees of freedom; and

means for holding the carrier package in place against the plurality of locators in order to exactly constrain the carrier package within the optical system.

3. An optical system as claimed in claim 2 wherein said set of features comprises three holes extending into the carrier package so as to provide adjoining ledges that form the three targets to set the plane of the carrier package against the reference locators, and wherein said at least two straight edges are defined by a set of three points on the circumference of two of the holes.

4. An optical system as claimed in claim 3 wherein two of the holes are squared in order to provide the two straight edges.

5. An optical system as claimed in claim 2 wherein said image sensing device includes photolithographically generated elements, and wherein said elements are optically referenced to the set of features on the carrier package.

6. An image sensor assembly as claimed in claim 5 wherein the photolithographically generated elements are image sensing sites.

7. An image sensor assembly as claimed in claim 5 wherein the photolithographically generated elements are bonding pads.

8. An image sensor assembly as claimed in claim 5 wherein the photolithographically generated elements are dedicated registration marks.

9. An image sensor assembly for mounting in an optical system having a plurality of reference locators, said image sensor assembly comprising:

an image sensing device; and

a carrier package adapted for exact constraint to a set of features on the carrier package that are externally accessible to the reference locators, wherein said set of features comprises three openings extending into the carrier package to provide an inset surface that provides three targets to set the plane of the carrier package against the reference locators, and wherein two of the openings are squared in order to provide two straight edges that are urged against at least one of the reference locators to set the remaining degrees of freedom.

10. An image sensor assembly for mounting in an optical system having a plurality of reference locators that include a plurality of locator pins extending from respective flat surfaces, said image sensor assembly comprising:

an image sensing device; and

a supporting substrate adapted for exact constraint to a set of features on the substrate that are externally accessible to the reference locators, said substrate supporting the image sensing device in a location on the substrate that is referenced to the set of features, wherein said set of features includes three target surfaces that contact the flat surfaces of the locators to set the plane of the substrate, and at least two straight edges orthogonal to one another that contact the pins to set the remaining degrees of freedom of the substrate.

11. An image sensor assembly as claimed in claim 10 wherein said image sensing device includes photolithographically generated elements, and wherein the photolithographically generated elements are referenced to at least one or more features having the straight edges orthogonal to one another.