Process monitoring system for real time statistical process control

• US 5,862,054 A
• Filed: 02/20/1997
• Issued: 01/19/1999
• Est. Priority Date: 02/20/1997
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Li, Hung-Yeh
• Primary Examiner(s): Gordon, Paul P.
• Application Number:
  US08/803,353
• Time in Patent Office: 698 Days
• Field of Search: 364/468, 364/28, 364/468.24, 364/554, 364/478.01, 364/184, 364/185, 364/468.15, 364/468.16
• US Class Current: 700/121
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/31288 Archive collected data into history file
• CPC Class Codes: G05B 2219/33028 Function, rbf radial basis function network, gaussian network
• CPC Class Codes: G05B 2219/33166 Rs485 bus to control several modules, motors
• CPC Class Codes: G05B 2219/35488 Graphical user interface, labview
• CPC Class Codes: G05B 2219/42001 Statistical process control spc
• CPC Class Codes: G05B 23/0227 Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
• CPC Class Codes: G05B 23/027 Alarm generation, e.g. communication protocol; Forms of alarm
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

This invention describes a method to monitor process parameters from multiple process machines to provide real time statistical process control (SPC). The particular implementation was derived from ion implantation of wafers, but has wide applicability where there are a number of process machines having a number of process parameters and close continuous sampling of data is required. The process parameters are collected on a single computer over a single RS 485 network, and each parameters is analyzed and displayed separately for each process and process machine. Statistical variables like Cp and Cpk arc calculated and presented on the computer screen along with graphs of the various parameters for a particular process machine. Data is aged out of the computer to an archival data base under the control of a manufacturing information system and connected to a company wide network.

Claims

1. A process parameter monitoring system for real time SPC, and comprising:

a) production control computer connected to wafer fabrication machinery to monitor key parameters and provide control signals,

b) said production control computer containing a database for storage and retrieval of process data collected from the wafer fabrication machinery,

c) said production control computer connected to a data server,

d) said production control computer having a display monitor upon which various data and parameter limits are displayed,

e) said data server connecting the production control computer to a company wide network,

f) said company wide network connected to a production manufacturing information system,

g) said data server providing process data and information to the production control computer from the production manufacturing information system through the company wide network,

h) said production control computer collecting process parameter data from the wafer fabrication machinery for each processing lot throughout the process,

i) said process parameter data placed into the database contained within the production control computer.

2. The process parameter monitoring system for real time SPC of claim 1, wherein the recipe for the particular process is obtained from the production manufacturing information system and delivered to the production control computer by means of the server and the company wide network.

3. The process parameter monitoring system for real time SPC of claim 1, wherein historical process data needed to provide limits for a statistical process control is obtained from the database contained within the production control computer.

4. The process parameter monitoring system for real time SPC of claim 1, wherein data collected from a process batch by the production control computer is archived in said database for future use in determining statistical process control parameters used for each wafer fabrication process machinery.

5. The process parameter monitoring system for real time SPC of claim 1, wherein data collected from the wafer fabrication process machinery is compared to control limits developed from previous data for each wafer fabrication process machine.

6. A process control and data collection system for wafer fabrication process SPC, and comprising:

a) a production control computer connected to a RS 485 network through a RS 485 adapter,

b) a RS 485 to digital converter connecting control data from the RS 485 network to each wafer fabrication process machine,

c) an analog to RS 485 converter connecting process parameter data from the wafer fabrication process machinery to the production control computer by means of the RS 485 network,

d) said process parameter data from the wafer fabrication process machinery providing real time process data,

e) said real time process data compared to SPC limits in the production control computer to determine a probability of yield from the process,

f) adjustments made to the process depending upon the real time process data as compared to the SPC limits and the probability of yield from the process.

7. The process control and data collection system of claim 6, wherein multiple wafer fabrication process machines can be monitored by the production control computer using a single RS 485 network, and comprising:

a) more than one wafer fabrication machine of the same type,

b) more than one type of wafer fabrication machine,

c) monitoring of one or more wafer fabrication machines can be stopped without affecting the monitoring of the other machines.

8. The process control and data collection system of claim 6, wherein real time data is collected on important process parameters for each process machine and connected to the process control computer for analysis against statistical limits for the process parameters for each process machine.

9. The process control and data collection system of claim 6, wherein the real time data collected from each process machine is placed into a historical database and used to form part of the database for future SPC limits and analysis.

10. The process control and data collection system of claim 6, wherein the real time data as collected by the production control computer provides real time status of the process, and allows corrections to the process when the real time parameters exceed statistical limits.

11. The process control and data collection system of claim 6, wherein short interval monitoring can assist process troubleshooting by sampling three process parameter data points in a short interval of time.

12. A method for real time process control by means of a process control computer connected to wafer fabrication machinery through a network, and comprising:

a) collecting process parameter data by a production control computer connected to one or more wafer process machines by means of a network,

b) storing real time process parameter data into a data base,

c) computing an average value for each parameter of each product batch,

d) storing said average values in an historical data file,

e) determining process control limits from said historical data file,

f) monitoring wafer fabrication process parameters and comparing to said process control limits.

13. The method of claim 12, further comprising an alarm for parameter data that exceeds control limits, and comprising:

a) detecting parameter data from a process machine that has exceeded the process control limits,

b) sending a control signal to hold said process machine with the parameter data that has exceeded the process control limits,

c) enabling an alarm to both a process operator and a process engineer signaling a failing process,

d) reviewing both the wafer product and the process machine to determine further action.

14. The method of claim 13, wherein a short interval monitor of the failing process can be used to help diagnose the problem, and comprising:

a) closing the parameter monitor of the failing process,

b) applying a short interval monitor to the failing process and taking several parameter samples in a short time interval,

c) resuming the parameter monitor of the failing process.

15. The method of claim 13, wherein a trend of a process parameter can signal a process going out of control.