Electronic device having the electromagnetic interference suppressing body

• US 5,864,088 A
• Filed: 01/19/1995
• Issued: 01/26/1999
• Est. Priority Date: 01/20/1994
• Status: Expired due to Term

• Current Assignee: NEC Tokin Corporation (Yageo Corporation)
• Original Assignee: Tokin Corporation (Yageo Corporation)
• Inventors: Sato, Tadakuni, Togawa, Hitoshi, Inabe, Toshihisa, Yoshida, Shigeyoshi, Sato, Mitsuharu
• Primary Examiner(s): Ledynh, Bot L.
• Assistant Examiner(s): Ngo, Hung V.
• Application Number:
  US08/374,825
• Time in Patent Office: 1,468 Days
• Field of Search: 174/35 R, 174/35 MS, 361/816, 361/818, 361/782, 428/255, 428/256, 428/338, 428/339, 428/692, 428/928, 257/642, 257/645, 257/724
• US Class Current: 174/386
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 9/0088 comprising a plurality of shielding layers; combining different shielding material structure
• CPC Class Codes: Y10T 428/12014 having metal particles

Abstract

An electromagnetic interference suppressing body is provided for suppressing electromagnetic interference by undesirable electromagnetic waves. The body can have a conductive support element and a non-conductive soft magnetic layer provided on at least one surface. The electromagnetic interference suppressing body may be used in circuit board electronic equipment and in a hybrid integrated circuit element having an active element and a passive element mounted on a circuit board.

Claims

1. A hybrid integrated circuit element having a circuit board, an active element and a passive element mounted on the circuit board, which is characterized in that said active element, said passive element, and said circuit board are covered together with and sealed by an insulating layer, a non-conductive soft magnetic layer comprising soft magnetic powder and organic binder, and overlying an outer surface of said insulating layer.

2. A hybrid integrated circuit element claimed in claim 1, wherein said non-conductive soft magnetic layer comprises a first and a second non-conductive soft magnetic layer portions and a conductive layer interposed therebetween, said conductive layer comprising conductive powder and organic binder.

3. A hybrid integrated circuit element claimed in claim 1, wherein said soft magnetic powder comprises soft magnetic particles each having a flat or needle-like shape, said powder being dispersed in said organic binder.