Monolithic saw duplexer

• US 5,864,260 A
• Filed: 12/09/1996
• Issued: 01/26/1999
• Est. Priority Date: 05/10/1996
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Albert A.
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): Summons, Barbara
• Application Number:
  US08/761,861
• Time in Patent Office: 778 Days
• Field of Search: 333/133, 333/193-196, 310/313 R, 310/313 B, 310/313 C, 310/313 D
• US Class Current: 333/133
• CPC Class Codes: H03H 9/0576 including surface acoustic wave [SAW] devices
• CPC Class Codes: H03H 9/72 Networks using surface acoustic waves
• CPC Class Codes: H03H 9/725 Duplexers

Abstract

A monolithic SAW (surface acoustic wave) duplexer is disclosed. A transmitting bonding pad, a transmitting resonator, a microstrip line, an input/output bonding pad, a band pass filter, a receiving resonator, a receiving bonding pad, a ground bonding pad and a ground pattern are formed upon a single piezo-electric substrate through a single process.

Claims

1. A monolithic SAW duplexer comprising:

a piezo-electric substrate;

transmitting and receiving resonators formed by SAW devices upon said piezo-electric substrate;

a microstrip line for allowing pass-through of signals of a frequency band of a transmitting filter so as to output the signals to an antenna; and

a transmission signal removing filter formed by a SAW device for allowing pass-through of signals of a receiving band to remove transmission signals of a receiving band to remove transmission signals before outputting the signals to said receiving resonator,

wherein a ground pattern is disposed between said transmitting resonator and said receiving resonator, and a sound absorbing means is installed upon said ground pattern.

2. The monolithic SAW duplexer as claimed in claim 1, wherein said sound absorbing means is a polymeric synthetic resin.

3. The monolithic SAW duplexer as claimed in claim 2, wherein said polymeric synthetic resin has a thickness of 20-30 μ

m.

4. The monolithic SAW duplexer as claimed in claim 2, wherein said polymeric synthetic resin is spread within a range not intruding regions of reflector arrays and an active region of said transmitting resonator and said receiving resonator.

5. A monolithic SAW duplexer comprising:

a transmitting bonding pad section including a plurality of transmitting bonding pads;

a transmitting resonator section including a plurality of transmitting resonators formed by SAW devices and having different frequency characteristics;

a microstrip line section including a plurality of microstrips connected to the plurality of transmitting resonators and having different frequency characteristics;

an input/output bonding pad connected to the plurality of said microstrip lines, for transferring their signals to an antenna ANT and for outputting signals of said antenna ANT;

a band pass filter formed by a SAW device, for receiving output signals of said input/output bonding pad to allow only signals of a reception frequency band to be passed;

a receiving resonator section including a plurality of receiving resonators for receiving output signals of said band pass filter to output only signals corresponding to relevant frequency characteristics; and

a receiving bonding pad section including a plurality of receiving bonding pads respectively connected to the plurality of said receiving resonators of said receiving resonator section, for outputting the signals to an amplifier of a receiving section, wherein the above components are formed upon a single piezo-electric substrate.