Electrostatic chuck
First Claim
1. An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising:
- an electrostatic paddle, including a bottom sapphire plate adjacent the holder, a sapphire frame adjacent the bottom sapphire plate, wherein the sapphire frame defines a plurality of slots, and a top sapphire plate adjacent the frame; and
a plurality of conductors, wherein each of the plurality of conductors rests in one of the slots, and wherein a brazing joins the top and bottom sapphire plates to the adjacent surfaces of the plurality of conductors, wherein the brazing pulls the top and bottom sapphire plates tightly against the sapphire frame for electrical isolation.
0 Assignments
0 Petitions
Accused Products
Abstract
An electrostatic chuck is provided having a plurality of small electrostatic structures for holding an electrically conductive workpiece forming a plate of a capacitor. Each electrostatic structure includes a first thermally conductive single-crystal dielectric sheet, and a first electrode in sheet form sandwiched between the first dielectric sheet and a second dielectric surface. The workpiece, typically a conductive or semiconductive wafer, is juxtaposed to the first dielectric sheet of each electrostatic structure and forms a second electrode. The second dielectric sheet, if thick, is used as a thermally conducting base plate which can be attached to a low pressure reactor. If the second dielectric is a thin sheet, then it is mounted to a thermally conductive metal base plate through which heat can be controllably conducted. The resultant electrostatic structure may optionally be brazed to the metal base plate if the thermal expansion characteristics of the two elements are sufficiently matched. The first thermally conductive dielectric sheet is preferably formed of sapphire (Al2 O3), which is sufficiently thermally conductive to allow for rapid heat transfer between the base plate and the workpiece. The first electrodes of different electrostatic structures are held at different electrical potentials (typically of several thousand volts difference) and a charge is maintained by this potential difference between selected electrostatic structures.
-
Citations
14 Claims
-
1. An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising:
-
an electrostatic paddle, including a bottom sapphire plate adjacent the holder, a sapphire frame adjacent the bottom sapphire plate, wherein the sapphire frame defines a plurality of slots, and a top sapphire plate adjacent the frame; and a plurality of conductors, wherein each of the plurality of conductors rests in one of the slots, and wherein a brazing joins the top and bottom sapphire plates to the adjacent surfaces of the plurality of conductors, wherein the brazing pulls the top and bottom sapphire plates tightly against the sapphire frame for electrical isolation. - View Dependent Claims (2, 3, 4, 5)
-
-
6. An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising:
-
an electrostatic paddle, attached to the holder, including a bottom sapphire plate with a top surface and a bottom surface, a sapphire frame with a top surface and a bottom surface, and a top sapphire plate with a top surface and a bottom surface, wherein the bottom surface of the bottom sapphire plate is adjacent the holder, and the bottom surface of the sapphire frame is adjacent the top surface of the bottom sapphire plate, and the bottom surface of the top sapphire plate is adjacent the top surface of the sapphire frame; and a plurality of conductors, wherein each of the plurality of conductors resides in the sapphire frame, and the conductors, the top sapphire plate, and the bottom sapphire plate are brazed together. - View Dependent Claims (7, 8, 9, 10)
-
-
11. An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising:
-
an electrostatic paddle, including a plurality of sapphire plates, including a bottom surface adjacent the holder; and a plurality of conductors, adjacent the plurality of sapphire plates; and wherein the plurality of conductors and the plurality of sapphire plates are brazed together, such that the plurality of conductors are sandwiched between the sapphire plates, and wherein alumina, grown by chemical vapor deposition, joins the adjacent contacting surfaces of the plurality of sapphire plates. - View Dependent Claims (12, 13, 14)
-
Specification