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Mounting for a semiconductor integrated circuit device

  • US 5,867,368 A
  • Filed: 09/09/1997
  • Issued: 02/02/1999
  • Est. Priority Date: 09/09/1997
  • Status: Expired due to Term
First Claim
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1. A mounting for a semiconductor integrated circuit device comprising:

  • an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;

    a semiconductor integrated circuit device having a first surface, wherein the first surface of the integrated circuit device has a plurality of conductive pads thereon and a light sensitive cell; and

    a transparent aperture cover juxtaposed to the second surface of the substrate, said aperture cover over the aperture;

    wherein the first surface of the integrated circuit device faces and is affixed to the first surface of the substrate, the light sensitive cell is aligned with the aperture, the aperture cover transmits light to the light sensitive cell through the aperture, and the conductive pads of the integrated circuit device are electrically connected to the conductive metallization on the first surface of the substrate;

    a first adhesive material affixing the aperture cover to the second surface of the substrate; and

    wherein the aperture cover has a peripheral side surface, and the first adhesive material contacts at least a portion of the peripheral side surface.

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