Mounting for a semiconductor integrated circuit device

• US 5,867,368 A
• Filed: 09/09/1997
• Issued: 02/02/1999
• Est. Priority Date: 09/09/1997
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): Feild, Lynn D.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/926,495
• Time in Patent Office: 511 Days
• Field of Search: 361/760, 361/783, 361/820, 257/431-434, 257/459, 257/466, 257/680, 257/681, 257/684, 174/52.1-52.6, 438/116, 438/136, 348/374, 348/375, 396/542
• US Class Current: 361/783
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A mounting for a semiconductor integrated circuit device, such as a charge coupled device ("CCD") or an erasable programmable read only memory device ("EPROM"), includes an insulating substrate having an aperture between its first and second surfaces. A first surface of the integrated circuit device is placed adjacent to and facing the first surface of the substrate. Light sensitive circuitry on the first surface of the integrated circuit device is aligned with the aperture. Solder bumps on the periphery of the first surface of the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A aperture cover transparent to light is affixed to the second surface of the substrate and extends over the aperture, so that light may be transmitted through the aperture cover and aperture to the light sensitive circuitry on the first surface of the integrated circuit device. The substrate may be a printed circuit board.

Claims

1. A mounting for a semiconductor integrated circuit device comprising:

an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;

a semiconductor integrated circuit device having a first surface, wherein the first surface of the integrated circuit device has a plurality of conductive pads thereon and a light sensitive cell; and

a transparent aperture cover juxtaposed to the second surface of the substrate, said aperture cover over the aperture;

wherein the first surface of the integrated circuit device faces and is affixed to the first surface of the substrate, the light sensitive cell is aligned with the aperture, the aperture cover transmits light to the light sensitive cell through the aperture, and the conductive pads of the integrated circuit device are electrically connected to the conductive metallization on the first surface of the substrate;

a first adhesive material affixing the aperture cover to the second surface of the substrate; and

wherein the aperture cover has a peripheral side surface, and the first adhesive material contacts at least a portion of the peripheral side surface.

2. The mounting of claim 1, wherein a portion of the peripheral side surface of the aperture cover has a diagonal orientation relative to a first surface of the aperture cover, and the first adhesive material contacts the portion of the side surface having the diagonal orientation.

3. The mounting of claim 2, wherein a first portion of the peripheral side surface of the aperture cover has a diagonal orientation relative to the first surface of the aperture cover, and a second portion of the peripheral side surface of the aperture cover has a perpendicular orientation relative to the first surface of the aperture cover.

4. The mounting of claim 1, wherein the peripheral side surface of the aperture cover includes an indentation, and the first adhesive material contacts the indentation.

5. The mounting of claim 1, wherein the peripheral side surface of the aperture cover includes an outward protrusion, and the first adhesive material contacts the protrusion.

6. The mounting of claim 1, wherein the peripheral side surface of the aperture cover includes a means for enhancing a connection between the aperture cover and the first adhesive material.

7. The mounting of claim 6, wherein the first adhesive material covers the entire peripheral side surface of the aperture cover.

8. The mounting of claim 1, wherein the first adhesive material covers the entire peripheral side surface of the aperture cover.

9. The mounting of claim 1, wherein said aperture is lined with an epoxy resin material.

10. The mounting of claim 1, wherein said aperture has a perimeter formed by a first portion of said substrate, and further including a means for preventing fragments of said first portion of said substrate from depositing on the first surface of the aperture cover and the first surface of the integrated circuit device.

11. A mounting for a semiconductor integrated circuit device comprising:

an insulating substrate having a first surface, an opposite second surface, and an aperture through the substrate between the first and second surfaces, said first surface including conductive metallization;

a semiconductor integrated circuit device having a first surface, wherein the first surface of the integrated circuit device has a plurality of conductive pads thereon and a light sensitive cell; and

a transparent aperture cover juxtaposed to the second surface of the substrate, said aperture cover over the aperture;

wherein the first surface of the integrated circuit device faces and is affixed to the first surface of the substrate, the light sensitive cell is aligned with the aperture, the aperture cover transmits light to the light sensitive cell through the aperture, and the conductive pads of the integrated circuit device are electrically connected to the conductive metallization on the first surface of the substrate;

wherein the conductive pads are at a peripheral portion of the first surface of the integrated circuit device, a metallic solder bump is on each of the conductive pads, and each solder bump is electrically connected to a corresponding conductive metallization on the first surface of the substrate;

an adhesive underfill material between the first surface of the integrated circuit device and the first surface of the substrate;

a second adhesive material affixing the aperture cover to the second surface of the substrate;

wherein the aperture cover has a peripheral side surface, and the second adhesive material contacts at least a portion of the peripheral side surface; and

wherein a portion of the peripheral side surface of the aperture cover has a diagonal orientation relative to a first surface of the aperture cover, and the second adhesive material contacts the portion of the side surface having the diagonal orientation.

12. The mounting of claim 11, wherein the second adhesive material covers the entire peripheral side surface of the aperture cover.

13. The mounting of claim 11, wherein said aperture is lined with an epoxy resin material.

14. The mounting of claim 11, wherein said aperture has a perimeter formed by a first portion of said substrate, and further including a means for preventing fragments of said first portion of said substrate from depositing on the first surface of the aperture cover and the first surface of the integrated circuit device.

15. The mounting of claim 11, wherein a first portion of the peripheral side surface of the aperture cover has a diagonal orientation relative to the first surface of the aperture cover, and a second portion of the peripheral side surface of the aperture cover has a perpendicular orientation relative to the first surface of the aperture cover.

16. The mounting of claim 15, wherein the second adhesive material covers the entire peripheral side surface of the aperture cover.