×

Metalization structure and manufacturing method thereof

  • US 5,868,949 A
  • Filed: 11/14/1995
  • Issued: 02/09/1999
  • Est. Priority Date: 11/14/1994
  • Status: Expired due to Fees
First Claim
Patent Images

1. A metalization structure comprising a conductor layer and a insulative film containing a polyimide and, further, a conductor layer of a conductor material on the surface of the insulative film,said polyimide being obtained by polymerizing:

  • a tetracarboxylic acid dianhydride represented by the following general formula (15);

    ##STR47## where R1 represents at least one tetravalent organic group selected from the following structural formula (2);

    ##STR48## and a diamine compound represented by the following general formula (16);

    
    
    space="preserve" listing-type="equation">H.sub.2 N--R.sup.2 --NH.sub.2 (

         16)where R2 is at least one bivalent organic group selected from the following structural formulae (3);

    ##STR49##

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×