Brush for scrubbing semiconductor wafers
First Claim
1. A tool for an apparatus which cleans semiconductor wafers comprising a brush formed as a single piece of porous, flexible, elastic material, and having a substrate portion with first and second major surfaces and having a lip for securing the brush to the apparatus, the lip extending around and projecting from the first major surface and a plurality of projections of a pre-defined shape extending from the second major surface, and said first major surface adapted to abut a portion of said apparatus when mounted thereon.
4 Assignments
0 Petitions
Accused Products
Abstract
A tool for cleaning semiconductor wafers includes a cleaning head with a flat face bounded by an edge. A tubular drive shaft is connected to the cleaning head and provides a conduit through which a cleaning fluid can flow. An opening into the shaft is provided in the flat face which also has a plurality of channels to distribute the cleaning fluid across the flat face. A brush is formed as a single piece of porous, elastic material with a substrate portion that has a first major surface abutting the cleaning head face. A lip of the brush extends from the substrate portion around the edge of the flat face to removably secure the brush to the cleaning head. The brush has a plurality of cylindrical nubs on the second major surface forming projections for scrubbing surfaces of semiconductor wafers.
30 Citations
19 Claims
- 1. A tool for an apparatus which cleans semiconductor wafers comprising a brush formed as a single piece of porous, flexible, elastic material, and having a substrate portion with first and second major surfaces and having a lip for securing the brush to the apparatus, the lip extending around and projecting from the first major surface and a plurality of projections of a pre-defined shape extending from the second major surface, and said first major surface adapted to abut a portion of said apparatus when mounted thereon.
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10. A tool for an apparatus which cleans semiconductor wafers comprising:
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a cleaning head having a flat face bounded by an edge; a brush formed as a single piece of porous, flexible, elastic material, having a substrate portion with a first major surface abutting the face of the cleaning head and having a lip extending from the substrate portion and around the edge to attach the brush to the cleaning head, the brush including a plurality of projections extending from a second major surface for scrubbing the semiconductor wafers. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. An apparatus for cleaning semiconductor wafers, said apparatus comprising;
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a first cleaning disk coupled to a shaft for rotational movement and having a first flat face bounded by an edge; a second cleaning disk coupled to the shaft for rotational movement, and having a second flat face bounded by an edge and facing the first flat face; first and second brushes each attached to a different one of the first and second cleaning disks, wherein each of the first and second brushes being formed as a single piece of porous, flexible, elastic material having a substrate portion with a first major surface abutting the face of a cleaning disk and having a lip extending from the substrate portion and around the edge to attach the brush to the cleaning disk, each of the first and second brushes further including a plurality of projections of a predefined shape extending from a second major surface for scrubbing the semiconductor wafers. - View Dependent Claims (18, 19)
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Specification