Attachment apparatus and method for an implantable medical device employing ultrasonic energy

• US 5,871,515 A
• Filed: 08/27/1998
• Issued: 02/16/1999
• Est. Priority Date: 08/01/1997
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Kelley, James F., Haeg, Daniel C., Wiklund, Craig L.
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): EVANISKO, GEORGE ROBERT
• Application Number:
  US09/140,973
• Time in Patent Office: 173 Days
• Field of Search: 29/515, 29/592.1, 607/36-38
• US Class Current: 607/36
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: Y10T 29/49925 Inward deformation of aperture or hollow body wall

Abstract

A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature formed on or in the tab that is designed to accommodate the flow of the thermoplastic material during the application of ultrasonic energy in the region of the tab channel and to cooperate with the solidified mass of thermoplastic material. During application of the ultrasonic energy, the thermoplastic material melts and flows into the remaining space of the tab channel and encapsulate the attachment tab including the retention feature. Upon termination of the ultrasonic energy, the thermoplastic housing material cools and solidifies and forms a continuous mass that encapsulates the surface of the attachment tab and the retention feature.

Claims

1. A method of attaching a hermetically sealed enclosure of an implantable medical device to a pre-formed thermoplastic material header module, comprising the steps of:

forming a retention structure extending away from an enclosure attachment surface of the hermetically sealed enclosure into proximity with a portion of the pre-formed header module when the enclosure attachment surface and a module attachment surface of the pre-formed header module are aligned in respect of one another, the retention structure comprising an upstanding attachment tab extending from a tab base to a tab free end and having an attachment feature disposed therein or thereon;

attaching the tab base to the hermetically sealed enclosure at a predetermined location, the upstanding attachment tab extending in a predetermined direction away from the enclosure surface, the retention feature being disposed at a location away from the enclosure attachment surface;

providing a tab channel in the header module, the tab channel being sized and oriented to receive the upstanding attachment tab therein when the enclosure attachment surface and the module attachment surface are aligned in respect of and brought into contact with one another;

aligning and firmly seating the module attachment surface against the enclosure attachment surface, the upstanding attachment tab being received in the tab channel of the header module, the attachment feature being disposed within the channel;

applying ultrasonic energy to a region of the pre-formed header module propinquant to the upstanding attachment tab and the tab channel, at least portions of the thermoplastic material of the header module in the region melting and flowing into intimate engagement with the upstanding tab and the attachment feature in response to the application of the ultrasonic energy thereto; and

cooling the melted thermoplastic material until it solidifies around the upstanding attachment tab and the attachment feature.

2. The method of claim 1, further comprising the step of applying adhesive material between the enclosure attachment surface and the module attachment surface prior to the alignment and seating step.

3. The method of claim 1, wherein the retention structure forming step further comprises the step of forming a tab bore through the upstanding attachment tab to constitute the attachment feature and the ultrasonic energy application step further comprises applying ultrasonic energy to the region having an amplitude and for a duration of time sufficient to melt at least portions of the thermoplastic material in the region, the thermoplastic material flowing through the tab bore and extending therethrough, the thermoplastic material solidifying after the ultrasonic energy is no longer applied to the region.

4. The method of claim 1, where the retention structure forming step further comprises the step of forming a tab hook in the free end of the upstanding attachment tabs, the tab hook forming the attachment feature and the ultrasonic energy application step further comprises applying ultrasonic energy to the region having an amplitude and for a duration of time sufficient to melt at least portions of thermoplastic material in the region, the thermoplastic material flowing around the tab hook, the thermoplastic material solidifying after the ultrasonic energy is no longer applied to the region.

5. The method of claim 1, wherein:

the retention structure forming step further comprises the step of forming tab pleats in the upstanding attachment tab, the tab pleats forming the attachment feature; and

the ultrasonic energy application step further comprises applying ultrasonic energy to the region having an amplitude and for a duration of time sufficient to melt at least portions of the thermoplastic material in the region, the thermoplastic material flowing around the tab pleats when the thermoplastic material solidifies after removal of the ultrasonic energy.

6. The method of claim 1, wherein the retention structure forming step further comprises the step of forming irregularly laterally extending means for retention extending laterally in respect of the upstanding attachment tab and the ultrasonic energy application step further comprises applying ultrasonic energy to the region having an amplitude and for a duration of time sufficient to melt at least portions of the thermoplastic material in the region, the thermoplastic material flowing around the laterally extending retention means, the thermoplastic material solidifying after the ultrasonic energy is no longer applied to the region.

7. The method of claim 1, further comprising the steps of fabricating a pre-formed spacer of a compressible body compatible material shaped to conform to the enclosure attachment surface and the header module attachment surface and fitting the pre-formed spacer between the enclosure attachment surface and the header module attachment surface to provide a seal therebetween.

8. The method of claim 1, wherein the tab forming step further comprises forming a pair of upstanding attachment tabs extending in parallel in respect of one another from respective ends of the tab base, each tab having a retention feature disposed therein;

the tab base attaching step further comprises attaching the tab base to a predetermined location of the enclosure attachment surface, each upstanding attachment tab extending in a predetermined direction away from the enclosure surface;

the tab channel providing step further comprises providing a pair of tab channels spaced apart from one another, disposed in the header module, and sized to receive the upstanding attachment tabs when the enclosure attachment surface and the module attachment surface engage and are aligned respecting one another; and

the aligning and firmly seating step further comprises aligning the module attachment surface with the enclosure attachment surface, the upstanding attachment tabs being received in the tab channels.

9. The method of claim 8, further comprising the steps of fabricating a pre-formed spacer comprising a compressible body compatible material, the spacer being shaped to be disposed between and to conform to the enclosure attachment surface and the module attachment surface and fitting the pre-formed spacer between the enclosure attachment surface and the header module attachment surface to provide a seal therebetween.

10. The method of claim 8, wherein the retention structure forming step further comprises the step of disposing a tab bore through at least portions of each of the upstanding attachment tabs to form the respective retention features.

11. The method of claim 8, wherein the retention structure forming step further comprises the step of forming a tab hook in the free end of each of the upstanding attachment tabs to form the respective attachment features.

12. The method of claim 8, wherein the retention structure forming step further comprises the step of forming tab pleats in each of the upstanding attachment tabs to form the respective attachment features.

13. The method of claim 8, wherein the retention structure forming step further comprises the step of forming irregularly laterally extending means for retention in each of the upstanding attachment tabs.

14. The method of claim 8, further comprising the step of:

applying adhesive material between the enclosure attachment surface and the module attachment surface prior to the aligning and firmly seating step.