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Lead-free, high tin ternary solder alloy of tin, silver, and indium

  • US 5,874,043 A
  • Filed: 12/17/1996
  • Issued: 02/23/1999
  • Est. Priority Date: 06/12/1996
  • Status: Expired due to Term
First Claim
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1. A lead free ternary solder alloy for use in microelectronic application consisting essentially of from 70.5 to 73.5 weight percent tin, from 6.5 to 7.5% by weight silver, balance indium.

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