Method and apparatus for uniformly spin-coating a photoresist material
First Claim
1. A spin-coating apparatus for uniformly applying a layer of photoresist material to a wafer, comprising:
- a first rotating device for rotating a rotating connector about a first axis; and
a second rotating device, connected to an outer portion of said rotating connector, for rotating the wafer about a second axis while said rotating connector rotates about said first axis, said first and second axes being substantially parallel to each other and spaced apart by a designated distance, which said designated distance is variable.
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Accused Products
Abstract
A method and apparatus for uniformly spin-coating photoresist material on wafers before the wafers are subjected to a photoetching process. The spin-coating apparatus comprises a first rotating device for rotating a rotating connector about a first axis and a second rotating device located on the outer portion of the rotating connector. The second rotating device rotates a wafer about a second axis while the rotating connector rotates around the first axis. The first and second axes are parallel to each other but are spaced apart by a designated distance. The designated distance can be adjusted and a plurality of second rotating devices may be connected to outer portions of the rotating connector.
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Citations
20 Claims
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1. A spin-coating apparatus for uniformly applying a layer of photoresist material to a wafer, comprising:
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a first rotating device for rotating a rotating connector about a first axis; and a second rotating device, connected to an outer portion of said rotating connector, for rotating the wafer about a second axis while said rotating connector rotates about said first axis, said first and second axes being substantially parallel to each other and spaced apart by a designated distance, which said designated distance is variable. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A spin-coating apparatus for uniformly applying a layer of photoresist material to a wafer, comprising:
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a first rotating spinner for rotating a disk about a first axis at a predetermined velocity; a second rotating spinner, connected to an outer portion of said disk, for rotating the wafer about a second axis substantially coincident with a center axis of said wafer, said spinner rotating at a second predetermined velocity while said disk rotates about said first axis, said first and second axes being substantially parallel and spaced apart by a designated distance; a vacuum chuck rotatably connected to said second spinner for holding said wafer by a vacuum suction force; and an adjusting member for varying said designated distance, said adjusting member comprising a screw wherein one end of said screw is connected to said rotating disk and said screw mechanically communicates with said second spinner via operation of threads of said screw.
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16. A spin-coating method for uniformly applying a layer of photoresist material to a wafer, comprising:
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rotating a rotating connector about a first axis with a first rotating device at a first predetermined velocity; and rotating the wafer about a second axis with a second rotating device located at an outer portion of said rotating connector, said second rotating device rotating at a second predetermined velocity while rotating said connector about said first axis, said second axis being substantially coincident with a center axis of said wafer, and said first and second axes being substantially parallel and spaced apart by a designated distance, which said designated distance is variable. - View Dependent Claims (17, 18, 19)
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20. A spin-coating apparatus for uniformly applying a layer of photoresist material to a wafer, comprising:
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a first rotating device for rotating a rotating connector about a first axis; and a second rotating device, connected to an outer portion of said rotating connector, for rotating the wafer about a second axis while said rotating connector rotates about said first axis, wherein said first and second axes are substantially parallel to each other and spaced apart by a designated distance, and wherein said second axis is substantially coincident with a center axis of said wafer, whereby the wafer is substantially parallel to the rotating connector.
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Specification