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Method and apparatus for uniformly spin-coating a photoresist material

  • US 5,874,128 A
  • Filed: 06/30/1997
  • Issued: 02/23/1999
  • Est. Priority Date: 01/22/1997
  • Status: Expired due to Fees
First Claim
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1. A spin-coating apparatus for uniformly applying a layer of photoresist material to a wafer, comprising:

  • a first rotating device for rotating a rotating connector about a first axis; and

    a second rotating device, connected to an outer portion of said rotating connector, for rotating the wafer about a second axis while said rotating connector rotates about said first axis, said first and second axes being substantially parallel to each other and spaced apart by a designated distance, which said designated distance is variable.

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