×

Thermal stress relieving substrate

  • US 5,874,776 A
  • Filed: 04/21/1997
  • Issued: 02/23/1999
  • Est. Priority Date: 04/21/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A chip carrier comprising:

  • a substrate with a coefficient of thermal expansion compensation plate having means to provide a variable in-plane stiffness to accommodate thermal expansion mismatch between elements on the substrate to either side of the compensation plate.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×