Organic electroluminescent device hermetic encapsulation package and method of fabrication

• US 5,874,804 A
• Filed: 03/03/1997
• Issued: 02/23/1999
• Est. Priority Date: 03/03/1997
• Status: Expired due to Term

• Current Assignee: Universal Display Corporation
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Rogers, Stephen P.
• Primary Examiner(s): Patel, Nimeshkumar D.
• Application Number:
  US08/807,974
• Time in Patent Office: 722 Days
• Field of Search: 313/506, 313/512, 313/504
• US Class Current: 313/512
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

An organic electroluminescent device encapsulating package including a substrate, an organic electroluminescent device carried by the substrate, an inorganic perimetric seal carried by the substrate, the perimetric seal encircling the organic electroluminescent device within a perimeter thereof, and an inorganic cover overlying the organic electroluminescent device and sealingly coupled to the substrate in a spaced apart relationship by the inorganic perimetric seal.

Claims

1. An organic electroluminescent device encapsulating package comprising:

a substrate;

an organic electroluminescent device carried by the substrate;

an inorganic perimetric seal carried by the substrate, the perimetric seal encircling the organic electroluminescent device within a perimeter thereof; and

an inorganic cover overlying the organic electroluminescent device and sealingly coupled to the substrate in a spaced apart relationship by the inorganic perimetric seal, and the inorganic perimetric seal including a first layer of low melting metal patterned on the substrate and a second layer of low melting metal patterned on the cover, the first layer and the second layer joined by reflow of the low melting metal.

2. An organic electroluminescent device encapsulation package as claimed in claim 1 wherein the perimetric seal further includes a first adhesion layer coupling the first layer to the substrate and a second adhesion layer coupling the second layer to the cover.

3. An organic electroluminescent device encapsulation package as claimed in claim 1 wherein the cover and the substrate include contacts electrically coupled to the organic electroluminescent device.

4. An organic electroluminescent device encapsulation package as claimed in claim 1 wherein the organic electroluminescent device includes a first electrical contact layer formed on the substrate and an organic layer overlying the first electrical contact layer and carried by the substrate, the perimetric seal overlying the first electrical contact layer and carried by the substrate.

5. An organic electroluminescent device encapsulation package as claimed in claim 4 wherein the organic electroluminescent device further includes a second electrical contact layer overlying the organic layer and the first electrical contact layer.

6. An organic electroluminescent device encapsulation package as claimed in claim 5 wherein the perimetric seal has a thickness substantially equal to the thickness of the organic layer such that the first electrical contact layer and the second electrical contact layer are spaced apart sufficient to accommodate the organic layer while maintaining contact therewith.

7. An organic electroluminescent device encapsulating package comprising:

a substrate;

a first electrical contact layer formed on the substrate;

an organic layer overlying the first electrical contact layer and carried by the substrate;

a perimetric seal overlying the first electrical contact layer and carried by the substrate, the perimetric seal enclosing the organic layer within a perimeter thereof;

a second electrical contact layer overlying the organic layer and the first electrical contact layer, the perimetric seal has a thickness substantially equal to the thickness of the organic layer such that the first electrical contact layer and the second electrical contact layer are spaced apart sufficient to accommodate the organic layer while maintaining contact therewith; and

an inorganic cover overlying the second electrical contact layer, the organic layer and the first electrical contact layer, the inorganic cover is carried by the substrate and supported in a spaced apart relationship therefrom and sealed thereto by the perimetric seal, and the perimetric seal including a first layer of a first metal patterned on the substrate overlying the first electrical contact layer and a second layer of a second metal patterned on the cover, the first layer and the second layer being joined by pressure to form the perimetric seal.

8. An organic electroluminescent device encapsulating package as claimed in claim 7 wherein the first metal includes one of indium and gold and the second metal includes another of indium and gold.

9. An organic electroluminescent device encapsulation package comprising

a substrate;

a first electrical contact layer formed on the substrate;

an organic layer overlying the first electrical contact layer and carried by the substrate;

a perimetric seal overlying the first electrical contact layer and carried by the substrate, the perimetric seal enclosing the organic layer within a perimeter thereof;

a second electrical contact layer overlying the organic layer and the first electrical contact layer, the perimetric seal has a thickness substantially equal to the thickness of the organic layer such that the first electrical contact layer and the second electrical contact layer are spaced apart sufficient to accommodate the organic layer while maintaining contact therewith; and

an inorganic cover overlying the second electrical contact layer, the organic layer and the first electrical contact layer, the inorganic cover is carried by the substrate and supported in a spaced apart relationship therefrom and sealed thereto by the perimetric seal, wherein the perimetric seal includes a first layer of low melting metal patterned on the substrate overlying the first electrical contact layer and a second layer of low melting metal patterned on the cover, the first layer and the second layer being joined by reflow of the low melting metal.

10. An organic electroluminescent device encapsulation package as claimed in claim 9 wherein the perimetric seal further includes a first adhesion layer coupling the first layer to the substrate and a second adhesion layer coupling the second layer to the cover.

11. An organic electroluminescent device encapsulation package as claimed in claim 10 wherein the adhesion layer includes titanium, and the perimetric seal includes indium.