High reliability I/O stacked fets

• US 5,874,836 A
• Filed: 09/06/1996
• Issued: 02/23/1999
• Est. Priority Date: 09/06/1996
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Nowak, Edward J., Tong, Minh H.
• Primary Examiner(s): Tokar, Michael
• Assistant Examiner(s): Chang, Daniel D.
• Application Number:
  US08/709,061
• Time in Patent Office: 900 Days
• Field of Search: 326/83, 326/86, 326/26, 326/27, 326/121
• US Class Current: 326/83
• CPC Class Codes: H03K 17/102 in field-effect transistor switches

Abstract

The effects on device reliability of across chip length variation (ACLV), gate ion channeling and dislocation are reduced or eliminated in input/output (I/O) stacked field effect transistors (FETs). A pair of stacked PFETs and a pair of stacked NFETs are connected to an I/O pad. The PFET and the NFET adjacent to the I/O pad are designed with a channel length greater than the PFET and NFET, respectively, further removed from the I/O pad. This has the effect of making the PFET and NFET adjacent to the I/O pad insensitive to leakage-induced effects. Alternatively, a Schottky or P/N junction diode may be connected between the node between the gate of the PFET adjacent to the I/O pad and the two PFETs, and another Schottky or P/N junction diode may be connected between the node between the two NFETs and the gate of the NFET adjacent to the I/O pad. The Schottky diodes act to clamp the nodes between the pair of PFETs and the pair of NFETs near the respective gate voltages. A similar clamping action can be accomplished using an NFET in place of the Schottky or P/N junction diode for the pair of PFETs and a PFET in place of the Schottky or P/N junction diode for the pair of NFETs.

Claims

1. A complementary metal oxide semiconductor (CMOS) mixed voltage input/output (I/O) driver circuit comprising:

a stack of at least first and second serially connected CMOS devices of the same type, said first CMOS device being connected to an I/O pad and said second CMOS device being connected to a voltage source, additional CMOS devices, if any, serially connected between the first and second CMOS devices, each of said serially connected CMOS device having a separate input gate signal;

a mixed voltage driver which drives an output voltage higher than a chip operating voltage;

a drain of one of said serially connected CMOS devices connected to a higher of voltage than a drain of another of said serially connected CMOS devices; and

voltage control means for preventing a node between the serially connected first and second devices from charging to a voltage greater than a predetermined voltage.

2. The CMOS mixed voltage I/O driver circuit recited in claim 1 wherein said stack includes third and fourth serially connected CMOS devices of a type opposite the type of said first and second CMOS devices, said third CMOS device being connected to said I/O pad and said fourth CMOS device being connected to a second voltage source opposite to said first mentioned voltage source, further comprising second voltage control means for preventing a second node between the third and fourth serially connected devices from charging to a voltage greater than a second predetermined voltage.

3. The CMOS mixed voltage I/O driver circuit recited in claim 2 wherein said first and second voltage control means comprises an increased channel length of the first and third CMOS devices connected to said I/O pad as compared to a channel length of the second and fourth CMOS devices further removed from the I/O pad.

5. The CMOS mixed voltage I/O driver circuit recited in claim 2 wherein said first mentioned voltage control means comprises a fifth CMOS device of said second type connected between said first mentioned node between the serially connected first and second CMOS devices and a gate of said first CMOS device, a gate of said fifth CMOS device being connected to a gate of said second CMOS device, thereby clamping said first mentioned node to a voltage at the gate of said first CMOS device, and wherein said second voltage control means comprises a sixth CMOS device of said first mentioned type connected between said second node between the serially connected third and fourth CMOS devices and a gate of said third CMOS device, a gate of said sixth CMOS device being connected to a gate of said fourth CMOS device, thereby clamping said second node to a voltage at the gate of said third CMOS device.

4. A complementary metal oxide semiconductor (CMOS) mixed voltage input/output (I/O) driver circuit comprising:

a stack of at least first and second serially connected CMOS devices of the same type, said first CMOS device being connected to an I/O pad and said second CMOS device being connected to a voltage source;

voltage control means for preventing a node between the serially connected first and second devices from charging to a voltage greater than a predetermined voltage;

said stack further including at least third and fourth serially connected CMOS devices of a type opposite the type of said first and second CMOS devices, said third CMOS device being connected to said I/O pad and said fourth CMOS device being connected to a second voltage source opposite to said first mentioned voltage source, further comprising second voltage control means for preventing a second node between the third and fourth serially connected devices from charging to a voltage greater than a second predetermined voltage; and

wherein said first mentioned voltage control means comprises a first clamping diode connected between said first mentioned node between the serially connected first and second CMOS devices and a gate of said first CMOS device, thereby clamping said first mentioned node to a voltage at the gate of said first CMOS device, and wherein said second voltage control means comprises a second clamping diode connected between said second node between the serially connected third and fourth CMOS devices and a gate of said third CMOS device, thereby clamping said second node to a voltage at the gate of said third CMOS device.

6. High reliability input/output (I/O) stacked field effect transistors (FETs) wherein the effects of across chip length variation (ACLV), gate ion channeling and dislocation are reduced or eliminated, comprising:

first and second stacked PFETs;

first and second stacked NFETs; and

an I/O pad, said first PFET and said first NFET being connected to the I/O pad, said first PFET and said first NFET being designed with a channel length greater than the second PFET and the second NFET, respectively, thereby making the first PFET and the first NFET insensitive to leakage-induced effects.

7. High reliability input/output (I/O) stacked field effect transtors (FETs) wherein the effects of across chip length variation (ACLV), gate ion channeling and dislocation are reduced or eliminated, comprising:

first and second stacked PFETs;

first and second stacked NFETs;

an I/O pad, said first PFET and said first NFET being connected to the I/O pad; and

first and second diodes, said first diode connected between a node between said first and second PFETs and a gate of the first PFET, and said second diode connected between a node between said first and second NFETs and a gate of the first NFET, said first and second diodes acting to clamp the nodes between the first and second PFETs and the first and second NFETs near the respective gate voltages of the first PFET and of the first NFET, thereby making the first PFET and the first NFET insensitive to leakage-induced effects.

8. High reliability input/output (I/O) stacked field effect transtors (FETS) as in claim 7 wherein said first and second diodes are Schottky diodes.

9. High reliability input/output (I/O) stacked field effect transtors (FETS) as in claim 7 wherein said first and second diodes are P/N junction diodes.

10. High reliability input/output (I/O) stacked field effect transistors (FETs) wherein the effects of across chip length variation (ACLV), gate ion channeling and dislocation are reduced or eliminated, comprising:

first and second stacked PFETs;

first and second stacked NFETs;

an I/O pad, said first PFET and said first NFET being connected to the I/O pad; and

a third NFET connected between a node between said first and second PFETs and a gate of the first PFET, a gate of the third NFET being connected to a gate of the second PFET; and

a third PFET connected between a node between said first and second NFETs and a gate of the first PFET, a gate of the third PFET being connected to a gate of the second NFET, said third NFET and said third PFET acting to clamp the nodes between the first and second PFETs and the first and second NFETs near the respective gate voltages of the first PFET and of the first NFET, thereby making the first PFET and the first NFET insensitive to leakage-induced effects.