Wafer cleaning apparatus

• US 5,875,507 A
• Filed: 07/15/1996
• Issued: 03/02/1999
• Est. Priority Date: 07/15/1996
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Oliver Design Inc. (Seagate Technology Holdings Plc)
• Inventors: Jones, Oliver David, Stephens, Donald Edgar, Miller, Hugo John III
• Primary Examiner(s): TILL, TERRENCE R
• Application Number:
  US08/683,654
• Time in Patent Office: 960 Days
• Field of Search: 15/77, 15/88.2, 15/88.3, 15/102, 15/308, 15/DIG. 14
• US Class Current: 15/102
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is orientated vertically between the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.

Claims

1. A wafer cleaning apparatus comprising:

a first brush;

a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between;

a pair of rollers located vertically below said region defined by said first brush and said second brush;

a first brush positioner which moves said first brush from a first position to a second position, wherein said first brush positioner comprises a first plate, said first brush mounted to a first shaft mounted to said first plates; and

a second brush positioner which moves said second brush from a first position to a second position, a distance between said first brush and said second brush being greater when said first brush is in said first position and said second brush is in said first position than when said first brush is in said second position and said second brush is in said second position, wherein said second brush positioner comprises a second plate, said second brush mounted to a second shaft mounted to said second plate, said first plate being coupled to said second plate by a pivot.

2. The wafer cleaning apparatus of claim 1 further comprising an air cylinder having a piston, said piston coupled to said first plate and adapted to move said first plate and by said pivot adapted to move said second plate.

3. The wafer cleaning apparatus of claim 2 further comprising a pressure transducer, said piston being coupled to said first plate by said pressure transducer.

4. The wafer cleaning apparatus of claim 3 wherein said first brush and said second brush contact a wafer when in said second position, a perpendicular component of force exerted on said wafer by said first brush and said second brush being controlled by measuring and controlling the force exerted by said piston on said pressure transducer.

5. A wafer cleaning apparatus comprising:

a first brush;

a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between;

a pair of rollers located vertically below said region defined by said first brush and said second brush;

a housing having a vertical slot therein; and

a door which opens and closes said vertical slot.

6. The wafer cleaning apparatus of claim 5 wherein each roller of said pair of rollers has a V-groove therein.

7. The wafer cleaning apparatus of claim 5 further comprising:

a first shaft having said first brush mounted thereon; and

a second shaft having said second brush mounted thereon.

8. The wafer cleaning apparatus of claim 7 further comprising:

a first rotary union mounted to said first shaft; and

a second rotary union mounted to said second shaft.

9. The wafer cleaning apparatus of claim 7 further comprising:

a first motor connected to said first shaft capable of rotating said first shaft and thereby rotating said first brush; and

a second motor connected to said second shaft capable of rotating said second shaft and thereby rotating said second brush.

10. The wafer cleaning apparatus of claim 5 wherein said first brush and said second brush are made from the group consisting of polyvinyl alcohol (PVA), nylon, mohair and polishing pad material mounted on a mandrel.

11. The wafer cleaning apparatus of claim 5 further comprising a motor coupled to said pair of rollers capable of rotating said pair of rollers.

12. A wafer cleaning apparatus comprising:

a first brush;

a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between;

a pair of rollers located vertically below said region defined by said first brush and said second brush;

a first shaft having a first end with said first brush mounted thereon; and

a second shaft having a first end with said second brush mounted thereon, wherein said first shaft has a cavity formed therein and has perforations in the region where said first brush is mounted and wherein said second shaft has a cavity formed therein and has perforations in the region where said second brush is mounted.

13. A wafer cleaning apparatus comprising:

a first brush,

a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between;

a pair of rollers located vertically below said region defined by said first brush and said second brush;

a first set of spray nozzles capable of spraying a first liquid towards said first brush;

a second set of spray nozzles capable of spraying said first liquid towards said second brush;

a third set of spray nozzles capable of spraying a second liquid towards said first brush; and

a fourth set of spray nozzles capable of spraying said second liquid towards said second brush.

14. The wafer cleaning apparatus of claim 13 wherein said first liquid is a surfactant.

15. A wafer cleaning apparatus comprising:

a first brush;

a second brush located horizontally from said first brush;

a first set of spray nozzles, wherein said first set of spray nozzles comprises a first nozzle capable of spraying a first liquid towards said first brush and a second nozzle capable of spraying a second liquid towards said first brush; and

a second set of spray nozzles, wherein said second set of spray nozzles comprises a first nozzle capable of spraying said first liquid towards said second brush and a second nozzle capable of spraying said second liquid towards said second brush, said second liquid being different than said first liquid.