Method of manufacturing an electronic component

• US 5,875,541 A
• Filed: 05/01/1996
• Issued: 03/02/1999
• Est. Priority Date: 10/12/1992
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Itou, Makoto, Nakajima, Yoshinobu, Kumeji, Yasushi, Nishimura, Seiichi
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US08/595,988
• Time in Patent Office: 1,035 Days
• Field of Search: 29/608, 29/827, 29/602.1, 333/181, 333/185, 333/175, 333/177
• US Class Current: 29/602.1
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/2847 Sheets; Strips H01F27/2866 takes precedence
• CPC Class Codes: H03H 3/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: Y10S 425/033 Magnet
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49076 From comminuted material
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

An electronic component comprises an inductive element which includes a pair of zigzag parts, a pair of first terminals connected to one side of the zigzag parts, a connection part connected to the other side of the zigzag parts, an electrode disposed in the middle of the connection part, a second terminal provided on the extensional position of the electrode, and an exterior mold having a gap in the middle in order to expose the fronts of electrode and second terminal.

Claims

1. A method of manufacturing an electronic component comprising the steps of:

a) blanking a metal sheet to form a continuous electrically conductive frame, an inductive element including a pair of zigzag parts, each having two sides, a pair of first terminals, each connected between one side of a respective zigzag part of the pair of zigzag parts and said frame, a connection part connecting the other sides of each of the pair of zigzag parts, an electrode coupled to said connection part, and a second terminal;

b) forming an external casing having an opening and an outer surface so that said inductive element is within said casing, said electrode and said second terminal protruding into said opening, and

c) cutting and separating the pair of first terminals from the electrically conductive frame to form said electronic component.

2. A method of manufacturing an electronic component according to claim 1, further comprising bending said pair of first terminals along the outer surface of the casing, after cutting and separating the pair of first terminals.

3. A method of manufacturing an electronic component according to claim 1, further comprising the steps of:

e) positioning a capacitive element within the opening; and

f) connecting said capacitive element to the second terminal and to the electrode.

4. A method of manufacturing an electronic component according to claim 1, wherein in step a) said second terminal is coupled to said frame and in step c) said second terminal is cut and separated from said frame.