Process for device fabrication in which the plasma etch is controlled by monitoring optical emission

• US 5,877,032 A
• Filed: 08/27/1996
• Issued: 03/02/1999
• Est. Priority Date: 10/12/1995
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: McNevin, Susan Clardy, Guinn, Keith V.
• Primary Examiner(s): JONES, DEBORAH D
• Application Number:
  US08/703,756
• Time in Patent Office: 917 Days
• Field of Search: 216/60, 438/8, 438/9, 438/16
• US Class Current: 438/9
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: G01N 21/73 using plasma burners or torches
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32963 End-point detection
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

The present invention is directed to a process for device fabrication in which a pattern is transferred from a photoresist mask into an underlying layer of silicon dioxide. A plasma containing a fluorocarbon gas is used to etch the pattern into the underlying silicon dioxide layer. The plasma is monitored using optical emission spectroscopy to effect control of the etch process. The optical emission is monitored at select wavelengths. To control the process based on an observation of photoresist etch rate, two wavelengths are monitored. One is associated with a species that is produced by the interaction between the photoresist and the plasma, and one is associated with a species related to the plasma intensity. The ratio of the optical intensity at these two wavelengths is determined in real time during processing, and the ratio is associated with acceptable process conditions by referring to a predetermined calibration curve that associates a particular ratio with a particular photoresist etch rate for a given set of process conditions. If the ratio is observed to not be within a certain range of ratios determined to indicate acceptable process conditions, the plasma conditions are either changed to bring the ratio back within the desired range, or the process is stopped until the problem is corrected. To control the process based on an observation of contact hole etch rate, a wavelength associated with one species in the plasma is monitored at two different times during the etch. A ratio of the measured intensity at these two different times is obtained. Calibration information is then used to determine if the ratio indicates that the process is proceeding acceptably. If the ratio is not within the acceptable range, remedial action is taken.

Claims

1. A process for device fabrication comprising:

placing a substrate in a reaction chamber which is adapted for plasma generation, the substrate having a layer of silicon dioxide on at least a portion of one surface thereof, and a photoresist mask over the silicon dioxide layer wherein at least a portion of the silicon dioxide layer is exposed through the mask;

introducing a fluorocarbon-containing gas in the reaction chamber;

generating a plasma in the reaction chamber to remove the silicon dioxide exposed through the mask from the substrate;

monitoring the optical emission of the plasma and measuring the luminous intensity associated with at least one species in the plasma;

calculating a value from the measured luminous intensity;

comparing the calculated value to a range of calibration values, wherein the range of calibration values is associated with either an etch rate of the photoresist mask or an etch rate of the silicon dioxide layer; and

controlling the process based upon the comparison.

2. The process of claim 1 wherein the process is controlled by adjusting a process parameter if the calculated value is not within the range of calibration values.

3. The process of claim 2 wherein the luminous intensity of a first species and the luminous intensity of a second species in the plasma are monitored as a function of time, wherein the luminous intensity of the first species is associated with the interaction between the photoresist and the plasma and the luminous intensity of the second species is associated with plasma intensity, wherein the calculated value is the ratio of the luminous intensity associated with the first species to the luminous intensity associated with the second species.

4. The process of claim 3 wherein the first species is C₂ and the second species is selected from the groups consisting of SiF, Si, and F.

5. The process of claim 4 wherein the first species is C₂ monitored at 515 nm and the second species is SiF monitored at 440 nm.

6. The process of claim 3 wherein the range of calibration ratios associated with the etch rate are determined from a calibration curve that associates a particular ratio with a particular photoresist etch rate for a given set of process conditions.

7. The process of claim 6 further comprising adjusting the process conditions if the calculated ratio is not within the range of calibration ratios associated with the etch rate of the particular photoresist.

8. The process of claim 2 wherein the luminous intensity of the species in the plasma is monitored over time and wherein the calculated value is the ratio of the luminous intensity associated with the species at a time t₁ to the luminous intensity associated with the species at a time t₂, wherein both times t₁ and t₂ occur during the etch process.

9. The process of claim 8 wherein the etch rate is a contact hole etch rate.

10. The process of claim 9 wherein the species is selected from the groups consisting of C₂ and SiF.

11. The process of claim 10 wherein the range of calibration ratios is determined from a calibration curve that associates a particular ratio with a particular contact hole etch rate for a given set of process conditions.

12. The process of claim 11 further comprising adjusting the process conditions if the calculated ratio is not within the range of calibration ratios determined from the calibration curve that associates the particular ratio with the particular etch rate for the given set of process conditions.