Active matrix substrate, for use in a liquid crystal display and method for producing the same

• US 5,877,832 A
• Filed: 03/12/1997
• Issued: 03/02/1999
• Est. Priority Date: 03/15/1996
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Shimada, Yoshinori
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): CHOWDHURY, TARIFUR RASHID
• Application Number:
  US08/815,702
• Time in Patent Office: 720 Days
• Field of Search: 349/42, 349/43, 349/138, 349/113, 349/143
• US Class Current: 349/138
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer

Abstract

An active matrix substrate includes a switching device; a scanning line electrically connected to the switching device; a signal line electrically connected to the switching device and arranged so as to cross the scanning line; an interlayer insulation layer formed over the switching device, the scanning line and the signal line, the interlayer insulation layer having a contact hole; and a picture element electrode provided on the interlayer insulation layer and electrically connected to the switching device through the contact hole. The picture element electrode has a recessed portion in the contact hole, and a buried portion formed of an insulation material is provided in the recessed portion so that a top surface of the buried portion and a top surface of the picture element electrode are at an identical level.

Claims

1. A transparent active matrix substrate, comprising:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

a transparent interlayer insulation layer formed over the switching device, the scanning line and the signal line, the transparent interlayer insulation layer having a contact hole; and

a transparent picture element electrode provided on the transparent interlayer insulation layer and electrically connected to the switching device through the contact hole,

wherein the transparent picture element electrode has a recessed portion in the contact hole and a non-recessed portion over the interlayer insulation layer, and

a buried portion formed of a transparent insulation material is provided in the recessed portion over the transparent picture element electrode so that a top surface of the buried portion and a top surface of the non-recessed portion of the transparent picture element electrode are at an identical level.

2. An active matrix substrate according to claim 1, further including an insulation layer provided on the picture element electrode, the insulation layer Including the buried portion.

3. An active matrix substrate according to claim 2, wherein the buried portion is formed of an organic thin film.

4. An active matrix substrate according to claim 3, wherein said buried portion is an optically discolored transparent buried portion.

5. An active matrix substrate according to claim 3, wherein said buried portion is a chemically discolored transparent buried portion.

6. An active matrix substrate according to claim 3, wherein the buried portion is formed of an anisotropically etched organic thin film applied to a plate having the picture element electrode thereon.

7. An active matrix substrate according to claim 2, wherein the buried portion is formed of a film which is obtained as a result of applying a photosensitive organic thin film on the picture element electrode so as to cover the recessed portion and performing exposure to light and alkaline development of the photosensitive organic thin film.

8. An active matrix substrate according to claim 1, wherein the buried portion is formed of an organic thin film.

9. An active matrix substrate according to claim 8, wherein said buried portion is an optically discolored transparent buried portion.

10. An active matrix substrate according to claim 8, wherein said buried portion is a chemically discolored transparent buried portion.

11. An active matrix substrate according to claim 8, wherein the buried portion is formed of an anisotropically etched organic thin filn applied to a plate having the picture element electrode thereon.

12. An active matrix substrate according to claim 1, wherein the buried portion is formed of a film which is obtained as a result of applying a photosensitive organic thin film on the picture element electrode so as to cover the recessed portion and performing exposure to light and alkaline development of the photosensitive organic thin film.

13. A liquid crystal display device, comprising:

an active matrix substrate according to claim 1;

a liquid crystal layer; and

a counter substrate located to face the active matrix substrate with the liquid crystal layer interposed therebetween, whereby light transmitted through the buried portion contributes to conducting a display.

14. An active matrix substrate, comprising:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

an interlayer insulation layer formed over the switching device, the scanning line and the signal line, the interlayer insulation layer having a contact hole; and

a picture element electrode provided on the interlayer insulation layer and electrically connected to the switching device through the contact hole,

wherein the picture clement electrode has a recessed portion in the contact hole, and

a buried portion formed of an insulation material is provided in the recessed portion so that a top surface of the buried portion and a top surface of the picture element electrode are at an identical level, wherein

a plurality of convex areas are provided on the picture element electrode and a reflection electrode is formed over the plurality of convex areas, and wherein the plurality of convex areas are each formed of an insulation material, the picture element electrode is electrically connected to the reflection electrode between the plurality of convex areas, and a surface of the reflection electrode has convex areas and concave areas.

15. An active matrix substrate according to claim 14, wherein the plurality of convex areas and the buried portion are formed of an identical material.

16. An active matrix substrate, comprising:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

an interlayer insulation layer formed over the switching device, the scanning line and the signal line, the interlayer insulation layer having a contact hole; and

a picture element electrode provided on the interlayer insulation layer and electrically connected to the switching device through the contact hole,

wherein the picture element electrode has a recessed portion in the contact hole, and

a buried portion formed of an insulation material is provided in the recessed portion so that a top surface of the buried portion and a top surface of the picture element electrode are at an identical level, said buried portion having a convex portion.

17. An active matrix substrate, comprising:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

an interlayer insulation layer formed over the switching device, the scanning line and the signal line, the interlayer insulation layer having a contact hole;

a picture element electrode provided on the interlayer insulation layer and electrically connected to the switching device through the contact hole; and

an insulation layer provided on the picture element electrode;

wherein the picture element electrode has a recessed portion in the contact hole,

said insulation layer including a buried portion provided in the recessed portion so that a top surface of the buried portion and a top surface of the picture element electrode are at an identical level; and

wherein said insulation layer including the buried portion covers the picture element electrode, and a surface of the insulation layer is subjected to rubbing treatment so as to act as an alignment layer.

18. A method for producing an active matrix substrate including:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

a transparent interlayer insulation layer formed over the switching device, the scanning line and the signal line;

a transparent picture element electrode provided on the transparent interlayer insulation layer; and

a contact hole formed in the transparent interlayer insulation layer,

wherein the transparent picture element electrode has a recessed portion in the contact hole and a non-recessed portion over the interlayer insulation layer, and the switching device is electrically connected to the transparent picture element electrode, the method comprising the step of;

filling the recessed portion with a transparent insulation material to form a buried portion in the recessed portion over the transparent picture element electrode so that a top surface of the buried portion and a top surface of the non-recessed portion of the transparent picture element electrode are at an identical level.

19. A method for producing an active matrix substrate including:

a switching device;

a scanning line electrically connected to the switching device;

a signal line electrically connected to the switching device and arranged so as to cross the scanning line;

an interlayer insulation layer formed over the switching device, the scanning line and the signal line;

a picture element electrode provided on the interlayer insulation layer; and

a contact hole formed in the interlayer insulation layer,

wherein the picture element electrode has a recessed portion in the contact hole, and the switching device is electrically connected to the picture element electrode, the method comprising the steps of;

forming a buried portion in the recessed portion of the picture element electrode, thereby filling the recessed portion, the buried portion being formed of an insulation material;

forming a plurality of convex areas on the picture element electrode; and

forming a reflection electrode so as to cover the plurality of convex areas, thereby forming convex areas and concave areas at a surface of the reflection electrode.

20. A method according to claim 19, further comprising the step of applying a photosensitive resin to the picture element electrode and performing exposure to light and development of the photosensitive resin, thereby forming the buried portion and the plurality of convex areas simultaneously.