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Method for making an electronic module and electronic module obtained according to the method

  • US 5,879,502 A
  • Filed: 11/12/1996
  • Issued: 03/09/1999
  • Est. Priority Date: 05/27/1994
  • Status: Expired due to Term
First Claim
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1. A method of making an electronic module comprising at least one electronic circuit encapsulated in a body of synthetic material, the body having two essentially flat and parallel main faces,wherein at least one electronic circuit is disposed on a first sheet in a first material pre-impregnated with a first impregnating substance, a second sheet in a second material pre-impregnated with a second impregnating substance being disposed above the first sheet and the electronic circuit or circuits;

  • the sheets being made of a heat-deformable material are then subjected to a pressure according to a predetermined value accompanied by a heating to a predetermined temperature, leading to the deformation of the sheets and to the liquefaction of the impregnating substances, the encapsulation of the electronic circuit or circuits between the two compressed sheets being obtained at the time of rigidification of the two sheets at the time of polymerization of the impregnating substances.

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