Molded products for high voltage apparatus comprising brominated epoxy resins

• US 5,880,179 A
• Filed: 12/23/1996
• Issued: 03/09/1999
• Est. Priority Date: 03/04/1994
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation), Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Itabashi, Yoshifumi, Fujioka, Hirofumi, Kikuchi, Takumi, Ito, Hiromi, Kanegae, Hirozoh, Nogami, Fumio
• Primary Examiner(s): Wilson, Donald R.
• Application Number:
  US08/774,068
• Time in Patent Office: 806 Days
• Field of Search: 523/435, 523/443, 523/466, 523/433, 528/102, 528/112, 528/97, 528/96, 310/43, 336/205
• US Class Current: 523/433
• CPC Class Codes: C08G 59/226 Mixtures of di-epoxy compounds
• CPC Class Codes: C08G 59/245 aromatic
• CPC Class Codes: C08G 59/26 heterocyclic
• CPC Class Codes: C08G 59/30 containing atoms other than carbon, hydrogen, oxygen and nitrogen
• CPC Class Codes: C08G 59/42 Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01B 3/40 epoxy resins

Abstract

"Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 μm and in which the content of particles having a diameter of not more than 5 μm is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

Claims

1. A molded product for an apparatus used for high voltage which is produced from an epoxy resin composition comprising:

an epoxy resin (A) comprising from 50 to 100% by weight of an epoxy resin (A-2) represented by the general formula (II);

##STR32## wherein each of R¹ is independently hydrogen atom or methyl group, each of x is independently an integer of 1 to 4, and the average of y is 0 to 4; and

at least one resin selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F type epoxy resin, and a biphenyl epoxy resin;

an acid anhydride (B);

a curing accelerator (C);

at least one coupling agent (D) selected from the group consisting of epoxysilane coupling agents, phenylaminosilane coupling agents, mercaptosilane coupling agents and titanate coupling agents; and

a filler (E) comprising at least one of silica fillers or alumina fillers,

wherein the ratio of the number of acid anhydride groups of said acid anhydride (B) to the number of epoxy groups of said epoxy resin (A) is 0.5 to 1.5, the amount of said curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of said epoxy resin (A), the amount of said coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of said filler (E), and the content of said filler (E) is 35 to 95% by weight of the resin composition.

2. In a molded transformer, the improvement comprising producing a molded transformer having excellent crack resistance and high reliability by using an epoxy resin composition for molding comprising:

an epoxy resin (A) comprising from 50 to 100% by weight of an epoxy resin (A-2) represented by the general formula (II);

##STR33## wherein each of R¹ is independently hydrogen atom or methyl group, each of x is independently an integer of 1 to 4, and the average of y is 0 to 4; and

at least one resin selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F type epoxy resin, and a biphenyl epoxy resin;

an acid anhydride (B);

a curing accelerator (C);

at least one coupling agent (D) selected from the group consisting of epoxysilane coupling agents, phenylaminosilane coupling agents, mercaptosilane coupling agents and titanate coupling agents; and

a filler (E) comprising at least one of silica fillers or alumina fillers,

wherein the ratio of the number of acid anhydride groups of said acid anhydride (B) to the number of epoxy groups of said epoxy resin (A) is 0.5 to 1.5, the amount of said curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of said epoxy resin (A), the amount of said coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of said filler (E), and the content of said filler (E) is 35 to 95% by weight of the resin composition.

3. In a molded motor, the improvement comprising producing a molded motor having excellent crack resistance and high reliability by using an epoxy resin composition for molding comprising:

an epoxy resin (A) comprising from 50 to 100% by weight of an epoxy resin (A-2) represented by the general formula (II);

##STR34## wherein each of R¹ is independently hydrogen atom or methyl group, each of x is independently an integer of 1 to 4, and the average of y is 0 to 4; and

at least one resin selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F type epoxy resin, and a biphenyl epoxy resin;

an acid anhydride (B);

a curing accelerator (C);

at least one coupling agent (D) selected from the group consisting of epoxysilane coupling agents, phenylaminosilane coupling agents, mercaptosilane coupling agents and titanate coupling agents; and

a filler (E) comprising at least one of silica fillers or alumina fillers,

wherein the ratio of the number of acid anhydride groups of said acid anhydride (B) to the number of epoxy groups of said epoxy resin (A) is 0.5 to 1.5, the amount of said curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of said epoxy resin (A), the amount of said coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of said filler (E), and the content of said filler (E) is 35 to 95% by weight of the resin composition.

4. A bushing or a spacer which is produced from an epoxy resin composition comprising:

an epoxy resin (A) comprising from 50 to 100% by weight of an epoxy resin (A-2) represented by the general formula (II);

##STR35## wherein each of R¹ is independently hydrogen atom or methyl group, each of x is independently an integer of 1 to 4, and the average of y is 0 to 4; and

at least one resin selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F type epoxy resin, and a biphenyl epoxy resin;

an acid anhydride (B);

a curing accelerator (C);

at least one coupling agent (D) selected from the group consisting of epoxysilane coupling agents, phenylaminosilane coupling agents, mercaptosilane coupling agents and titanate coupling agents; and

a filler (E) comprising at least one of silica fillers or alumina fillers,

wherein the ratio of the number of acid anhydride groups of said acid anhydride (B) to the number of epoxy groups of said epoxy resin (A) is 0.5 to 1.5, the amount of said curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of said epoxy resin (A), the amount of said coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of said filler (E), and the content of said filler (E) is 35 to 95% by weight of the resin composition.