Heat exchanger system for cooling a hinged computing device

• US 5,880,929 A
• Filed: 12/01/1997
• Issued: 03/09/1999
• Est. Priority Date: 12/01/1997
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Bhatia, Rakesh
• Primary Examiner(s): FEILD, LYNN DIANA
• Application Number:
  US08/980,704
• Time in Patent Office: 463 Days
• Field of Search: 361/687-699, 361/700, 361/704, 361/707, 361/717-719, 165/104.33, 165/86, 174/15.2, 364/708.1
• US Class Current: 361/679.27
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/203 Heat conductive hinge

Abstract

A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positioned in the display housing. The heat exchanger system includes a heat pipe located in the base and thermally coupled to both an electronic component and the hinge to allow heat transfer from the electronic component to the hinge. A flat plate heat pipe located in the display housing is mechanically and thermally coupled to the hinge to allow heat transfer from the hinge to the flat plate heat pipe for dissipation through the display housing.

Claims

1. A heat exchanger system for transferring heat generated by an electronic component located in a first part of a computing device to a second part thereof for dissipation into the surrounding environment, said first part of the computing device being coupled to said second part by a thermally conductive hinge having a first hinge section and a second hinge section, said heat exchanger system comprising:

a heat pipe located in the first part of the computing device and thermally coupled between the electronic component and the first hinge section; and

a flat plate heat pipe located in the second part of the computing device, said flat plate heat pipe being thermally coupled to the second hinge section.

2. The heat exchanger system according to claim 1, wherein the heat pipe exhibits a round cross-section.

3. The heat exchanger system according to claim 1, wherein the flat plate heat pipe is formed from aluminum.

4. The heat exchanger system according to claim 1, wherein the thermally conductive hinge comprises two thermally conductive hinges, each connected to an end of the heat pipe.

5. The heat exchanger system according to claim 4, wherein the electronic component is thermally coupled to the heat pipe at a position between the ends of the heat pipe.

6. A hinged computing device, comprising:

a first housing member having a first edge and containing an electronic component;

a second housing having a second edge;

a thermally conductive hinge including a first hinge section coupled to the first edge and a second hinge section coupled to the second edge allowing pivotal motion between the first housing and the second housing;

a heat pipe located in the first housing and thermally coupled to both the electronic component and said first hinge section to allow heat transfer between the electronic component and said first hinge section; and

a flat plate heat pipe located in the second housing, said flat plat heat pipe being mechanically and thermally coupled to the second hinge section to allow heat transfer between the second hinge section and the flat plate heat pipe.

7. The hinged computing device according to claim 6, wherein the first housing is a base housing and the second housing is a display housing.

8. The hinged computing device according to claim 7, wherein a display screen is housed in the display housing, said flat plate heat pipe being positioned within the display housing between the screen and an outer cover of the display housing.

9. The hinged computing device according to claim 8, wherein the display screen is a liquid crystal display screen.

10. The hinged computing device according to claim 7, wherein the computing device is a notebook computer.

11. The hinged computing device according to claim 6, wherein the heat pipe exhibits a round cross-section.

12. The hinged computing device according to claim 6, wherein the flat plate heat pipe is formed from aluminum.

13. The hinged computing device according to claim 6, wherein the thermally conductive hinge comprises two thermally conductive hinges, each connected to an end of the heat pipe.

14. The hinged computing device according to claim 13, wherein the electronic component is thermally coupled to the heat pipe at a position between the ends of the heat pipe.

15. The hinged computing device according to claim 6, wherein the electronic component is a central processing unit.