Data carrier having separately provided integrated circuit and induction coil

• US 5,880,934 A
• Filed: 10/29/1997
• Issued: 03/09/1999
• Est. Priority Date: 05/11/1994
• Status: Expired due to Term

• Current Assignee: Giesecke + Devrient Mobile Security GmBH (Giesecke & Devrient GmbH)
• Original Assignee: Giesecke & Devrient GmbH
• Inventors: Haghiri-Tehrani, Yahya
• Primary Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US08/960,500
• Time in Patent Office: 496 Days
• Field of Search: 235/487, 235/488, 235/492, 235/449, 235/451, 235/441, 235/491, 257/678, 257/679, 361/737, 361/761, 361/782, 361/813, 361/811, 361/821, 361/764, 361/807, 361/809, 361/820, 340/825.44, 455/269, 156/267, 156/252, 156/300, 156/297
• US Class Current: 361/737
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07781 the coil being fabricated in a winding process
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G11C 5/142 Contactless power supplies, e.g. RF, induction, or IR
• CPC Class Codes: G11C 7/00 Arrangements for writing information into, or reading information out from, a digital store G11C5/00 takes precedence; auxiliary circuits for stores using semiconductor devices G11C11/4063, G11C11/413
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

The invention relates to a data carrier comprising a card body and an integrated circuit connected electroconductively via contact elements with at least one coil serving the purpose of power supply and/or data exchange of the integrated circuit with external devices. The invention is characterized in that the integrated circuit and the contact elements form a separate module known in the art and the coil is disposed on a card body constructed from one or more layers in known fashion. The coil is preferably formed as a flat coil.

Claims

1. A data carrier having a body comprising:

at least one layer;

an integrated circuit; and

at least one coil having leads integrally formed with the coil and forming part of the body;

characterized in that;

a module bearing the integrated circuit and at least two contact elements is electrically connected via said contact elements with the leads of the coil;

the module and the layer of the body are provided separately;

the module further comprises outer contact surfaces;

the body has a two-step recess for receiving the module, the two-step recess having a first step and a second step which is deeper than the first step; and

the coil is disposed on the first step.

2. The data carrier of claim 1, characterized in that the at least one layer of the body comprises a cover layer.

3. The data carrier of claim 1, characterized in that the at least one layer of the body comprises an insulating layer and in that the coil is formed as a flat coil which is glued to the insulating layer of the body as a finished wire-wrapped coil.

4. The data carrier of claim 1, characterized in that the coil extends essentially over an entire surface of the body.

5. The data carrier of claim 1, characterized in that the leads of the coil and the contact elements of the module are disposed opposite each other within a plane of the body.

6. The data carrier of claim 5, characterized in that the leads of the coil are glued electroconductively to the contact elements of the module.

7. The data carrier of claim 1, characterized in that the at least one layer of the body comprises an inner layer of the body.

8. The data carrier of claim 1, characterized in that the at least one layer of the body comprises an injection molded body part.

9. The data carrier of claim 1, characterized in that the at least one layer of the body comprises an insulating layer of the body and in that the coil is printed on the insulating layer of the body as an electroconductive layer.

10. The data carrier of claim 1, characterized in that the coil is stamped in a layer of the at least one layer of the body by a hot stamping method.

11. The data carrier of claim 1, characterized in that the coil is punched out of a metal foil and disposed on a layer of the at least one layer of the body.

12. The data carrier of claim 1, characterized in that the coil is punched out of an electroconductively coated plastic film and disposed on a layer of the at least one layer of the body.

13. The data carrier of claim 1, characterized in that said body consists of one layer.